Patents by Inventor Seiji Harada
Seiji Harada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240067142Abstract: A vehicle control device includes: an actuator drive controller configured to control a drive of an actuator; a main motor drive controller configured to control a drive of a main motor; and a stuck determiner. The stuck determiner determines a stuck of the actuator based on a detection value of a sensor unit that detects a physical quantity changed according to a drive state of the actuator. The main motor drive controller is configured to perform an engaging surface pressure reduction control for reducing an engaging surface pressure between a parking gear and a parking lever by driving the main motor, when the stuck determiner determines that the actuator is stuck in releasing a parking lock of the vehicle.Type: ApplicationFiled: October 24, 2023Publication date: February 29, 2024Inventors: Akihiro HARADA, Seiji NAKAYAMA, Shigeru KAMIO, Takuji NAKAMURA
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Patent number: 10546758Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a diffusing step of heating the wafer after performing the coating step, thereby diffusing the metal salt on the back side of the wafer to form a gettering layer containing the metal salt on the back side of the wafer, in which the metal salt is diffused in the gettering layer.Type: GrantFiled: May 4, 2018Date of Patent: January 28, 2020Assignee: DISCO CORPORATIONInventors: Daigo Shitabo, Seiji Harada, Hiroki Takeuchi
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Patent number: 10541149Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a drying step of drying the wafer after performing the coating step, thereby forming a gettering layer containing the metal salt on the back side of the wafer.Type: GrantFiled: May 4, 2018Date of Patent: January 21, 2020Assignee: DISCO CORPORATIONInventor: Seiji Harada
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Patent number: 10157802Abstract: A workpiece evaluating method evaluates the gettering property of a device wafer having a plurality of devices formed on the front side of the wafer and having a gettering layer formed inside the wafer. The method includes the steps of applying excitation light for exciting a carrier to the wafer, applying microwaves to a light applied area where the excitation light is applied and also to an area other than the light applied area, measuring the intensity of the microwaves reflected from the light applied area and from the area other than the light applied area, subtracting the intensity of the microwaves reflected from the area other than the light applied area from the intensity of the microwaves reflected from the light applied area to thereby obtain a differential signal, and determining the gettering property of the gettering layer according to the intensity of the differential signal obtained above.Type: GrantFiled: March 17, 2017Date of Patent: December 18, 2018Assignee: Disco CorporationInventors: Naoya Sukegawa, Seiji Harada
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Publication number: 20180323080Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a drying step of drying the wafer after performing the coating step, thereby forming a gettering layer containing the metal salt on the back side of the wafer.Type: ApplicationFiled: May 4, 2018Publication date: November 8, 2018Inventor: Seiji Harada
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Publication number: 20180323081Abstract: A gettering layer forming method includes a coating step of applying a solution of metal salt to a back side of a wafer, and a diffusing step of heating the wafer after performing the coating step, thereby diffusing the metal salt on the back side of the wafer to form a gettering layer containing the metal salt on the back side of the wafer, in which the metal salt is diffused in the gettering layer.Type: ApplicationFiled: May 4, 2018Publication date: November 8, 2018Inventors: Daigo Shitabo, Seiji Harada, Hiroki Takeuchi
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Patent number: 9786490Abstract: Disclosed herein is a wafer processing method for processing the back side of a wafer having a plurality of devices formed on the front side so as to be separated by a plurality of crossing division lines. The wafer processing method includes a back grinding step of grinding the back side of the wafer to thereby reduce the thickness of the wafer to a predetermined thickness, a back polishing step of polishing the back side of the wafer after performing the back grinding step, thereby removing grinding strain, and a diamond-like carbon film deposition step of forming a diamond-like carbon film on the back side of the wafer after performing the back polishing step.Type: GrantFiled: August 1, 2016Date of Patent: October 10, 2017Assignee: Disco CorporationInventor: Seiji Harada
