Abstract: The invention provides a microspeaker diaphragm edge member having superior heat resistance, cold resistance, moisture resistance, formability, and high internal loss property, a diaphragm employing such a microspeaker diaphragm edge member, a microspeaker employing such a diaphragm, and an electronic device incorporating such a microspeaker. To constitute such an edge member, an intermediate layer featuring a high damping effect has a constraining layer of polyetheretherketone (PEEK) disposed on one face thereof and a constraining layer of either polyetheretherketone (PEEK) or polyetherimide (PEI) disposed on the other face thereof.

Abstract: The photosensitive resin composition is composed of a poly((meth)acrylic acid)-based water-soluble photo-sensitive resin (A) having an acid value of 150 mgKOH/g or more on a solid basis; the resin (A) being formed of a ((meth)acrylic acid)-based polymer in which a compound represented by formula (1): (wherein R1 represents H or Me; and R2 represents a liner or branched C2-C10 alkylene group) has been added to portions of the carboxylic groups, a photopolymerization initiator (B); and water (C).

Abstract: A photosensitive resin which exhibits excellent storage stability, affinity, miscibility, or solubility with respect to a variety of compounds, and high sensitivity can be solidified even under hydrous conditions as well as exhibiting high cure-related sensitivity and high flexibility and being uniformly solidified even under highly hydrous conditions, a photosensitive resin composition containing the resin, and a novel compound. The photosensitive resin is a saponified poly(vinyl acetate)-based photosensitive resin having a structural unit represented by formula (1): (wherein R1 represents H or Me; R2 represents a linear or branched C2-C10 alkylene group; n is an integer of 1 to 3; X represents m is an integer of 0 to 6; and Y represents an aromatic ring or a single bond).

Abstract: A photosensitive resin which exhibits excellent storage stability, affinity, miscibility, or solubility with respect to a variety of compounds, and high sensitivity can be solidified even under hydrous conditions as well as exhibiting high cure-related sensitivity and high flexibility and being uniformly solidified even under highly hydrous conditions, a photosensitive resin composition containing the resin, and a novel compound. The photosensitive resin is a saponified poly(vinyl acetate)-based photosensitive resin having a structural unit represented by formula (1): (wherein R1 represents H or Me; R2 represents a linear or branched C2-C10 alkylene group; n is an integer of 1 to 3; X represents m is an integer of 0 to 6; and Y represents an aromatic ring or a single bond).

Abstract: The present invention provides a cross-linkable polymer compound which can be developed with an aqueous developer and exhibits excellent patterning properties; a photosensitive composition containing the same; and a pattern formation method employing the composition.