Patents by Inventor Seiichi Hayakawa
Seiichi Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230282561Abstract: The provided power semiconductor module is configured to reduce the wiring inductance and save space on the substrate by establishing a multi-parallel connection between multiple power semiconductor chips. It consists of a first and second insulated substrates with a plurality of semiconductor switching elements positioned on one and facing the other. There are also first and second spacer conductors positioned between the plurality of semiconductor switching elements and the second insulated substrate. Inter-spacer-conductor wiring parts are connected with the plurality of second spacer conductors.Type: ApplicationFiled: April 19, 2021Publication date: September 7, 2023Applicant: Hitachi Power Semiconductor Device, Ltd.Inventors: Toru Masuda, Seiichi Hayakawa, Yuji Takayanagi
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Patent number: 11539361Abstract: To provide a semiconductor device signal transmission circuit for drive-control, a method of controlling a semiconductor device signal transmission circuit for drive-control, a semiconductor device, a power conversion device, and an electric system for a railway vehicle capable of preventing malfunction due to noise while speeding up or reducing loss of a switching operation. The semiconductor device signal transmission circuit for drive-control that is connected between a semiconductor device constituting an arm in a power conversion device and a drive circuit configured to drive the semiconductor device, including: an inductor; and an impedance circuit including a switch and connected in parallel with the inductor.Type: GrantFiled: February 10, 2021Date of Patent: December 27, 2022Assignee: Hitachi Power Semiconductor Device, Ltd.Inventors: Toru Masuda, Seiichi Hayakawa, Yuji Takayanagi, Takae Shimada, Takashi Wada
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Patent number: 11496041Abstract: The invention provides a gate drive device, a gate drive method, a power semiconductor module, and an electric power conversion device capable of reducing a negative gate surge voltage. The gate drive device drives a semiconductor device constituting an arm in an electric power conversion device. Before a turn-off start of a drive arm, in a counter arm, a voltage between one main terminal of the semiconductor device and a gate terminal of the semiconductor device is charged to a voltage value that is larger, in a positive direction, than a negative voltage of a negative gate power supply and smaller than a gate threshold voltage of the semiconductor device.Type: GrantFiled: January 28, 2021Date of Patent: November 8, 2022Assignee: Hitachi Power Semiconductor Device, Ltd.Inventors: Daisuke Ikarashi, Toru Masuda, Seiichi Hayakawa, Yuji Takayanagi, Masamitsu Inaba
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Publication number: 20220302075Abstract: There is provided a power semiconductor module with multiple semiconductor chips arranged in parallel on an insulated substrate, allowing for high density mounting of semiconductor chips and highly reliable with less difference in operating characteristics from one semiconductor chip to another. The above module includes an insulated substrate; a first conductive pattern laid out on the insulated substrate; multiple power semiconductor chips arranged on the first conductive pattern; a first wiring formed to bridge and directly connecting respective gate electrodes of the power semiconductor chips; and a second wiring formed to bridge and directly connecting respective source electrodes of the power semiconductor chips, wherein the first wiring is placed alongside of the second wiring and may be angled within 30 degrees with respect to the second wiring.Type: ApplicationFiled: April 6, 2020Publication date: September 22, 2022Applicant: Hitachi Power Semiconductor Device, Ltd.Inventors: Toru Masuda, Seiichi Hayakawa, Yuji Takayanagi
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Publication number: 20210296979Abstract: The invention provides a gate drive device, a gate drive method, a power semiconductor module, and an electric power conversion device capable of reducing a negative gate surge voltage. The gate drive device drives a semiconductor device constituting an arm in an electric power conversion device. Before a turn-off start of a drive arm, in a counter arm, a voltage between one main terminal of the semiconductor device and a gate terminal of the semiconductor device is charged to a voltage value that is larger, in a positive direction, than a negative voltage of a negative gate power supply and smaller than a gate threshold voltage of the semiconductor device.Type: ApplicationFiled: January 28, 2021Publication date: September 23, 2021Inventors: Daisuke IKARASHI, Toru MASUDA, Seiichi HAYAKAWA, Yuji TAKAYANAGI, Masamitsu INABA
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Publication number: 20210288640Abstract: To provide a semiconductor device signal transmission circuit for drive-control, a method of controlling a semiconductor device signal transmission circuit for drive-control, a semiconductor device, a power conversion device, and an electric system for a railway vehicle capable of preventing malfunction due to noise while speeding up or reducing loss of a switching operation. The semiconductor device signal transmission circuit for drive-control that is connected between a semiconductor device constituting an arm in a power conversion device and a drive circuit configured to drive the semiconductor device, including: an inductor; and an impedance circuit including a switch and connected in parallel with the inductor.Type: ApplicationFiled: February 10, 2021Publication date: September 16, 2021Inventors: Toru MASUDA, Seiichi HAYAKAWA, Yuji TAKAYANAGI, Takae SHIMADA, Takashi WADA
