Patents by Inventor Seiji Katsuoka
Seiji Katsuoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8141513Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: GrantFiled: January 3, 2011Date of Patent: March 27, 2012Assignee: Ebara CorporationInventors: Masahiko Sekimoto, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
-
Patent number: 8133376Abstract: A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.Type: GrantFiled: August 30, 2010Date of Patent: March 13, 2012Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo
-
Patent number: 8038136Abstract: A hand 1 is constituted by a hand base 4 serving as a base portion, a rocking hand 3 disposed to be superposed on the hand base 4 and serving to support a substrate 2, and a rocking mechanism 5 provided between the hand base 4 and the rocking hand 3 and serving to support the rocking hand 3 to be tiltable and movable in parallel with respect to the hand base 4.Type: GrantFiled: March 20, 2009Date of Patent: October 18, 2011Assignees: Kabushiki Kaisha Yaskawa Denki, Ebara CorporationInventors: Hiroki Sanemasa, Hideo Yamamoto, Naoomi Torii, Takahiro Ogawa, Seiji Katsuoka, Hidetaka Nakao, Natsuki Makino
-
Publication number: 20110237163Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: ApplicationFiled: June 3, 2011Publication date: September 29, 2011Inventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Publication number: 20110203518Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: ApplicationFiled: May 4, 2011Publication date: August 25, 2011Inventors: Seiji KATSUOKA, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
-
Patent number: 7976362Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: GrantFiled: August 3, 2009Date of Patent: July 12, 2011Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Patent number: 7959977Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: GrantFiled: April 30, 2010Date of Patent: June 14, 2011Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
-
Publication number: 20110094442Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: ApplicationFiled: January 3, 2011Publication date: April 28, 2011Inventors: Masahiko SEKIMOTO, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
-
Patent number: 7886685Abstract: A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by bringing a peripheral portion of a surface of the substrate (W) into contact with a first sealing member; and a substrate pressing section for lowering relative to the substrate holder so as to press the substrate (W) held by the substrate holder downward, thereby bringing a first sealing member into pressure contact with the substrate (W). The substrate pressing section is provided with a second ring-shaped sealing member which makes pressure contact with an upper surface of a ring-shaped holding section of the substrate holder, thereby sealing the peripheral region of the substrate pressing section.Type: GrantFiled: December 22, 2004Date of Patent: February 15, 2011Assignee: Ebara CorporationInventors: Masahiko Sekimoto, Seiji Katsuoka, Naoki Dai, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Suzuki, Kenichi Kobayashi, Yasuyuki Motoshima, Ryo Kato
-
Publication number: 20100320090Abstract: A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.Type: ApplicationFiled: August 30, 2010Publication date: December 23, 2010Inventors: Junichiro YOSHIOKA, Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo
-
Patent number: 7807027Abstract: A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.Type: GrantFiled: December 3, 2004Date of Patent: October 5, 2010Assignee: Ebara CorporationInventors: Junichiro Yoshioka, Seiji Katsuoka, Masahiko Sekimoto, Yasuhiko Endo, Yugang Guo
-
Publication number: 20100221432Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: ApplicationFiled: April 30, 2010Publication date: September 2, 2010Inventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
-
Patent number: 7735451Abstract: A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface of a substrate as pre-plating treatments and then electroless plates a metal film on the catalyst-imparted surface of the substrate. The cleaning treatment is carried out in a wider area of the surface of the substrate than that area to which a catalyst is imparted by the catalyst-imparting treatment.Type: GrantFiled: November 14, 2003Date of Patent: June 15, 2010Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motojima
-
Patent number: 7735450Abstract: A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.Type: GrantFiled: March 24, 2008Date of Patent: June 15, 2010Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Teruyuki Watanabe, Ryo Kato, Toshio Yokoyama, Kenichi Suzuki, Kenichi Kobayashi
-
Publication number: 20090305612Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.Type: ApplicationFiled: June 3, 2009Publication date: December 10, 2009Inventors: Mitsuru Miyazaki, Seiji Katsuoka, Naoki Matsuda, Junji Kunisawa, Kenichi Kobayashi, Hiroshi Sotozaki, Hiroyuki Shinozaki, Osamu Nabeya, Shinya Morisawa, Takahiro Ogawa, Natsuki Makino
-
Publication number: 20090291624Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: ApplicationFiled: August 3, 2009Publication date: November 26, 2009Inventors: Seiji KATSUOKA, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Publication number: 20090236786Abstract: A hand 1 is constituted by a hand base 4 serving as a base portion, a rocking hand 3 disposed to be superposed on the hand base 4 and serving to support a substrate 2, and a rocking mechanism 5 provided between the hand base 4 and the rocking hand 3 and serving to support the rocking hand 3 to be tiltable and movable in parallel with respect to the hand base 4.Type: ApplicationFiled: March 20, 2009Publication date: September 24, 2009Applicants: KABUSHIKI KAISHA YASKAWA DENKI, EBARA CORPORATIONInventors: Hiroki SANEMASA, Hideo YAMAMOTO, Naoomi TORII, Takahiro OGAWA, Seiji KATSUOKA, Hidetaka NAKAO, Natsuki MAKINO
-
Patent number: 7585205Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.Type: GrantFiled: October 3, 2007Date of Patent: September 8, 2009Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Junji Kunisawa, Mitsuru Miyazaki, Teruyuki Watanabe, Kenichi Kobayashi, Masayuki Kumekawa, Toshio Yokoyama
-
Publication number: 20090209176Abstract: A method can effectively eliminate a surface level difference (irregularities) in a film formed on an object without producing scratches in a surface of the film, and can polish and remove the film into a flat surface with greatly increased productivity. The method comprises carrying out a first polishing step by pressing a polishing pad of a polishing device, having a diameter which is smaller than the radius of the object, against the surface of the object at a first pressure while moving the polishing pad and the object relative to each other at a first relative speed. The first polishing step is terminated at a point in time when a surface level difference in the object is eliminated to a targeted level.Type: ApplicationFiled: February 10, 2009Publication date: August 20, 2009Inventors: Seiji Katsuoka, Manabu Tsujimura
-
Patent number: 7575636Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.Type: GrantFiled: June 20, 2006Date of Patent: August 18, 2009Assignee: Ebara CorporationInventors: Seiji Katsuoka, Masahiko Sekimoto, Toshio Yokoyama, Teruyuki Watanabe, Takahiro Ogawa, Kenichi Kobayashi, Mitsuru Miyazaki, Yasuyuki Motoshima, Akira Owatari, Naoki Dai