Patents by Inventor Seiichi Kurosawa

Seiichi Kurosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensing apparatus and method, and program therefor
    Patent number: 8106893
    Abstract: Human contact/non-contact is detected speedily and accurately. A measurement section measures capacitance of each of sites to which a plurality of electrodes are connected where a human body touches, a comparison section compares the capacitance with a threshold value for each contacting electrode, and a control section determines whether a human body has come in contact based on the comparison result.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: January 31, 2012
    Assignee: OMRON Corporation
    Inventors: Hiroyuki Fujita, Masahiro Kinoshita, Takeshi Horiuchi, Teppei Sumino, Seiichi Kurosawa
  • SENSING APPARATUS AND METHOD, AND PROGRAM THEREFOR
    Publication number: 20090073140
    Abstract: Human contact/non-contact is detected speedily and accurately. A measurement section measures capacitance of each of sites to which a plurality of electrodes are connected where a human body touches, a comparison section compares the capacitance with a threshold value for each contacting electrode, and a control section determines whether a human body has come in contact based on the comparison result.
    Type: Application
    Filed: September 8, 2008
    Publication date: March 19, 2009
    Applicant: OMRON CORPORATION
    Inventors: Hiroyuki Fujita, Masahiro Kinoshita, Takeshi Horiuchi, Teppei Sumino, Seiichi Kurosawa
  • Mold for injection molding and a method of operating a mold
    Patent number: 7156649
    Abstract: A fixed mold (10) has engaging pins (17) projecting towards a movable mold (20). Each engaging pin (17) includes a shaft (17A) and a large-diameter portion (17C) formed at the leading end of the shaft (17A). The large-diameter portions (17C) of the engaging pins (17) interfere with the bottom surfaces of recesses (53) of an ejector plate (50) in the process of separating the movable mold (20). Thus, the ejector plate (50) is moved forward relative to the movable mold (20) and leading ends of ejector pins (90) project from the movable mold (20).
    Type: Grant
    Filed: August 4, 2004
    Date of Patent: January 2, 2007
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Naoya Hattori, Seiichi Kurosawa, Shinsuke Tsutsui, Toshiya Muraki, Yumiko Muramoto
  • Mold for injection molding and a method of operating a mold
    Publication number: 20050031729
    Abstract: A fixed mold (10) has engaging pins (17) projecting towards a movable mold (20). Each engaging pin (17) includes a shaft (17A) and a large-diameter portion (17C) formed at the leading end of the shaft (17A). The large-diameter portions (17C) of the engaging pins (17) interfere with the bottom surfaces of recesses (53) of an ejector plate (50) in the process of separating the movable mold (20). Thus, the ejector plate (50) is moved forward relative to the movable mold (20) and leading ends of ejector pins (90) project from the movable mold (20).
    Type: Application
    Filed: August 4, 2004
    Publication date: February 10, 2005
    Applicant: Sumitomo Wiring Systems, Ltd.
    Inventors: Naoya Hattori, Seiichi Kurosawa, Shinsuke Tsutsui, Toshiya Muraki, Yumiko Muramoto
  • Manufacturing method of resin molded assembly
    Patent number: 5961910
    Abstract: A moving mold 100 consisting of slidable housing molds 110 and 110 and retainer molds 120 and 120 and a fixed mold 200 pairing with the moving mold 100 are used to mold a housing 20 and retainers 30a and 30b in resin at the same time. When the fixed mold 200 and the moving mold 100 are opened, the housing molds 110 and 110 are opened and a space is formed between the housing 20 and the retainers 30a and 30b to be fitted to each other. The retainers 30a and 30b are pressed against the housing 20 with the retainers 30a and 30b held in the retainer molds 120 and 120 from both the left and right sides, whereby the housing 20 and the retainers 30a and 30b are assembled.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: October 5, 1999
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hikaru Ito, Shinsuke Tsutsui, Yasunori Wada, Osamu Taniuchi, Seiichi Kurosawa
  • Manufacturing metal mold for assembling a resin molded assembly
    Patent number: 5814356
    Abstract: A moving mold 100 consisting of slidable housing molds 110 and 110 and retainer molds 120 and 120 and a fixed mold 200 pairing with the moving mold 100 are used to mold a housing 20 and retainers 30a and 30b in resin at the same time. When the fixed mold 200 and the moving mold 100 are opened, the housing molds 110 and 110 are opened and a space is formed between the housing 20 and the retainers 30a and 30b to be fitted to each other. The retainers 30a and 30b are pressed against the housing 20 with the retainers 30a and 30b held in the retainer molds 120 and 120 from both the left and right sides, whereby the housing 20 and the retainers 30a and 30b are assembled.
    Type: Grant
    Filed: March 7, 1996
    Date of Patent: September 29, 1998
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Hikaru Ito, Shinsuke Tsutsui, Yasunori Wada, Osamu Taniuchi, Seiichi Kurosawa
  • Thermoregulator of a block cylinder used for an offset press
    Patent number: 5074213
    Abstract: A thermoregulator of a block cylinder used for an offset press which prevents the surface temperature of a block from rising, and at the same time allows it to maintain the said temperature at the most suitable point for printing.
    Type: Grant
    Filed: November 30, 1989
    Date of Patent: December 24, 1991
    Inventor: Seiichi Kurosawa