Abstract: A thin film type magnetic head that electromagnetic conversion efficiency is improved by making gradually magnetic resistance larger with approaching to a magnetic gap can be provided. There is disclosed a magnetic head including a pair of magnetic core half members having nonmagnetic substrates and magnetic metal films formed on the nonmagnetic substrates and a coil formed at a concave part by a thin film forming process, the pair of magnetic core half members being jointed to each other opposite to each other through a magnetic gap formed between the respective magnetic metal films, the concave part formed on the surface formed by joining at least one of the magnetic metal films and the other magnetic metal film, wherein assistant cores consisting of magnetic materials are joined on the side of the surface by joining a pair of nonmagnetic substrates and the magnetic metal films are formed connected with the assistant cores.

Abstract: A method of manufacturing a magnetic head by bonding a pair of magnetic cores to each other, wherein a residual stress in the magnetic cores upon bonding them together is controlled so that a permeability of the magnetic cores in the vicinity of a magnetic recording medium sliding surface of the magnetic cores may become maximum. Accordingly, the residual stress in the magnetic cores is controlled so that the permeability of the magnetic cores may surely become maximum after forming the magnetic head, thereby ensuring a superior reproduction efficiency of the magnetic head.

Abstract: A rotary magnetic head apparatus is provided which is capable of reliably supplying DC power for driving to an active-type reproducing head provided within a rotary drum and which is capable of taking the reproductive output signal of the active-type head to the outside of the drum. The rotary magnetic head apparatus includes a fixed drum, a rotary drum which is rotatable with respect to the fixed drum, an active-type reproducing head, disposed on the rotary drum, for reproducing information from a magnetic tape, a constant-current circuit, disposed on the rotary drum, for supplying a constant current for driving the head to the active-type reproducing head, a noncontact signal transmission device for taking the reproductive output signal which is output when the active-type reproducing head reproduces information from the magnetic tape to the outside of the rotary drum, and a sliding-type contact device for supplying external DC power to the constant-current circuit.

Abstract: There is provided a copper alloy sheet for forming a connector, having a chemical composition consisting essentially of:Mg: 0.3-2% by weight;P: 0.001-0.02% by weight;C: 0.0002-0.0013% by weight;O: 0.0002-0.001% by weight; andCu and inevitable impurities: the balance. The copper alloy sheet has a structure that fine particles of oxides including Mg oxide having a particle size of not more than 3 .mu.m are evenly dispersed in a matrix of the copper alloy sheet. The copper alloy sheet is excellent not only in tensile strength, elongation, electric conductivity and spring limit value before forming, but also in spring limit value after forming, and high-temperature creep strength.

Abstract: In a magnetic head having a pair of magnetic cores defining a magnetic gap in-between, a side of each magnetic core facing a recording medium is formed of a single-crystal ferrite, with the remaining portions of each magnetic core being formed of poly-crystal ferrite. The surface of the magnetic core facing the recording medium and the abutment surface of the magnetic core are the {100} plane and the {100} plane of the single-crystal ferrite, respectively. The magnetic head has excellent abrasion resistance and electro-magnetic conversion characteristics.

Abstract: A magnetic head has a pair of magnetic core substrates formed of an oxide magnetic material, at least one of the magnetic core substrates having a gap film formed on an abutment surface thereof, the pair of magnetic core substrates being abutted to each other on the gap film as abutment surfaces, having a magnetic gap formed between them. The gap film is formed of platinum, the platinum group, or an alloy consisting mainly of platinum or the platinum group. The pair of magnetic core substrates are bonded to each other to be integrated into one unit by a non-magnetic glass. The magnetic gap has a track width of not greater than 50 .mu.m. The gap film has a thickness of not greater than 150 nm.

Abstract: A plurality of rotatable attracting units are mounted on a rotary member each for attracting the bottom of one can barrel supplied from a supply path in a first position. Each of the attracting units is inactivatable to release the can barrel onto a conveyor path in a second position after the can barrel has been rotated by the rotary member through a prescribed angle from the first position to the second position. A holder is disposed for holding in the first position the can barrels, one at a time, supplied from the supply path while centrally aligning the bottom of the can barrel with the center of rotation of the attracting unit. The holder includes, in the first position below the the supply path, a rotary body having a plurality of recessed defined in an outer periphery thereof each for supporting a side of a can barrel supplied from the supply path, and a drive device for intermittently rotating the rotary body in synchronism with the rotary member.

Abstract: A copper alloy lead material for leads of a semiconductor device, which consists essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus, from 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities. The copper alloy lead material possesses satisfactory properties such as elongation and electrical conductivity required of a material for leads in a semiconductor device, and further exhibits excellent strength and heat resistance enough to be used as leads in semiconductor devices having high wiring densities, and at the same time possesses improved soldering reliability to the substrate of the semiconductor device as compared to a conventional copper alloy lead material.