Patents by Inventor Seiji Ishiyama

Seiji Ishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible joint methodology to attach a die on an organic substrate
    Patent number: 7554198
    Abstract: In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: June 30, 2009
    Assignee: Intel Corporation
    Inventors: Kazuo Ogata, Tsuyoshi Fukuo, Seiji Ishiyama, Tetsuhide Koh
  • Flexible joint methodology to attach a die on an organic substrate
    Publication number: 20080001270
    Abstract: In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: June 29, 2006
    Publication date: January 3, 2008
    Inventors: Kazuo Ogata, Tsuyoshi Fukuo, Seiji Ishiyama, Tetsuhide Koh
  • Cured mold compound spacer for stacked-die package
    Publication number: 20070231970
    Abstract: An embodiment of the present invention is a technique to fabricate a package. A lower die is attached to a substrate. A stacked-die assembly having a spacer made of a cured mold compound is formed between the lower die and an upper die. The stacked-die assembly is encapsulated using the cured mold compound.
    Type: Application
    Filed: March 31, 2006
    Publication date: October 4, 2007
    Inventors: Tsuyoshi Fukuo, Tetsuhide Koh, Seiji Ishiyama, Kazuo Ogata