Abstract: A workpiece holding body holding a workpiece having a three-dimensional shape is swung around a lateral swing axis to position the workpiece so that one mounting surface of the workpiece faces a predetermined worked direction and a viscous substance is printed on the one mounting surface of the workpiece which is positioned. The workpiece holding body is swung around the swing axis to position the workpiece so that another mounting surface of the workpiece in which the viscous substance is printed on one mounting surface faces the worked direction and to print the viscous substance on the other mounting surface of the workpiece which is positioned.

Abstract: A flux recovery device recovers a vaporized flux being generated at a time of soldering an electronic circuit board on which electronic components are placed. The flux recovery device includes a first pipe, a dust collector, and a current controller. The first pipe causes gas including the vaporized flux to pass to the flux recovery device. The dust collector solidifies the vaporized flux passed through the first pipe and collects dust, by a plasma discharge. The current controller performs a constant current control of the plasma discharge.

Abstract: When a workpiece holder holding a workpiece is rocked around a lateral rocking axis by a work stage of a mounter and the workpiece is positioned so that one mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the one mounting surface by a mounting head of the mounter. When a posture of the workpiece in the workpiece holder is changed by a posture changing head of a posture changer and thereafter the workpiece holder in which the posture of the workpiece is changed is rocked around the lateral rocking axis by the work stage of the mounter and the workpiece is positioned so that the other mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the other mounting surface by the mounting head of the mounter.

Abstract: A workpiece holding body holding a workpiece having a three-dimensional shape is swung around a lateral swing axis to position the workpiece so that one mounting surface of the workpiece faces a predetermined worked direction and a viscous substance is printed on the one mounting surface of the workpiece which is positioned. The workpiece holding body is swung around the swing axis to position the workpiece so that another mounting surface of the workpiece in which the viscous substance is printed on one mounting surface faces the worked direction and to print the viscous substance on the other mounting surface of the workpiece which is positioned.

Abstract: When a workpiece holder holding a workpiece is rocked around a lateral rocking axis by a work stage of a mounter and the workpiece is positioned so that one mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the one mounting surface by a mounting head of the mounter. When a posture of the workpiece in the workpiece holder is changed by a posture changing head of a posture changer and thereafter the workpiece holder in which the posture of the workpiece is changed is rocked around the lateral rocking axis by the work stage of the mounter and the workpiece is positioned so that the other mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the other mounting surface by the mounting head of the mounter.

Abstract: A flux recovery device recovers a vaporized flux being generated at a time of soldering an electronic circuit board on which electronic components are placed. The flux recovery device includes a first pipe, a dust collector, and a current controller. The first pipe causes gas including the vaporized flux to pass to the flux recovery device. The dust collector solidifies the vaporized flux passed through the first pipe and collects dust, by a plasma discharge. The current controller performs a constant current control of the plasma discharge.

Abstract: Brightness information of, for example, an average value of brightnesses at an X-ray image of a first connected part when an electronic component is mounted onto only one face of a printed board is obtained. Binary images of an X-ray image of the board with the electronic components mounted to both faces are formed by an upper and a lower levels relative to the brightness information. The binary images are synthesized with each other so as to extract an image of only a second connected part. The image of only the second connected part can be obtained in this manner on the basis of the X-ray image of the double face-mounted board, so that an accuracy for connection inspection is improved. Also, a relationship between a density in the X-ray image of the connected part and a thickness of the connected part is obtained beforehand, based on which a plurality of thickness images are obtained for a plurality of X-ray images of different image storage times.

Abstract: Brightness information of, e.g., an average value of brightnesses at an X-ray image of a first connected part when an electronic component (422) is mounted onto only one face of a printed board (421) is obtained. Binary images of an X-ray image of the board with the electronic components mounted to both faces are formed by an upper and a lower levels relative to the brightness information. The binary images are synthesized with each other so as to extract an image of only a second connected part. The image of only the second connected part can be obtained in this manner on the basis of the X-ray image of the double face-mounted board, so that an accuracy for connection inspection is improved in comparison with the related art. Also, a relationship between a density in the X-ray image of the connected part and a thickness of the connected part is obtained beforehand, based on which a plurality of thickness images are obtained for a plurality of X-ray images of different image storage times.

Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted on a printed circuit board by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.

Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted on a printed circuit board by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.

Abstract: A mounting state of a component mounted on a printed circuit board with adhesive is inspected by an apparatus which includes an image pick-up unit for picking up in colors an image of the board after the component is mounted, a color extracting part for discriminating an adhesive portion of the image based on a predetermined color distribution of the adhesive and then extracting the adhesive portion as extracted data, a cutting part for setting a window frame for a to-be-inspected portion in the image of the board relative to the extracted data so as to detect bulging of the adhesive, and cutting out data within the window frame, and a deciding part for deciding, based on the cut data, a presence/absence of the bulging of the adhesive from a size or an area of a portion in the window frame which shows a color within the color distribution of the adhesive.

Abstract: An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective.

Abstract: A position recognizing device receives and stores image information denoting tones or gradations of an image of a target object. Projection data is synthesized from the image information and the projection data is normalized using a maximum value thereof. A run position and a run length of the normalized projection data at a predetermined slice level are detected, and a position of the target device is detected based on the run position and the run length.

Abstract: A method in which the position of an object pattern in an image can be accurately detected is disclosed. The method comprises the steps of: (a) preparing a reference pattern which has a pattern and a background which are composed of pixels each having a value regarding the brightness or gradation; (b) dividing the image into a plurality of sections; (c) selecting arbitrarily an area having two or more of the sections; (d) obtaining the brightness data from each of the sections; (e) obtaining a sum of products of the value of each pixel and the brightness data of each section corresponding to the pixel; (f) moving the area to another position in the image; (g) repeating steps (d) to (f); and (h) deciding that the area from which the sum having an extreme value is obtained is the one containing the object pattern.

Abstract: An apparatus for converting image signals into binary signals is disclosed. The apparatus comprises: a binarizing section for binarizing image signals; a connectivity distribution section for obtaining connectivities between pixels from binary signals and for producing a connectivity distribution; and a judging section for, from connectivity distributions obtained with different binary levels, judging the level at which the frequencies of maximum and minimum connectivities are highest and the sum of the frequencies of intermediate connectivities is minimal.

Abstract: In a position recognizing method and an apparatus, an edge is detected by scanning a one-dimensional model including an edge to be recognized and one-dimensional edge detecting data of an image obtained via a camera so as to determine the difference between the density of the pixel of the one-dimensional model and the density of the corresponding pixel of the one-dimensional edge detecting data and the geometric balance therebetween. Then, the amount of data for detecting the edge becomes smaller and the pattern or parts can be recognized without controlling the binary level and at a high speed.

Abstract: A lead's position recognizing device including device for detecting positions of maximum points and minimum points on each outline of each region surrounded by adjacent leads or positions of a pair of corners on diagonal of each outline and a device for detecting the lead's position from intersecting point of a straight line connecting midpoints between said maximum point and minimum point taken at a given proportion or midpoints on diagonal of a pair of corners also taken at a given proportion and the outline.It features the possibility of recognizing the lead's position by the use as positional information of the maximum and minimum points of the outline or the positions of a pair of corners on the diagonal of the outline which remain unchanged even if the given IC parts are turned or have changes in shape such as burrs.