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Publication number: 20170278759Abstract: A workpiece evaluating method evaluates the gettering property of a device wafer having a plurality of devices formed on the front side of the wafer and having a gettering layer formed inside the wafer. The method includes the steps of applying excitation light for exciting a carrier to the wafer, applying microwaves to a light applied area where the excitation light is applied and also to an area other than the light applied area, measuring the intensity of the microwaves reflected from the light applied area and from the area other than the light applied area, subtracting the intensity of the microwaves reflected from the area other than the light applied area from the intensity of the microwaves reflected from the light applied area to thereby obtain a differential signal, and determining the gettering property of the gettering layer according to the intensity of the differential signal obtained above.Type: ApplicationFiled: March 17, 2017Publication date: September 28, 2017Inventors: Naoya Sukegawa, Seiji Harada
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Publication number: 20170233609Abstract: Disclosed herein is a resin composition for fixing a plate-shaped workpiece. The resin composition includes a composition and a photopolymerization initiator added to the composition. This composition is composed of (meth)acrylate and a plasticizer or a reactive diluent. Preferably, the composition constituting the resin composition contains 30% to 45% by mass of (meth)acrylate having an urethane bond, 5% to 15% by mass of (meth)acrylate not having an urethane bond, and 40% to 65% by mass of plasticizer, which is an ester.Type: ApplicationFiled: February 3, 2017Publication date: August 17, 2017Inventors: Seiji Harada, Makoto Shimotani
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Patent number: 9679820Abstract: An evaluation method of a device wafer on which plural devices are formed on a front surface and inside which a gettering layer is formed is provided. In the evaluation method, electromagnetic waves are radiated toward a back surface of the device wafer and excitation light is radiated to generate excess carriers. Furthermore, the gettering capability of the gettering layer formed in the device wafer is determined based on the damping time of reflected electromagnetic waves.Type: GrantFiled: June 26, 2015Date of Patent: June 13, 2017Assignee: Disco CorporationInventors: Naoya Sukegawa, Seiji Harada
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Publication number: 20170047221Abstract: Disclosed herein is a wafer processing method for processing the back side of a wafer having a plurality of devices formed on the front side so as to be separated by a plurality of crossing division lines. The wafer processing method includes a back grinding step of grinding the back side of the wafer to thereby reduce the thickness of the wafer to a predetermined thickness, a back polishing step of polishing the back side of the wafer after performing the back grinding step, thereby removing grinding strain, and a diamond-like carbon film deposition step of forming a diamond-like carbon film on the back side of the wafer after performing the back polishing step.Type: ApplicationFiled: August 1, 2016Publication date: February 16, 2017Inventor: Seiji Harada
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Patent number: 9543189Abstract: A method of processing a laminated wafer in which a first wafer is laminated on a second wafer, the method including: a laminated wafer forming step of forming the laminated wafer by laminating the first wafer on the second wafer; a modified layer forming step of forming a modified layer within the first wafer by positioning a focusing point of a laser beam within the first wafer and moving the first wafer in a horizontal direction relative to the focusing point while applying the laser beam, the modified layer forming step being performed before or after the laminated wafer forming step is performed; and a separating step of separating part of the first wafer from the laminated wafer with the modified layer as a boundary, the separating step being performed after the laminated wafer forming step and the modified layer forming step are performed.Type: GrantFiled: July 29, 2014Date of Patent: January 10, 2017Assignee: Disco CorporationInventors: Seiji Harada, Satoshi Kobayashi, Yasuyoshi Yubira
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Publication number: 20150377779Abstract: An evaluation method of a device wafer on which plural devices are formed on a front surface and inside which a gettering layer is formed is provided. In the evaluation method, electromagnetic waves are radiated toward a back surface of the device wafer and excitation light is radiated to generate excess carriers. Furthermore, the gettering capability of the gettering layer formed in the device wafer is determined based on the damping time of reflected electromagnetic waves.Type: ApplicationFiled: June 26, 2015Publication date: December 31, 2015Inventors: Naoya Sukegawa, Seiji Harada
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Publication number: 20150037962Abstract: A method of processing a laminated wafer in which a first wafer is laminated on a second wafer, the method including: a laminated wafer forming step of forming the laminated wafer by laminating the first wafer on the second wafer; a modified layer forming step of forming a modified layer within the first wafer by positioning a focusing point of a laser beam within the first wafer and moving the first wafer in a horizontal direction relative to the focusing point while applying the laser beam, the modified layer forming step being performed before or after the laminated wafer forming step is performed; and a separating step of separating part of the first wafer from the laminated wafer with the modified layer as a boundary, the separating step being performed after the laminated wafer forming step and the modified layer forming step are performed.Type: ApplicationFiled: July 29, 2014Publication date: February 5, 2015Inventors: Seiji Harada, Satoshi Kobayashi, Yasuyoshi Yubira
