Patents by Inventor Seiichi Hirawata

Seiichi Hirawata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5892174
    Abstract: A structure for accommodating an electric apparatus having contacts in an accommodating space formed by joining a welding protrusion of a first member and a joint portion of a second member by ultrasonic welding. A groove is formed between the joint portion and the accommodating space to gather and prevent welding refuse produced by the ultrasonic welding from penetrating into the accommodating structure and sticking to the contacts of the electric apparatus and to concentrate ultrasonic energy to the joint portion. An opening through which the welding refuse flows is also formed outside of the joint portion. The opening has an aperture that increases with increasing distance from the joint portion.
    Type: Grant
    Filed: November 21, 1996
    Date of Patent: April 6, 1999
    Assignee: Niles Parts Co., Ltd.
    Inventor: Seiichi Hirawata
  • Patent number: 5319331
    Abstract: An electromagnetic relay having a plate spring provided with a fixed contact, a movable contact and an L-shaped bent portion at the middle portion of the plate spring, and an armature fixed on one side of the plate spring with respect to the bent portion. The armature includes a first offset portion spaced apart from the plate spring between a first fixed portion of the plate spring and the bent portion and a blocking portion for changing the supporting arrangement of the plate spring in accordance with the deflection of the plate spring. A yoke is fixed on the other side of the plate spring with respect to the bent portion and has a second offset portion spaced apart from the plate spring between a second fixed portion of the plate spring and the bent portion.
    Type: Grant
    Filed: August 4, 1993
    Date of Patent: June 7, 1994
    Assignee: Niles Parts Co., Ltd.
    Inventors: Seiichi Hirawata, Hiroshi Hirata
  • Patent number: 4700162
    Abstract: In a contact mechanism having electrical contact pieces in a switching device integrated with a spring plate fixed at one end, a wiping movable contact piece is fixed to the other end of the spring plate and has a semispherical shape at the contact portion, and a fixed contact piece also has a semispherical shape at its contact with a movable contact piece. The level of the apex of the contact area of the movable contact piece is shifted toward the support point side of the movable contact piece from the level of the apex of the contact area of the fixed contact piece. Conversely, the level of the apex of the contact area of the fixed contact piece is shifted toward the lower base stand side from the level of the apex of the apex if the contact area of the movable contact piece. As a result, the movable contact piece can surely and easily contact and separate from the fixed contact piece, and the movement of the movable contact piece in sliding is improved.
    Type: Grant
    Filed: April 7, 1986
    Date of Patent: October 13, 1987
    Assignee: Niles Parts Co., Ltd.
    Inventors: Seiichi Hirawata, Shigeru Kobayashi