Patents by Inventor Seiji Morita
Seiji Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11807751Abstract: A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness and biodegradability is provided by using amorphous resin material components extracted from plant-derived wood. The resin composition includes a first resin including a hemicellulose or a hemicellulose derivative and a second resin including polymethylmethacrylate (PMMA, acrylic), polycarbonate (PC), cyclo olefin polymer (COP), cyclo olefin copolymer (COC), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or polystyrene (PS) and has excellent injection moldability.Type: GrantFiled: December 5, 2019Date of Patent: November 7, 2023Assignee: Hemicellulose Ltd.Inventors: Seiji Morita, Jin Nasukawa, Kenichi Sato, Laksmi Kusumawardhani
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Patent number: 11767382Abstract: A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness, and biodegradability is provided by using an amorphous resin material component extracted from plant-derived wood. The resin composition is a hemicellulose monomer obtained by applying a methacrylation reaction or acrylation reaction to a hemicellulose or hemicellulose derivative and has a molecular structure in which a methacrylic group or acryloyl group is bonded to the hemicellulose or hemicellulose derivative. This hemicellulose monomer has excellent injection moldability.Type: GrantFiled: December 5, 2019Date of Patent: September 26, 2023Assignee: Hemicellulose Ltd.Inventors: Seiji Morita, Jin Nasukawa, Kenichi Sato, Laksmi Kusumawardhani
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Publication number: 20220221792Abstract: A pattern forming material according to an embodiment is a pattern forming material comprising a polymer composed of a plurality of monomer units bonded to each other. Each of the monomer units includes an ester structure having a first carbonyl group and at least one second carbonyl group bonded to the ester structure. A second carbonyl group farthest from a main chain of the polymer constituting the pattern forming material among second carbonyl groups is in a linear chain state.Type: ApplicationFiled: March 29, 2022Publication date: July 14, 2022Applicant: Kioxia CorporationInventors: Ryosuke YAMAMOTO, Seiji MORITA, Norikatsu SASAO, Koji ASAKAWA, Tomoaki SAWABE, Shinobu SUGIMURA
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Patent number: 11320736Abstract: A pattern forming material according to an embodiment is a pattern forming material comprising a polymer composed of a plurality of monomer units bonded to each other. Each of the monomer units includes an ester structure having a first carbonyl group and at least one second carbonyl group bonded to the ester structure. A second carbonyl group farthest from a main chain of the polymer constituting the pattern forming material among second carbonyl groups is in a linear chain state.Type: GrantFiled: September 6, 2018Date of Patent: May 3, 2022Assignee: KIOXIA CORPORATIONInventors: Ryosuke Yamamoto, Seiji Morita, Norikatsu Sasao, Koji Asakawa, Tomoaki Sawabe, Shinobu Sugimura
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Publication number: 20220055254Abstract: According to one embodiment, a template for imprint patterning processes comprises a template substrate having a first surface and a pedestal on the first surface of the template substrate, the pedestal having a second surface spaced from the first surface in a first direction perpendicular to the first surface. A pattern is disposed on the second surface. The pedestal has a sidewall between the first surface and the second surface that is at an angle of less than 90° to the second surface.Type: ApplicationFiled: November 4, 2021Publication date: February 24, 2022Inventors: Kei KOBAYASHI, Anupam MITRA, Seiji MORITA, Hirokazu KATO
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Patent number: 11217431Abstract: In one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes housing the substrate provided with the first film in a chamber, and introducing a first gas into the chamber. The method further includes generating plasma discharge of the first gas in the chamber or applying radiation to the first gas in the chamber. The method further includes introducing a second gas containing a metal component into the chamber to cause the metal component to infiltrate into the first film after the generation of the plasma discharge or the application of the radiation is started.Type: GrantFiled: July 17, 2019Date of Patent: January 4, 2022Assignee: KIOXIA CORPORATIONInventors: Ryuichi Saito, Seiji Morita, Ryosuke Yamamoto
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Patent number: 11192282Abstract: According to one embodiment, a template for imprint patterning processes comprises a template substrate having a first surface and a pedestal on the first surface of the template substrate, the pedestal having a second surface spaced from the first surface in a first direction perpendicular to the first surface. A pattern is disposed on the second surface. The pedestal has a sidewall between the first surface and the second surface that is at an angle of less than 90° to the second surface.Type: GrantFiled: August 29, 2018Date of Patent: December 7, 2021Assignee: TOSHIBA MEMORY CORPORATIONInventors: Kei Kobayashi, Anupam Mitra, Seiji Morita, Hirokazu Kato
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Patent number: 11140551Abstract: An aircraft cabin audio communication system includes: a plurality of aircraft smart cabin headsets, each including a microphone and an earpiece. The earpiece includes a speaker; a first biometric sensor disposed on a first button; a second biometric sensor disposed on a second button; a third biometric sensor disposed on a third button; a wireless transceiver; a power button; and a processor that: performs device authentication of the aircraft smart cabin headset based on a device identifier of the aircraft smart cabin headset; performs first authentication based on first biometric data obtained from the first biometric sensor; establishes user connection with cabin speakers; performs second authentication based on second biometric data obtained from the second biometric sensor; and transmits information that comprises a connection request to a cockpit terminal of the aircraft through the wireless transceiver.Type: GrantFiled: July 3, 2019Date of Patent: October 5, 2021Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Sasha Dean-Bhïyan, Renato Seiji Morita
