Patents by Inventor Seiji Muraoka
Seiji Muraoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10818626Abstract: Provided is connection wiring capable of inhibiting connection defects between bumps and pads at the time of semiconductor chip mounting and also allowing an increase in the number of pads. In an area between a pad row in any stage and a pad row in an adjacent stage, a first line 31 is disposed so as to pass under an adjacent second line 32, or a second line 32 is disposed so as to pass over an adjacent first line 31. In this case, three lines are disposed in any area between pads 20 in each stage such that the three lines include a first line 31 situated in the middle, and second lines 32 are situated so as to have the first line 31 positioned therebetween. Thus, the pitch between the pads 20 can be further reduced without reducing the width of the pads 20.Type: GrantFiled: November 24, 2017Date of Patent: October 27, 2020Assignee: SHARP KABUSHIKI KAISHAInventors: Seiji Muraoka, Yukio Shimizu, Motoji Shiota
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Publication number: 20200236784Abstract: A display apparatus has a wiring board connected to a first connection portion at an outer edge of a display. The number of first wires on a first surface of the wiring board is less than the number of second wires on a second surface. Through-holes adjacent to each other are disposed at positions that differ in the extending direction of the first wires.Type: ApplicationFiled: January 13, 2020Publication date: July 23, 2020Inventors: SEIJI MURAOKA, RYOSUKE YAGI, SHIGENORI MORIOKA
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Publication number: 20190295974Abstract: Provided is connection wiring capable of inhibiting connection defects between bumps and pads at the time of semiconductor chip mounting and also allowing an increase in the number of pads. In an area between a pad row in any stage and a pad row in an adjacent stage, a first line 31 is disposed so as to pass under an adjacent second line 32, or a second line 32 is disposed so as to pass over an adjacent first line 31. In this case, three lines are disposed in any area between pads 20 in each stage such that the three lines include a first line 31 situated in the middle, and second lines 32 are situated so as to have the first line 31 positioned therebetween. Thus, the pitch between the pads 20 can be further reduced without reducing the width of the pads 20.Type: ApplicationFiled: November 24, 2017Publication date: September 26, 2019Applicant: SHARP KABUSHIKI KAISHAInventors: SEIJI MURAOKA, YUKIO SHIMIZU, MOTOJI SHIOTA
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Patent number: 10224305Abstract: In order to inhibit defective connection between a bump of a semiconductor chip and an electrode pad of a substrate, a semiconductor device includes a substrate provided on a surface with a plurality of electrode pads 15, a semiconductor chip 20 provided on a surface with a plurality of bumps 21 substantially equal in size, and an anisotropic conductive film 30 interposed between the plurality of bumps 21 and the plurality of electrode pads 15 and electrically connecting each of the bumps 21 and corresponding one of the electrode pads 15. The plurality of electrode pads 15 includes a plurality of first electrode pads 15A positioned closest to an end 25 of the semiconductor chip 20, and a plurality of second electrode pads 15B positioned inside the plurality of first electrode pads 15A on the semiconductor chip 20. Each of the second electrode pads 15B is larger in area than each of the first electrode pads 15A.Type: GrantFiled: May 18, 2016Date of Patent: March 5, 2019Assignee: SHARP KABUSHIKI KAISHAInventors: Masaki Nakayama, Motoji Shiota, Takashi Matsui, Yasuhiko Tanaka, Hiroki Miyazaki, Seiji Muraoka
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Patent number: 10001664Abstract: A liquid crystal display device includes a liquid crystal panel, a panel driver board, and flexible circuit boards. The liquid crystal panel has a substantially round shape and includes linear edge sections formed by linearly cutting out outer edge portions. The panel driver board is configured to supply signals related to image display to the liquid crystal panel. The flexible circuit boards include first ends and second ends. The first ends are mounted to the liquid crystal panel aligned with the linear edge sections with respect to the circumferential direction in a non-display area. The second ends are mounted to the panel driver board. Portions of the flexible circuit boards joining the first ends and the second ends have bending shapes in a plan view.Type: GrantFiled: March 3, 2016Date of Patent: June 19, 2018Assignee: SHARP KABUSHIKI KAISHAInventors: Masahiro Mitani, Aya Nakatani, Keiichi Yamamoto, Seiji Muraoka