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Patent number: 8930943Abstract: A software installing method for installing software to a computer includes searching printers that are installed in a network environment and displaying a list of found printers on a single searched printer screen. The found printers are listed in rows with each row comprising a checkbox and an identification name associated with the listed printers, and marking the checkbox in one of the rows and an operation for highlighting the identification name in the same row are independently acceptable. The method further includes displaying an image of at least one listed printer on the single searched printer screen whose identification name is highlighted on the single searched printer screen by a user and installing onto the computer the printer driver software that corresponds to the at least one listed printer where the checkbox associated with the printer is marked by the user.Type: GrantFiled: May 29, 2013Date of Patent: January 6, 2015Assignee: Konica Minolta, Inc.Inventor: Seiji Harada
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Patent number: 8896878Abstract: Disclose is an image forming apparatus, which makes it possible to easily change the display magnification factor of the print preview image, by conducting intuitive operations.Type: GrantFiled: November 22, 2011Date of Patent: November 25, 2014Assignee: Konica Minolta Business Technologies, Inc.Inventor: Seiji Harada
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Publication number: 20140175070Abstract: A laser processing method including the steps of covering the back side of a workpiece with fine particles having absorptivity to the wavelength of a laser beam to be applied to the workpiece, thereby forming a fine particle layer on the back side of the workpiece, and next applying the laser beam through the fine particle layer to the back side of the workpiece to thereby perform ablation to the workpiece. The laser beam applied to the workpiece is absorbed by the fine particle layer to thereby suppress the scattering of the energy of the laser beam and the reflection of the laser beam, so that the ablation to the workpiece can be efficiently performed.Type: ApplicationFiled: December 11, 2013Publication date: June 26, 2014Applicant: Disco CorporationInventors: Yukinobu Ohura, Daigo Shitabo, Nobuyasu Kitahara, Seiji Harada
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Patent number: 8707207Abstract: There are described a method and a computer executable program of the same, each of which makes it possible to provide registered items for a predetermined processing, which is established in advance corresponding to user's demands. The method includes: displaying a list of plural registrable items on a display section, which can be registered in order to provide at least one of the plural registrable items for the predetermined processing; accepting a registration instruction for registering said at least one of the plural registrable items, which includes an attribute value that indicates a status of its registration, based on an operation conducted by a user; providing the registered item for the predetermined processing according to the attribute value of the registration concerned; and when the registration instruction is accepted, displaying an attached image, which corresponds to the attribute value of the registration concerned, associating with one of the registrable items.Type: GrantFiled: October 27, 2009Date of Patent: April 22, 2014Assignee: Konica Minolta Business Technologies, Inc.Inventors: Yoshiyuki Harada, Seiji Harada
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Publication number: 20130268928Abstract: Disclosed a software installing method to a computer including the steps of: installing a software program to the computer, the software program corresponding to an equipment connected to the computer; acquiring equipment information of the equipment from the equipment connected to the computer; and displaying the acquired equipment information of the equipment on the display section prior to the installing step.Type: ApplicationFiled: May 29, 2013Publication date: October 10, 2013Applicant: KONICA MINOLTA BUSINESS TECHNOLOGIES, INC.Inventor: Seiji Harada
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Patent number: 8526064Abstract: Disclosed is a computer readable storage medium storing a program to make a computer realize functions of an image storage unit to store image data for generating a tint block image, a tint block image generation unit to generate the tint block image based on the image data, a script generation unit to generate a script for forming the tint block image based on the tint block image generated by the generation unit, a script adding unit to add the script to print data and a print data input unit to input the print data in which the script is added by the adding unit to an image forming apparatus.Type: GrantFiled: November 22, 2010Date of Patent: September 3, 2013Assignee: Konica Minolta Business Technologies, Inc.Inventors: Seiji Harada, Rei Yokoyama