Patents by Inventor Seiji Satou
Seiji Satou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240161231Abstract: A non-transitory computer-readable recording medium stores instructions causing a computer to execute: acquiring first information indicating a first lesion candidate area in a medical image, and causing a display to display the medical image attached with first display information that is based on the first information. When causing the display to display the medical image attached with the first display information, in a case that the first lesion candidate area or the first display information is not displayed within an image display area of the display, the computer causes the display to display presence information on the first lesion candidate area or the first display information.Type: ApplicationFiled: November 2, 2023Publication date: May 16, 2024Applicant: Konica Minolta, Inc.Inventors: Hidekazu Takahashi, Hisashi Wada, Ken Satou, Seiji Nomura, Ryuta Ogawa
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Publication number: 20230407014Abstract: The present invention relates to improvement of blocking resistance when a water-based dispersion containing polylactic acid as a dispersoid is used as a heat sealant. Provided is an aqueous dispersion obtained by dispersing a dispersoid containing polylactic acid and carnauba wax in a water-based dispersion medium, in which 1 to 14% by mass of the carnauba wax is blended relative to a mass of the polylactic acid.Type: ApplicationFiled: November 5, 2021Publication date: December 21, 2023Inventors: Hiroshi HIRAMATSU, Yuuki KATOU, Seiji SATOU, Yoshiyuki ABE, Shougo KAWAMURA
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Patent number: 9272349Abstract: A numerical control device for a wire electric discharge machining apparatus generates a wire-breakage sign signal, outputs a machining-condition re-setting instruction and wire-breakage threshold re-setting instruction from the wire-breakage sign signal and wire-breakage threshold, sets the wire-breakage threshold according to the wire-breakage threshold re-setting instruction and a wire-breakage signal, calculates a machining energy from a discharge pulse count, measures a machining speed from position information, calculates a board thickness of the workpiece from the machining energy and machining speed, outputs, according to a predetermined algorithm, a machining-condition switching instruction from the board thickness, the machining-condition re-setting instruction, and the wire-breakage signal, sends an oscillation instruction to a oscillator and sends a shaft feed instruction to a servo amplifier so that the machining condition is set to one determined by the machining-condition switching instruction,Type: GrantFiled: January 22, 2010Date of Patent: March 1, 2016Assignee: Mitsubishi Electric CorporationInventors: Yasuo Onodera, Takahiro Shiozawa, Seiji Satou, Yoshikazu Ukai, Hiroatsu Kobayashi
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Publication number: 20130024020Abstract: In order to obtain wire-breakage thresholds and machining conditions for respective board thicknesses in a trial machining, a numerical control device for a wire electric discharge machining apparatus according to the present invention includes a wire-breakage-sign-signal generation means that generates a wire-breakage sign signal from machining state quantities, a wire-breakage sign detection means that outputs a machining-condition re-setting instruction and a wire-breakage threshold re-setting instruction from the wire-breakage sign signal and a wire-breakage threshold, a wire-breakage threshold setting means that sets the wire-breakage threshold according to the wire-breakage threshold re-setting instruction and a wire-breakage signal, a machining energy calculation means that calculates a machining energy from a discharge pulse count, a machining speed measurement means that measures a machining speed from position information, a board thickness calculation means that calculates a board thickness of theType: ApplicationFiled: January 22, 2010Publication date: January 24, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuo Onodera, Takahiro Shiozawa, Seiji Satou, Yoshikazu Ukai, Hiroatsu Kobayashi
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Patent number: 7268314Abstract: A power supply device for electric discharge machining includes a switching circuit that supplies a discharge pulse current to an inter-electrode portion that is a portion between an electrode and a workpiece serving as another electrode arranged to be opposed to the electrode at a predetermined interval; and a pulse-width control unit that generates a control pulse signal of a predetermined pulse width in response to a detection signal for starting a discharge at the inter-electrode portion. The switching circuit includes a switching circuit including a switching element suitable for a high-speed operation and a switching circuit including a switching element suitable for a low-speed operation, and receives the control pulse signal in parallel.Type: GrantFiled: July 12, 2002Date of Patent: September 11, 2007Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Seiji Satou, Hiroyuki Ooguro
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Patent number: 7045735Abstract: Machining electrical power supply device for wire electrical discharge machining. Includes an electrical discharge state distinguishing circuit (6) for distinguishing at least two inter-electrode states, including electrical shorting and normal electrical discharge, between a wire electrode (E) and a workpiece (W), and an inter-electrode current waveform control means for supplying, and for switching between supply of, a triangular wave and a trapezoidal wave current to the electrodes. According to the inter-electrode state distinguished by the electrical discharge state distinguishing circuit (6), in cases where the inter-electrode state is that of electrical shorting (Y1), the inter-electrode current waveform control means supplies a triangular wave current (I) to the electrodes, and in cases where the inter-electrode state is that of normal electrical discharge (Y3), it supplies a trapezoidal wave current (I) to the electrodes.Type: GrantFiled: April 22, 2002Date of Patent: May 16, 2006Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Seiji Satou, Hiroyuki Ooguro, Hisashi Yamada