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Patent number: 10904686Abstract: A method of acoustic tuning includes: outputting, with a first speaker among a plurality of speakers in different locations on an aircraft cabin, a first sound; detecting, with a plurality of microphones in different locations of the cabin, first reflected sounds of the first sound; outputting, with a second speaker among the plurality of speakers, a second sound; detecting, with the plurality of microphones, second reflected sounds of the second sound; comparing, with a server connected to the speakers and the microphones, the first sound and the second sound with each of the first reflected sounds and each of the second reflected sounds, respectively; and adjusting an output gain and frequency phase of each of the plurality of speakers based on the comparisons between the first sound and each of the first reflected sounds and between the second sound and each of the second reflected sounds.Type: GrantFiled: July 3, 2019Date of Patent: January 26, 2021Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Sasha Dean-Bhïyan, Renato Seiji Morita, Victor-Daniel Gheorghian
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Patent number: 10879067Abstract: In one embodiment, a pattern forming method includes forming a first film on a substrate. The method further includes supplying energy to the first film to form a first region to which the energy have been supplied, and a second region including at least a region to which the energy has not been supplied. The method further includes impregnating at least the first region out of the first and second region with metal atoms. The method further includes developing the first film after impregnating the first region with the metal atoms to remove the second region while leaving the first region.Type: GrantFiled: February 21, 2019Date of Patent: December 29, 2020Assignee: Toshiba Memory CorporationInventors: Seiji Morita, Takashi Sato, Ryosuke Yamamoto
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Patent number: 10811252Abstract: A pattern-forming method includes forming a first film above a material to be processed, processing the first film into a pattern to be formed in the material to be processed, providing a second film on the first film and the material to be processed, supplying a precursor containing at least one of a metal material or a semiconductor material to the second film, removing the first film, and processing the material to be processed using the second film impregnated with at least one of the metal material and the semiconductor material, as a mask.Type: GrantFiled: August 30, 2018Date of Patent: October 20, 2020Assignee: TOSHIBA MEMORY CORPORATIONInventors: Ryosuke Yamamoto, Ryuichi Saito, Seiji Morita, Ryoichi Suzuki, Takeharu Motokawa, Shinichi Ito, Soichi Inoue
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Patent number: 10811268Abstract: According to one embodiment, a substrate processing apparatus comprises a chamber for a substrate that has a target film thereon. The apparatus includes a first gas introducing unit to introduce a precursor gas into the chamber, a second gas introducing unit that introduces a etching gas for etching the target film into the chamber, and a controller configured to control the first gas introducing unit and the second gas introducing unit to cause the first gas and the second gas to be alternately introduced to the chamber.Type: GrantFiled: August 13, 2018Date of Patent: October 20, 2020Assignee: TOSHIBA MEMORY CORPORATIONInventors: Yusuke Kasahara, Shinichi Ito, Seiji Morita, Ryosuke Yamamoto, Ryuichi Saito
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Publication number: 20200314573Abstract: A method of acoustic tuning includes: outputting, with a first speaker among a plurality of speakers in different locations on an aircraft cabin, a first sound; detecting, with a plurality of microphones in different locations of the cabin, first reflected sounds of the first sound; outputting, with a second speaker among the plurality of speakers, a second sound; detecting, with the plurality of microphones, second reflected sounds of the second sound; comparing, with a server connected to the speakers and the microphones, the first sound and the second sound with each of the first reflected sounds and each of the second reflected sounds, respectively; and adjusting an output gain and frequency phase of each of the plurality of speakers based on the comparisons between the first sound and each of the first reflected sounds and between the second sound and each of the second reflected sounds.Type: ApplicationFiled: July 3, 2019Publication date: October 1, 2020Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Sasha Dean-Bhïyan, Renato Seiji Morita, Victor-Daniel Gheorghian
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Publication number: 20200314646Abstract: An aircraft cabin audio communication system includes: a plurality of aircraft smart cabin headsets, each including a microphone and an earpiece. The earpiece includes a speaker; a first biometric sensor disposed on a first button; a second biometric sensor disposed on a second button; a third biometric sensor disposed on a third button; a wireless transceiver; a power button; and a processor that: performs device authentication of the aircraft smart cabin headset based on a device identifier of the aircraft smart cabin headset; performs first authentication based on first biometric data obtained from the first biometric sensor; establishes user connection with cabin speakers; performs second authentication based on second biometric data obtained from the second biometric sensor; and transmits information that comprises a connection request to a cockpit terminal of the aircraft through the wireless transceiver.Type: ApplicationFiled: July 3, 2019Publication date: October 1, 2020Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Sasha Dean-Bhïyan, Renato Seiji Morita
