Patents by Inventor Seiji Tokii
Seiji Tokii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9955604Abstract: A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.Type: GrantFiled: March 6, 2015Date of Patent: April 24, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Seiji Tokii, Manabu Tasaki
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Patent number: 9331047Abstract: A semiconductor package component (3) is mounted on a substrate (1) in such a manner that an electrode (2) of the substrate (1) and an electrode of the semiconductor package component (3) are brought into contact with each other through a joining material (4). A reinforcing adhesive (5c) is applied between the substrate (1) and the outer surface of the semiconductor package component (3). Then, reflow is performed to melt the joining metal (4) with the reinforcing adhesive (5c) uncured. After the reinforcing adhesive (5c) is cured, the joining metal (4) is solidified.Type: GrantFiled: November 27, 2013Date of Patent: May 3, 2016Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Naomichi Ohashi, Atsushi Yamaguchi, Arata Kishi, Masato Udaka, Seiji Tokii
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Publication number: 20150181740Abstract: A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure 1, a substrate 2 and an electronic component 4 raised on the substrate 2 are joined with bonding metal 3 and a reinforcing resin body 5 is bonded to the substrate 2 and the electronic component 4. The reinforcing resin body 5 includes a plurality of reinforcing resin layers 5a. The reinforcing resin layers 5a constituting the reinforcing resin body 5 are stacked in the height direction of the raised electronic component 4 along a side 4a of the electronic component 4 so as to be raised from the substrate 2.Type: ApplicationFiled: March 6, 2015Publication date: June 25, 2015Inventors: Seiji TOKII, Manabu TASAKI
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Publication number: 20140120663Abstract: A semiconductor package component (3) is mounted on a substrate (1) in such a manner that an electrode (2) of the substrate (1) and an electrode of the semiconductor package component (3) are brought into contact with each other through a joining material (4). A reinforcing adhesive (5c) is applied between the substrate (1) and the outer surface of the semiconductor package component (3). Then, reflow is performed to melt the joining metal (4) with the reinforcing adhesive (5c) uncured. After the reinforcing adhesive (5c) is cured, the joining metal (4) is solidified.Type: ApplicationFiled: November 27, 2013Publication date: May 1, 2014Applicant: PANASONIC CORPORATIONInventors: Naomichi OHASHI, Atsushi YAMAGUCHI, Arata KISHI, Masato UDAKA, Seiji TOKII
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Patent number: 8233288Abstract: An electronic component package includes: an insulating carrier substrate; a connection wiring that is provided on one side of the carrier substrate; an IC chip that is connected to the connection wiring; an external connection land that is disposed on the other side of the carrier substrate and is connected to the connection wiring via a wiring in the carrier substrate; and a solder ball that is disposed on the external connection land. A region of the external connection land that can be bonded to the solder ball has an outer shape that includes at least one arc portion and at least one straight portion. With this configuration, it is possible to provide an electronic component mounted apparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easily inspected, and a method of inspecting a bonding portion therein.Type: GrantFiled: April 22, 2008Date of Patent: July 31, 2012Assignee: Panasonic CorporationInventor: Seiji Tokii
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Patent number: 8218333Abstract: The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGA package as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGA package is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.Type: GrantFiled: March 10, 2009Date of Patent: July 10, 2012Assignee: Panasonic CorporationInventors: Masato Udaka, Seiji Tokii
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Patent number: 8116094Abstract: The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGA package as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGA package is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.Type: GrantFiled: March 10, 2009Date of Patent: February 14, 2012Assignee: Panasonic CorporationInventors: Masato Udaka, Seiji Tokii
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Publication number: 20110108997Abstract: A semiconductor package component (3) is mounted on a substrate (1) in such a manner that an electrode (2) of the substrate (1) and an electrode of the semiconductor package component (3) are brought into contact with each other through a joining material (4). A reinforcing adhesive (5c) is applied between the substrate (1) and the outer surface of the semiconductor package component (3). Then, reflow is performed to melt the joining metal (4) with the reinforcing adhesive (5c) uncured. After the reinforcing adhesive (5c) is cured, the joining metal (4) is solidified.Type: ApplicationFiled: April 19, 2010Publication date: May 12, 2011Applicant: PANASONIC CORPORATIONInventors: Naomichi Ohashi, Atsushi Yamaguchi, Arata Kishi, Masato Udaka, Seiji Tokii
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Publication number: 20100101845Abstract: An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved.Type: ApplicationFiled: October 26, 2009Publication date: April 29, 2010Inventors: Arata Kishi, Naomichi Ohashi, Atsushi Yamaguchi, Seiji Tokii, Masato Udaka
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Publication number: 20090229879Abstract: The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGApackage as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGApackage is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.Type: ApplicationFiled: March 10, 2009Publication date: September 17, 2009Applicant: PANASONIC CORPORATIONInventors: Masato Udaka, Seiji Tokii
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Publication number: 20090227136Abstract: The present invention provides a mounting structure for a surface mounted device capable of reducing sufficiently the stress applied to external joint terminal portions of a surface mounted device due to an impact caused by, for example, dropping a mobile device such as a mobile phone. A mounting structure for a surface mounted device includes: a printed circuit board; a BGA package as a surface mounted device mounted on the printed circuit board; a reinforcing member attached to the printed circuit board astride the BGA package for covering the BGA package; and a pressure pin as a pressure member passing through a top plate of the reinforcing member, being in contact with the top surface of the BGA package, and being fixed to the reinforcing member with solder.Type: ApplicationFiled: March 10, 2009Publication date: September 10, 2009Applicant: Panasonic CorporationInventor: Seiji TOKII
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Publication number: 20080266825Abstract: An electronic component package includes: an insulating carrier substrate; a connection wiring that is provided on one side of the carrier substrate; an IC chip that is connected to the connection wiring; an external connection land that is disposed on the other side of the carrier substrate and is connected to the connection wiring via a wiring in the carrier substrate; and a solder ball that is disposed on the external connection land. A region of the external connection land that can be bonded to the solder ball has an outer shape that includes at least one arc portion and at least one straight portion. With this configuration, it is possible to provide an electronic component mounted apparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easily inspected, and a method of inspecting a bonding portion therein.Type: ApplicationFiled: April 22, 2008Publication date: October 30, 2008Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventor: Seiji TOKII