Abstract: A resin ejection nozzle is scanned over a substrate on which an electronic part is mounted, and ejects an encapsulation resin to an encapsulation area of the substrate. The resin ejection nozzle comprises an ejection part adapted to eject the encapsulation resin, the ejection part having a longitudinal direction which is perpendicular to a direction of movement of the nozzle. An ejection hole part is adapted to cause the encapsulation resin to contact a substantially half area of a side of the electronic part which lies at right angles to the direction of movement of the nozzle. A remaining portion of the side of the electronic part is gradually contacted by the encapsulation resin after the substantially half area of the side of the electronic part is contacted by the encapsulation resin.

Abstract: To realize reduction in the size and cost of a protection circuit module for a secondary battery. A protection circuit module 1 for a secondary battery has at least a wiring board 2 having multiple battery-side external terminals 4a and multiple load-side external terminals 20a, and semiconductor components 12 and 14 mounted on the wiring board 2. On the wiring board 2, the battery-side external terminals 4a are disposed on a surface 2a, and the load-side external terminals 20a are disposed on a surface 2b on the opposite side. The semiconductor components 12 and 14 have multiple external connection terminals 12a and 14a arranged on a single plane surface, and are mounted face-down in a bare-chip state on the surface 2a of the wiring board 2.

Abstract: A resin ejection nozzle is scanned over a substrate on which an electronic part is mounted, and ejects an encapsulation resin to an encapsulation area of the substrate. The resin ejection nozzle comprises an ejection part adapted to eject the encapsulation resin, the ejection part having a longitudinal direction which is perpendicular to a direction of movement of the nozzle. An ejection hole part is adapted to cause the encapsulation resin to contact a substantially half area of a side of the electronic part which lies at right angles to the direction of movement of the nozzle. A remaining portion of the side of the electronic part is gradually contacted by the encapsulation resin after the substantially half area of the side of the electronic part is contacted by the encapsulation resin.

Abstract: A method of fabricating a device including plural electronic parts mounted on a circuit board with mounting areas for mounting the electronic parts being covered by a sealing resin is disclosed. The method prevents small air bubbles from entering into the sealing resin near the electronic parts. The method includes the steps of, before applying the sealing resin, applying an under-fill resin near the electronic parts with plural nozzles at the same time, and hardening the under-fill resin to form a taper-shaped structure around the electronic parts.

Abstract: To realize reduction in the size and cost of a protection circuit module for a secondary battery. A protection circuit module 1 for a secondary battery has at least a wiring board 2 having multiple battery-side external terminals 4a and multiple load-side external terminals 20a, and semiconductor components 12 and 14 mounted on the wiring board 2. On the wiring board 2, the battery-side external terminals 4a are disposed on a surface 2a, and the load-side external terminals 20a are disposed on a surface 2b on the opposite side. The semiconductor components 12 and 14 have multiple external connection terminals 12a and 14a arranged on a single plane surface, and are mounted face-down in a bare-chip state on the surface 2a of the wiring board 2.