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Publication number: 20180158795Abstract: In order to inhibit defective connection between a bump of a semiconductor chip and an electrode pad of a substrate, a semiconductor device includes a substrate provided on a surface with a plurality of electrode pads 15, a semiconductor chip 20 provided on a surface with a plurality of bumps 21 substantially equal in size, and an anisotropic conductive film 30 interposed between the plurality of bumps 21 and the plurality of electrode pads 15 and electrically connecting each of the bumps 21 and corresponding one of the electrode pads 15. The plurality of electrode pads 15 includes a plurality of first electrode pads 15A positioned closest to an end 25 of the semiconductor chip 20, and a plurality of second electrode pads 15B positioned inside the plurality of first electrode pads 15A on the semiconductor chip 20. Each of the second electrode pads 15B is larger in area than each of the first electrode pads 15A.Type: ApplicationFiled: May 18, 2016Publication date: June 7, 2018Inventors: MASAKI NAKAYAMA, MOTOJI SHIOTA, TAKASHI MATSUI, YASUHIKO TANAKA, HIROKI MIYAZAKI, SEIJI MURAOKA
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Publication number: 20180024395Abstract: A liquid crystal display device includes a liquid crystal panel, a panel driver board, and flexible circuit boards. The liquid crystal panel has a substantially round shape and includes linear edge sections formed by linearly cutting out outer edge portions. The panel driver board is configured to supply signals related to image display to the liquid crystal panel. The flexible circuit boards include first ends and second ends. The first ends are mounted to the liquid crystal panel aligned with the linear edge sections with respect to the circumferential direction in a non-display area. The second ends are mounted to the panel driver board. Portions of the flexible circuit boards joining the first ends and the second ends have bending shapes in a plan view.Type: ApplicationFiled: March 3, 2016Publication date: January 25, 2018Inventors: Masahiro MITANI, Aya NAKATANI, Keiichi YAMAMOTO, Seiji MURAOKA
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Patent number: 9217888Abstract: A liquid crystal display device includes: a liquid crystal panel having a display area and non-display area; a flexible substrate in the non-display area and connected to a control circuit substrate; a plurality of drivers in the non-display area; a plurality of connection wiring lines in the non-display area for connecting the flexible substrate to the plurality of drivers; a first driver; a second driver that is arranged further away from the flexible substrate than the first driver; a non-overlapping connection wiring line that connects the second driver to the flexible substrate and that does not overlap the first driver; and an overlapping connection wiring line that connects the second driver to the flexible substrate and that has a least a portion thereof overlapping the first driver.Type: GrantFiled: April 19, 2013Date of Patent: December 22, 2015Assignee: SHARP KABUSHIKI KAISHAInventors: Yukio Shimizu, Seiji Muraoka, Motoji Shiota, Takeshi Horiguchi
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Patent number: 9207477Abstract: A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.Type: GrantFiled: April 23, 2012Date of Patent: December 8, 2015Assignee: SHARP KABUSHIKI KAISHAInventors: Hiroki Miyazaki, Motoji Shiota, Takatoshi Kira, Gen Nagaoka, Seiji Muraoka, Makoto Tamaki, Keiji Aota, Yukio Shimizu, Takashi Matsui, Hiroki Nakahama, Hiroki Makino, Minoru Horino
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Publication number: 20150319849Abstract: The present invention provides a component securing structure that forms a wiring unit on a TFT glass substrate that is capable of transmitting UV light. A component, such as a driver IC and/or an FPC, is electrically connected to the wiring unit and is secured to the TFT glass substrate by a UV-curable ACF. An opening for transmitting UV light is formed in a light shielding layer of the wiring unit. UV light irradiated from the back side of the TFT glass substrate passes through the opening and directly irradiates the UV-curable ACF.Type: ApplicationFiled: December 9, 2013Publication date: November 5, 2015Applicant: SHARP KABUSHIKI KAISHAInventors: Yukio SHIMIZU, Motoji SHIOTA, Hiroki MIYAZAKI, Hiroki NAKAHAMA, Seiji MURAOKA, Takeshi HORIGUCHI
