Patents by Inventor Seiichiro Tsukui

Seiichiro Tsukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
    Patent number: 5028986
    Abstract: There is a trend to increase that area of a device requiring a memory of large capacity, which is occupied by a semiconductor memory. This trend obstructs reduction of the size of the device. The present invention contemplates to provide a memory which can have a high integration, a high density and a large capacity while minimizing the mounting area. In order to achieve this memory, the TAB (Tape Automated Bonding) of the prior art is mounted on an electrically conductive connector, and a plurality of structures composed of the TAB and the connector are stacked. Moreover, the connector mounting the TAB thereon is constructed such that the independent terminals of the stacked TABs may not be shorted.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: July 2, 1991
    Assignees: Hitachi, Ltd., HitachiTobu Semiconductor, Ltd.
    Inventors: Toshio Sugano, Kohji Nagaoka, Seiichiro Tsukui, Yoshiaki Wakashima, Michio Tanimoto, Masayuki Watanabe, Suguru Sakaguchi, Kunihiko Nishi, Aizo Kaneda, Kohji Serizawa, Michiharu Honda, Tohru Yoshida, Takeshi Komaru, Atsushi Nakamura
  • Semiconductor integrated circuit device and method of manufacturing the same
    Patent number: 4982265
    Abstract: In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of high packaging density can be realized by a flat packaging technique.
    Type: Grant
    Filed: June 22, 1988
    Date of Patent: January 1, 1991
    Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd., Akita Electronics Co., Ltd.
    Inventors: Masayuki Watanabe, Toshio Sugano, Seiichiro Tsukui, Takashi Ono, Yoshiaki Wakashima