Patents by Inventor Seiichirou Tsukui

Seiichirou Tsukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 5103247
    Abstract: In an SIP module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the positions closer to the end portion of the substrate in order to drastically reduce the packaging height.
    Type: Grant
    Filed: October 31, 1990
    Date of Patent: April 7, 1992
    Assignees: Hitachi, Ltd., Hitachi Tobu Semiconductor, Ltd.
    Inventors: Toshio Sugano, Seiichirou Tsukui, Shigeru Suzuki