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Publication number: 20150109550Abstract: A liquid crystal display device includes: a liquid crystal panel having a display area and non-display area; a flexible substrate (13) in the non-display area and connected to a control circuit substrate; a plurality of drivers (21) in the non-display area; a plurality of connection wiring lines (27) in the non-display area for connecting the flexible substrate to the plurality of drivers; a first driver (21A); a second driver (21B) that is arranged further away from the flexible substrate than the first driver; a non-overlapping connection wiring line (32) that connects the second driver to the flexible substrate and that does not overlap the first driver; and an overlapping connection wiring line (31) that connects the second driver to the flexible substrate and that has a least a portion thereof overlapping the first driver.Type: ApplicationFiled: April 19, 2013Publication date: April 23, 2015Applicant: Sharp Kabushiki KaishaInventors: Yukio Shimizu, Seiji Muraoka, Motoji Shiota, Takeshi Horiguchi
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Publication number: 20140092338Abstract: A display module 1 of the present invention includes a first board 3, a second board 4, a base film 5, and a circuit member 2. The first board 3 and the second board 4 are bonded together to face with each other. The base film 5 is provided between the first board 3 and the second board 4 and extends outwardly from an end of the first board 3. The base film 5 has an insulating property and the extended portion is bent to an outer surface side of one of the first board 3 and the second board 4. The circuit member 2 is formed on the base film 5.Type: ApplicationFiled: April 23, 2012Publication date: April 3, 2014Applicant: SHARP KABUSHIKI KAISHAInventors: Hiroki Miyazaki, Motoji Shiota, Takatoshi Kira, Gen Nagaoka, Seiji Muraoka, Makoto Tamaki, Keiji Aota, Yukio Shimizu, Takashi Matsui, Hiroki Nakahama, Hiroki Makino, Minoru Horino
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Patent number: 8351009Abstract: A display panel is connected to a wiring-mounted board on which a signal supply wiring that supplies wiring supplies signals for driving the display panel is mounted. The wiring-mounted board has (i) first and second wires extending toward the display panel, and (ii) first and second terminals that are connected to the first and second wires, respectively. The display panel has a first short-circuit wire that is connected to the first and second wires at a connecting part of the display panel and the wiring-mounted board, so as to short-circuit the first and second wires.Type: GrantFiled: June 22, 2009Date of Patent: January 8, 2013Assignee: Sharp Kabushiki KaishaInventors: Yasuhiro Wakita, Seiji Muraoka, Hidetaka Mizumaki
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Publication number: 20120140158Abstract: A pad section 112 of a liquid crystal display device and a main surface of a substrate located in a periphery of the pad section 112 are formed so as to be exposed from a multilayer film 109. The pad section 112 is formed of an aluminum alloy material film, and the difference between a potential of the aluminum alloy material film and that of an ITO film is smaller than the difference between a potential of an aluminum film and that of the ITO film.Type: ApplicationFiled: June 25, 2010Publication date: June 7, 2012Applicant: SHARP KABUSHIKI KAISHAInventors: Hijiri Nakahara, Yukinobu Nakata, Takaharu Yamada, Seiji Muraoka
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Publication number: 20100321623Abstract: A display panel is connected to a wiring-mounted board on which a signal supply wiring that supplies wiring supplies signals for driving the display panel is mounted. The wiring-mounted board has (i) first and second wires extending toward the display panel, and (ii) first and second terminals that are connected to the first and second wires, respectively. The display panel has a first short-circuit wire that is connected to the first and second wires at a connecting part of the display panel and the wiring-mounted board, so as to short-circuit the first and second wires.Type: ApplicationFiled: June 22, 2009Publication date: December 23, 2010Inventors: Yasuhiro WAKITA, Seiji Muraoka, Hidetaka Mizumaki
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Publication number: 20090044967Abstract: A circuit board, an electronic circuit device, and a display device, in which generation of an edge short-circuit is prevented, includes wirings that are arranged much more densely. A circuit board includes a substrate having a first main surface on which a semiconductor integrated circuit is mounted and a second main surface; a plurality of first wirings including a bump connecting terminal on the first main surface; and a plurality of second wirings on the second main surface, wherein the plurality of the second wirings are arranged independently from each other and overlap with a region where the semiconductor integrated circuit is mounted, and the circuit board includes a wiring portion on the second main surface in a region overlapping with a region where the bump connecting terminal is arranged.Type: ApplicationFiled: March 14, 2007Publication date: February 19, 2009Applicant: SHARP KABUSHIKI KAISHAInventors: Hiroki Nakahama, Seiji Muraoka