Patents by Inventor Seiji Mitsuno

Seiji Mitsuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip-type composite electronic component
    Patent number: 5734313
    Abstract: A chip-type composite electronic component according to the present invention comprises an insulating substrate (1), a common electrode (2) formed on the substrate (1), a plurality of individual electrodes (3a-3h) formed on the substrate (1) to be spaced from the common electrode (2), and a plurality of electronic elements (4a-4e) each interposed between each of the individual electrodes (3a-3h) and the common electrode (2). Each of the common electrode (2) and individual electrodes (3a-3h) has a plated solder layer as an outermost layer. Each of the electronic elements (4a-4e) has a direct current resistance of no less than 47K .OMEGA., and the solder layer of the common electrode (2) has a layer thickness which is no more than 2.9 times as great as that of the solder layer of the individual electrodes (3a-3h).
    Type: Grant
    Filed: June 27, 1996
    Date of Patent: March 31, 1998
    Assignee: Rohm Co., Ltd.
    Inventors: Masato Doi, Hirotoshi Inoue, Seiji Mitsuno