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Patent number: 7018596Abstract: Accordingly, the invention provides: (1) mesoporous silica characterized by having an average pore diameter in the mesopore region of from 1.5 to 10 nm, a nitrogen adsorption specific surface area determined by the BET method of from 500 to 1400 m2/g, and a monolayer adsorption of water at 25° C. of 1.7 H2O molecules/nm2 specific surface area or more; (2) a process for synthesizing the mesoporous silica characterized by mixing and reacting active silica with a neutral template and removing the neutral template from the thus formed complex; (3) ink absorbents characterized by containing mesoporous silica; (4) ink absorbent slurries composed of the above-described ink absorbent and a solvent; and (5) recording sheets characterized by containing the above-described ink absorbent.Type: GrantFiled: November 19, 1998Date of Patent: March 28, 2006Assignee: Asahi Kasei Kabushiki KaishaInventors: Seiji Satou, Tadashi Shimizu
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Publication number: 20060054600Abstract: A power supply device for electric discharge machining includes a switching circuit that supplies a discharge pulse current to an inter-electrode portion that is a portion between an electrode and a workpiece serving as another electrode arranged to be opposed to the electrode at a predetermined interval; and a pulse-width control unit that generates a control pulse signal of a predetermined pulse width in response to a detection signal for starting a discharge at the inter-electrode portion. The switching circuit includes a switching circuit including a switching element suitable for a high-speed operation and a switching circuit including a switching element suitable for a low-speed operation, and receives the control pulse signal in parallel.Type: ApplicationFiled: July 12, 2002Publication date: March 16, 2006Inventors: Seiji Satou, Hiroyuki Ooguro
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Publication number: 20050126439Abstract: The invention provides: (1) mesoporous silica characterized by having an average pore diameter in the mesopore region of from 1.5 to 10 nm, a nitrogen adsorption specific surface area determined by the BET method of from 500 to 1400 m2/g and a monolayer adsorption of water at 25° C of 1.7/nm2 or more; (2) a process for synthesizing the mesoporous silica characterized by mixing and reacting active silica with a neutral template and removing the neutral template from the thus formed complex; (3) ink absorbents characterized by containing mesoporous silica; (4) ink absorbent slurries composed of the above-described ink absorbent and a solvent; and (5) recording sheets characterized by containing the above-described ink absorbent.Type: ApplicationFiled: November 15, 2004Publication date: June 16, 2005Inventors: Seiji Satou, Tadashi Shimizu
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Publication number: 20050051519Abstract: Machining electrical power supply device for wire electrical discharge machining. Includes an electrical discharge state distinguishing circuit (6) for distinguishing at least two inter-electrode states, including electrical shorting and normal electrical discharge, between a wire electrode (E) and a workpiece (W), and an inter-electrode current waveform control means for supplying, and for switching between supply of, a triangular wave and a trapezoidal wave current to the electrodes. According to the inter-electrode state distinguished by the electrical discharge state distinguishing circuit (6), in cases where the inter-electrode state is that of electrical shorting (Y1), the inter-electrode current waveform control means supplies a triangular wave current (I) to the electrodes, and in cases where the inter-electrode state is that of normal electrical discharge (Y3), it supplies a trapezoidal wave current (I) to the electrodes.Type: ApplicationFiled: April 22, 2002Publication date: March 10, 2005Inventors: Seiji Satou, Hiroyuki Ooguro, Hisashi Yamada
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Publication number: 20050031896Abstract: The present invention provides an amorphous porous inorganic substance having small particle sizes and uniform pores, a process for synthesizing the same, and use of the same. The invention provides an amorphous porous inorganic substance having pores of a uniform pore diameter, which has an average particle size DL of 10 to 400 nm as measured by a dynamic light scattering method and a specific surface area difference, SB-SL, between a conversion specific surface area SL calculated from DL and a nitrogen adsorption specific surface area SB obtained by the BET method, of 250 m2/g or more. A process for synthesizing the same and use of the same are also disclosed.Type: ApplicationFiled: September 10, 2004Publication date: February 10, 2005Inventors: Seiji Satou, Yasuhide Isobe, Kenzo Onizuka
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Patent number: 6808768Abstract: The present invention provides an amorphous porous inorganic substance having small particle sizes and uniform pores, a process for synthesizing the same, and use of the same. The invention provides an amorphous porous inorganic substance having pores of a uniform pore diameter, which has an average particle size DL of 10 to 400 nm as measured by a dynamic light scattering method and a specific surface area difference, SB−SL, between a conversion specific surface area SL calculated from DL and a nitrogen adsorption specific surface area SB obtained by the BET method, of 250 m2/g or more. A process for synthesizing the same and use of the same are also disclosed.Type: GrantFiled: December 26, 2002Date of Patent: October 26, 2004Assignee: Asani Kasei Kabushiki KaishaInventors: Seiji Satou, Yasuhide Isobe, Kenzou Onizuka
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Patent number: 6781080Abstract: A wire electric discharge machine includes storage means for storing threshold value data found from a relation between the normal electric discharge pulse energy and the electric discharge machining energy setting value corresponding to various electric discharge machining conditions; and a controller for controlling the electric discharge machining energy setting value so that the threshold value data can approach an operation point at which wire breakage occurs.Type: GrantFiled: June 13, 2002Date of Patent: August 24, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Tatsushi Sato, Hidetaka Miyake, Seiji Satou, Yoshikazu Ukai
