Patents by Inventor Seiji OHNISHI

Seiji OHNISHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10172268
    Abstract: A component mounting device includes a mounting head that is movable in a horizontal direction and mounts a held component on a substrate and a control portion that controls the operation of the mounting head. The control portion is configured to perform control of a speed of mounting, by the mounting head, of a component to be located closely adjacent to another component and to be mounted on the substrate such that an interval to an adjacent component is equal to or less than a predetermined threshold, on the substrate. A speed of mounting of the component is less than a speed of mounting in a normal state in which the mounting head mounts a component, which is not the component to be located closely adjacent to another component, on the substrate.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: January 1, 2019
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Seiji Ohnishi, Koichi Izuhara, Hiroyuki Watanabe, Takashi Yoshii
  • Patent number: 9756770
    Abstract: A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding.
    Type: Grant
    Filed: December 24, 2014
    Date of Patent: September 5, 2017
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kazuyoshi Ohyama, Tsutomu Yanagida, Yoshinori Kano, Seiji Ohnishi, Tetsuji Ono
  • Publication number: 20170013750
    Abstract: A component mounting device includes a mounting head that is movable in a horizontal direction and mounts a held component on a substrate and a control portion that controls the operation of the mounting head. The control portion is configured to perform control of a speed of mounting, by the mounting head, of a component to be located closely adjacent to another component and to be mounted on the substrate such that an interval to an adjacent component is equal to or less than a predetermined threshold, on the substrate. A speed of mounting of the component is less than a speed of mounting in a normal state in which the mounting head mounts a component, which is not the component to be located closely adjacent to another component, on the substrate.
    Type: Application
    Filed: September 22, 2016
    Publication date: January 12, 2017
    Applicant: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Seiji OHNISHI, Koichi IZUHARA, Hiroyuki WATANABE, Takashi YOSHII
  • Publication number: 20150143693
    Abstract: A control unit determines whether or not confirmation of a type of a tape processing unit is necessary, and performs identification processing of the type of the tape processing unit when confirmation of the type of the tape processing unit is determined as necessary. Then, this identification processing of the type is performed and the control unit determines whether or not an electronic component handleable by this tape processing unit coincides with an electronic component of a component arrangement number in a feeder base, to perform control for performing an extraction operation for an electronic component in a storage tape with an adsorption nozzle when the electronic component is determined as coinciding.
    Type: Application
    Filed: December 24, 2014
    Publication date: May 28, 2015
    Applicant: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
    Inventors: Kazuyoshi OHYAMA, Tsutomu YANAGIDA, Yoshinori KANO, Seiji OHNISHI, Tetsuji ONO