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Publication number: 20150360648Abstract: A wiper arm including an arm main body pivotably connected to an arm head is provided in which the rotation angle of the arm main body is appropriately restricted while minimizing changes of the structure of the wiper arm from that of a wiper arm capable capable to be positioned in its locked back condition. A wiper arm 1 includes a retainer 3 capable of retaining a wiper blade, an arm head body 2 connected with the retainer 3 through a connection shaft 14 so that the retainer 3 is rotatable between an operational position and an upright position, and a rotation restricting member 30 pivotally connected through pivot shafts 16 provided on inner surfaces 12A of head arm sections 12 of the arm head body 2. The rotation restricting member 30 is pivotable around the pivot shaft 16 between a rotation restricting position and a rotation permitting position. In the rotation restriction position, the rotation restricting member 30 limits the rotation angle of the retainer 3 by contacting against the retainer 3.Type: ApplicationFiled: November 19, 2013Publication date: December 17, 2015Applicant: NIPPON WIPER BLADE CO., LTD.Inventors: Katsuhiro OUCHI, Seiichi HAYAKAWA, Yuichi SHIRAISHI
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Patent number: 8519561Abstract: A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.Type: GrantFiled: June 29, 2010Date of Patent: August 27, 2013Assignee: Hitachi, Ltd.Inventors: Katsunori Azuma, Mutsuhiro Mori, Michiaki Hiyoshi, Seiichi Hayakawa, Koji Sasaki, Isamu Yoshida
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Patent number: 8422235Abstract: The present invention provides a vehicle power module and a power converter including a power semiconductor element (328), a plurality of connecting conductors (371U, 372U, 373U) for transmitting current to the power semiconductor element (328), and a metallic base (304) upon which the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted; and the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted upon the metallic base (304) so as to form a looped current path. Desirably, the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, 373U) are arranged so as to form two or more looped current paths.Type: GrantFiled: July 30, 2009Date of Patent: April 16, 2013Assignee: Hitachi Automotive Systems, Ltd.Inventors: Katsunori Azuma, Mutsuhiro Mori, Kinya Nakatsu, Seiichi Hayakawa, Fusanori Nishikimi
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Publication number: 20110051371Abstract: The present invention provides a vehicle power module and a power converter including a power semiconductor element (328), a plurality of connecting conductors (371U, 372U, 373U) for transmitting current to the power semiconductor element (328), and a metallic base (304) upon which the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted; and the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, and 373U) are mounted upon the metallic base (304) so as to form a looped current path. Desirably, the power semiconductor element (328) and the plurality of connecting conductors (371U, 372U, 373U) are arranged so as to form two or more looped current paths.Type: ApplicationFiled: July 30, 2009Publication date: March 3, 2011Applicant: Hitachi Automotive Systems, LtdInventors: Katsunori Azuma, Mutsuhiro Mori, Kinya Nakatsu, Seiichi Hayakawa, Fusanori Nishikimi
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Publication number: 20100327654Abstract: A power module includes an upper arm circuit unit and a lower arm circuit unit each having a power semiconductor element; an insulating substrate with the units mounted on one surface thereof; a metal base bonded onto the other surface of the substrate opposite to the one surface where the units are mounted; a first connection conductor for supplying a high potential to the upper unit from outside; a second connection conductor for supplying a low potential to the lower unit from outside; an insulating sheet interposed between the conductors; and a resin case disposed on the metal base to support the conductors, the conductors are flat conductors and laminated with the sheet sandwiched therebetween; the sheet extends from one end of the laminated structure to secure the creepage distance between the conductors; and the case is furnished with a recess for containing the laminated structure.Type: ApplicationFiled: June 29, 2010Publication date: December 30, 2010Applicant: Hitachi, Ltd.Inventors: Katsunori AZUMA, Mutsuhiro Mori, Michiaki Hiyoshi, Seiichi Hayakawa, Koji Sasaki, Isamu Yoshida
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Patent number: 6665903Abstract: An arm head has a couple of hinge holes. A cover has a couple of hinge projections. The arm head and the cover are hingedly connected to each other through the hinge holes and the hinge projections. A rotation guide extends radially outwardly from each hinge hole. A protrusion protrudes radially outwardly from each hinge projection and is received in the rotation guide. A locking projection extends from the rotation guide. The locking projection is spaced from an opening movement limiting end of the rotation guide for a distance, which is substantially the same as a width of the protrusion of the hinge projection.Type: GrantFiled: April 10, 2002Date of Patent: December 23, 2003Assignees: Asmo Co., Lt.d., Nippon Wiper Blade Co., Ltd.Inventors: Kazuhide Tsukamoto, Yuji Morita, Takanari Itou, Takashi Kuboichi, Kazuhito Yokoo, Seiichi Hayakawa
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Publication number: 20020152575Abstract: An arm head has a couple of hinge holes. A cover has a couple of hinge projections. The arm head and the cover are hingedly connected to each other through the hinge holes and the hinge projections. A rotation guide extends radially outwardly from each hinge hole. A protrusion protrudes radially outwardly from each hinge projection and is received in the rotation guide. A locking projection extends from the rotation guide. The locking projection is spaced from an opening movement limiting end of the rotation guide for a distance, which is substantially the same as a width of the protrusion of the hinge projection.Type: ApplicationFiled: April 10, 2002Publication date: October 24, 2002Inventors: Kazuhide Tsukamoto, Yuji Morita, Takanari Itou, Takashi Kuboichi, Kazuhito Yokoo, Seiichi Hayakawa