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Patent number: 6756557Abstract: In a power source apparatus for wire electric discharge machining capable of applying voltages of both of positive and opposite polarities to a gap between a wire electrode (1a) and a workpiece (2), there is provided a controller (14) for applying a first voltage pulse to the gap for predetermined time T1 and then applying a second voltage pulse of a polarity opposite to the first voltage pulse for predetermined time T2a necessary for the gap voltage to become a predetermined voltage lower than or equal to a voltage Va capable of starting an electric discharge after a lapse of predetermined time t set for prevention of breakage of a switch. The apparatus is used in machining for performing at least two machining operations selected from machining in machining liquid, machining in mist and machining in gas. Wire electric discharge machining with high reliability suitable for high-accurate machining can be implemented.Type: GrantFiled: June 19, 2002Date of Patent: June 29, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yoshikazu Ukai, Seiji Satou
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Patent number: 6727455Abstract: In an electric discharge machining power supply system that can apply a voltage of both positive and negative polarities between an electrode and a workpiece, there is provided a controller that applies a first voltage pulse between the electrodes for a predetermined time T1, and then applies a second voltage pulse having a polarity opposite to the first voltage pulse for a predetermined time T2a required until the voltage between the electrodes is lowered to a predetermined voltage that is less than an electric discharge starting voltage Va, after a predetermined time t that is set to prevent breakdown of a switching circuit has lapsed. In electric discharge machining using this electric discharge machining power supply system, the stable machining having high machining quality can be accomplished by causing a remaining voltage between the electrodes to fall down quickly and remove.Type: GrantFiled: May 8, 2002Date of Patent: April 27, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yoshikazu Ukai, Seiji Satou
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Patent number: 6713705Abstract: A workpiece is machined by consecutively performing at least two of machining in a machining solution, machining in a mist and machining in a gas, such that at a point of time before the start of machining, except for the machining conducted in the machining solution, and a point of time after the operation of an automatic wire connecting device for conducting an automatic wire connection while the wire electrode is being held by a water column, the machining solution nozzles, can change from supplying the machining solution to supplying the pressurized gas. By the machining solution nozzles, liquid of the machining solution adhering to the workpiece and liquid adhering to the machining solution nozzle which is capable of dripping onto a face to be machined of the workpiece, are removed.Type: GrantFiled: June 4, 2002Date of Patent: March 30, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Seiji Satou, Akihiro Goto
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Patent number: 6686554Abstract: A method of wire electric discharge machining by which an electric discharge is generated in a gap between a wire electrode (1a) and a workpiece (2) so that the workpiece (2) is machined, includes the steps of: a first step in which electric discharge machining is conducted in a dielectric liquid (4a); a second step in which electric discharge machining is conducted in mist (7); and a third step in which electric discharge machining is conducted in gas (8), such that the machining process is changed over when straightness of the workpiece (2) becomes a predetermined value. It is possible to provide a method of wire electric discharge machining, the productivity of which is high, suitable for highly accurate machining.Type: GrantFiled: February 27, 2002Date of Patent: February 3, 2004Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Akihiro Goto, Toshio Moro, Seiji Satou
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Patent number: 6660957Abstract: A power supply apparatus for electric discharge machining is provided with a current loop including a diode, which is supplied with a forward current at the same time a voltage for generating a discharge is output or before it; and a resistor. Supply of forward current to the diode is blocked the moment a discharge is generated. By doing so, a reverse recovery current of the diode is supplied in a gap between an electrode and a workpiece to be machined.Type: GrantFiled: October 11, 2001Date of Patent: December 9, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hiroyuki Ohguro, Seiji Satou, Akihiko Iwata, Akihiro Suzuki
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Patent number: 6639172Abstract: The wire electric discharge machining apparatus includes apparatus or generating a discharge in a gap between a wire electrode (1a) and a machining subject (2) to machine the machining subject. A gas supplying unit (8) supplies a pressurized gas in the gap between the wire electrode and the machining subject. This wire electric discharge machining apparatus has a high productivity, and it is suitable for high-precision machining.Type: GrantFiled: February 4, 2002Date of Patent: October 28, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Akihiro Goto, Toshio Moro, Seiji Satou
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Publication number: 20030143345Abstract: The present invention provides an amorphous porous inorganic substance having small particle sizes and uniform pores, a process for synthesizing the same, and use of the same. The invention provides an amorphous porous inorganic substance having pores of a uniform pore diameter, which has an average particle size DL of 10 to 400 nm as measured by a dynamic light scattering method and a specific surface area difference, SB−SL, between a conversion specific surface area SL calculated from DL and a nitrogen adsorption specific surface area SB obtained by the BET method, of 250 m2/g or more. A process for synthesizing the same and use of the same are also disclosed.Type: ApplicationFiled: December 26, 2002Publication date: July 31, 2003Inventors: Seiji Satou, Yasuhide Isobe, Kenzou Onizuka