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Publication number: 20200310735Abstract: An aircraft cabin system includes: a cabin server that stores an application and a graphical attribute; and a plurality of modular displays connected to the cabin server via a network. Each of the modular displays includes: a modular display dock hardwired to the network; and a modular display body that is detachably attached and electrically connected to the modular display dock. The modular display body includes: a touch screen that displays a GUI; and a processor. The processor sends, to the cabin server, a request for the application and the graphical attribute when the modular display body is coupled to the modular display dock, the cabin server sends, to the modular display body via the modular display dock, the application and the graphical attribute in response to the request.Type: ApplicationFiled: July 3, 2019Publication date: October 1, 2020Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Sasha Dean-Bhïyan, Victor-Daniel Gheorghian, Renato Seiji Morita
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Publication number: 20200270430Abstract: A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness and biodegradability is provided by using amorphous resin material components extracted from plant-derived wood. The resin composition includes a first resin including a hemicellulose or a hemicellulose derivative and a second resin including polymethylmethacrylate (PMMA, acrylic), polycarbonate (PC), cyclo olefin polymer (COP), cyclo olefin copolymer (COC), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or polystyrene (PS) and has excellent injection moldability.Type: ApplicationFiled: December 5, 2019Publication date: August 27, 2020Inventors: Seiji Morita, Jin Nasukawa, Kenichi Sato, Laksmi Kusumawardhani
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Publication number: 20200270379Abstract: A resin composition for molding having excellent heat resistance, hardness, cost-effectiveness, and biodegradability is provided by using an amorphous resin material component extracted from plant-derived wood. The resin composition is a hemicellulose monomer obtained by applying a methacrylation reaction or acrylation reaction to a hemicellulose or hemicellulose derivative and has a molecular structure in which a methacrylic group or acryloyl group is bonded to the hemicellulose or hemicellulose derivative. This hemicellulose monomer has excellent injection moldability.Type: ApplicationFiled: December 5, 2019Publication date: August 27, 2020Inventors: Seiji Morita, Jin Nasukawa, Kenichi Sato, Laksmi Kusumawardhani
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Patent number: 10755689Abstract: An aircraft cabin system includes a plurality of modular displays disposed in an cabin and a server connected to each of the modular displays. Each of the plurality of modular displays includes a microphone that captures ambient noise in the cabin and a speaker that emits a noise reduction sound. The server instructs each of the plurality of modular displays to capture the ambient noise during a preselected flight phase. The server receives, from each of the plurality of modular displays, a digital ambient noise signal generated based on the ambient noise. The server generates for each of the plurality of modular displays a digital ambient noise reduction signal with an inverted phase of the digital ambient noise signal and a dynamic amplitude that is calculated to yield a highest level of ambient noise reduction. The server sends the digital ambient noise reduction signal to each of the plurality of modular displays.Type: GrantFiled: July 3, 2019Date of Patent: August 25, 2020Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Sasha Dean-Bhïyan, Renato Seiji Morita, Victor-Daniel Gheorghian
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Publication number: 20200090926Abstract: In one embodiment, a pattern forming method includes forming a first film on a substrate. The method further includes supplying energy to the first film to form a first region to which the energy have been supplied, and a second region including at least a region to which the energy has not been supplied. The method further includes impregnating at least the first region out of the first and second region with metal atoms. The method further includes developing the first film after impregnating the first region with the metal atoms to remove the second region while leaving the first region.Type: ApplicationFiled: February 21, 2019Publication date: March 19, 2020Applicant: TOSHIBA MEMORY CORPORATIONInventors: Seiji Morita, Takashi Sato, Ryosuke Yamamoto
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Publication number: 20190341229Abstract: In one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes housing the substrate provided with the first film in a chamber, and introducing a first gas into the chamber. The method further includes generating plasma discharge of the first gas in the chamber or applying radiation to the first gas in the chamber. The method further includes introducing a second gas containing a metal component into the chamber to cause the metal component to infiltrate into the first film after the generation of the plasma discharge or the application of the radiation is started.Type: ApplicationFiled: July 17, 2019Publication date: November 7, 2019Applicant: Toshiba Memory CorporationInventors: Ryuichi SAITO, Seiji MORITA, Ryosuke YAMAMOTO