Abstract: Provided are a binder in the producing of a casting sand mold according to an ink jet type lamination shaping method in which a binder is printed with respect to sand, a method for producing the binder, and a method for producing a casting sand mold using the binder. Specifically, provided are a binder useful for a casting sand mold of an ink jet type, containing: a resol-type phenolic resin that is obtained by reacting aldehydes (A1), phenols (P1), and a compound (N) having two or more phenolic hydroxyl groups in one molecule or by reacting the aldehydes (A1) and a novolac-type phenolic resin (N1), in the presence of an alkali catalyst, and has a dispersion degree (Mw/Mn) of 1.0 to 3.5 and a phenolic monomer residue of 5% or less, a method for producing the binder, and a method for producing a casting sand mold.

Abstract: Provided are a binder in the producing of a casting sand mold according to an ink jet type lamination shaping method in which a binder is printed with respect to sand, a method for producing the binder, and a method for producing a casting sand mold using the binder. Specifically, provided are a binder useful for a casting sand mold of an ink jet type, containing: a resol-type phenolic resin that is obtained by reacting aldehydes (A1), phenols (P1), and a compound (N) having two or more phenolic hydroxyl groups in one molecule or by reacting the aldehydes (A1) and a novolac-type phenolic resin (N1), in the presence of an alkali catalyst, and has a dispersion degree (Mw/Mn) of 1.0 to 3.5 and a phenolic monomer residue of 5% or less, a method for producing the binder, and a method for producing a casting sand mold.

Abstract: The present invention relates to a resin fine particle dispersion optimal for manufacturing a sheet product such as paper. Specifically, an object of the present invention is to provide a resin fine particle dispersion with which a sheet product having excellent heat resistance and high mechanical strength is obtained, and which has a small environmental load due to a small amount of resin particles remaining in wastewater after papermaking. Provided are a resin fine particle dispersion including resin fine particles (A), a fiber material (B), an ionic polyacrylamide (C), and water as essential components, and a sheet product and a friction plate using this.

Abstract: Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). (In the formula, R1 represents an alkyl group, an alkoxy group, or an aryl group, R2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R1's may be the same as or different from each other.

Abstract: The present invention relates to a resin fine particle dispersion optimal for manufacturing a sheet product such as paper. Specifically, an object of the present invention is to provide a resin fine particle dispersion with which a sheet product having excellent heat resistance and high mechanical strength is obtained, and which has a small environmental load due to a small amount of resin particles remaining in wastewater after papermaking. Provided are a resin fine particle dispersion including resin fine particles (A), a fiber material (B), an ionic polyacrylamide (C), and water as essential components, and a sheet product and a friction plate using this.

Abstract: Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below: wherein R1 is a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, R2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R2's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.

Abstract: Disclosed are a phenolic hydroxyl group-containing resin which has excellent alkali developing properties and makes it possible to exhibit high heat resistance in a cured product obtained therefrom, a production method therefor, a photosensitive composition, a resist material, a coating film, a curable composition and a cured product thereof, and a resist underlayer film. A phenolic hydroxyl group-containing resin, including a compound (A) having a molecular structure represented by the following Structural Formula (1). (In the formula, R1 represents an alkyl group, an alkoxy group, or an aryl group, R2 represents a hydrogen atom, an alkyl group, or an aryl group, m is an integer of 1 to 3, and n is an integer of 2 to 15. In the case where m is 2 or more, plural R1's may be the same as or different from each other.

Abstract: A photosensitive composition for permanent films having a hydroxynaphthalene novolac resin having a structural portion (I) represented by Formula (1) as a repeating unit and containing a hydroxynaphthalene (A) represented by Formula (2) in an amount of 2% by mass or less of the solid content of the resin, and which does not contain a curing agent, or contains a curing agent of 50 parts by mass or less to 100 parts by mass of the resin. In the formulas, R1 represents a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, an aralkyl group, or a halogen atom, a plurality of R1 may be the same as or different from each other, R2 represents a hydrogen atom, an alkyl group, or an aryl group, p represents 1 or 2, and q represents 4 or 5, with the proviso that the sum of p and q is 6.

Abstract: Provided is a compound containing a phenolic hydroxy group which has excellent heat resistance, a resist composition which has excellent thermal decomposition resistance, optical sensitivity and resolution, and a composition for a resist underlayer coating which has excellent thermal decomposition resistance and dry etching resistance. The compound containing a phenolic hydroxy group has a molecular structure represented by Structural Formula (1) below: wherein R1 is a hydrogen atom, an alkyl group or an aryl group, n is an integer of 2 to 10, R2 is any one of an alkyl group, an alkoxy group, an aryl group, an aralkyl group and a halogen atom, m is an integer of 0 to 4, and when m is 2 or greater, a plurality of R2's may be the same as or different from each other and may be bonded to either one of two aromatic rings of the naphthylene skeleton.