Patents by Inventor Seiji Yano

Seiji Yano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122295
    Abstract: Footwear includes a shell including an outsole portion; and a sole body including a footbed portion. The footbed portion includes a shock absorbing portion formed of a three-dimensional mesh structure body so as to extend to a peripheral surface of the footbed portion. An engaged portion is disposed in an inner side surface of the outsole portion, and an engaging portion is disposed in a portion of the shock absorbing portion that corresponds to the peripheral surface. One of the engaged portion and the engaging portion is a protruding portion while the other one of the engaged portion and the engaging portion is a cutout portion provided as a recessed portion or a hole portion. An occupied volume ratio of a region including at least a portion defining the engaging portion in the shock absorbing portion is locally increased.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Inventors: Yuka MATSUHISA, Seiji YANO, Kenji HIRATA, Genki HATANO
  • Publication number: 20240122296
    Abstract: Footwear includes a sole portion that supports a foot sole of a foot of a wearer, the sole portion including a ground contact surface and a shock absorbing portion formed of an elastic body. The shock absorbing portion includes a three-dimensional mesh structure portion in which a plurality of unit structures are repeatedly arranged so as to be adjacent to each other and an irregularly shaped portion that has a different shape from each of the unit structures and is at least partially embedded in the three-dimensional mesh structure portion. The irregularly shaped portion includes a protruding plate portion in which a central portion protrudes relative to a peripheral edge portion in a direction orthogonal to the ground contact surface.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Inventors: Yuka MATSUHISA, Seiji YANO, Kenji HIRATA, Genki HATANO
  • Publication number: 20240122297
    Abstract: Footwear includes a footbed portion including a support region. The support region includes an upper surface-side projection portion forming region having a plurality of upper surface-side projection portions. A maximum outer dimension in a cross-section orthogonal to a projecting direction of each of the plurality of upper surface-side projection portions is not greater than 3.0 mm. A projection length of each of the plurality of upper surface-side projection portions is not less than 4.0 mm and not greater than 13.0 mm, and an arrangement density of the plurality of upper surface-side projection portions in the upper surface-side projection portion forming region is not less than 10% and not greater than 100% in terms of an area ratio. An elastic modulus of a material forming the plurality of upper surface-side projection portions is not less than 0.1 MPa and not greater than 100 MPa.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Inventors: Yuka MATSUHISA, Seiji YANO, Kenji HIRATA, Genki HATANO
  • Publication number: 20240081481
    Abstract: An upper includes an upper body covering the instep of a foot. An upper body includes a first layer, a second layer disposed with a gap from the first layer, and a third layer connecting the first layer and the second layer. A part of the upper body is disposed with a low stiffness region having lower stiffness than an adjacent region. At least a part of the low stiffness region has a point in which the third layer is not disposed. A plurality of holes is disposed in at least a part of a portion of the first layer and the second layer of the low stiffness region corresponding to the point in which the third layer is not disposed.
    Type: Application
    Filed: January 21, 2021
    Publication date: March 14, 2024
    Inventors: Chihaya SUZUKI, Seiji YANO, Hiroki NAKAMURA, Satoru ABE, Sho TAKAMASU
  • Publication number: 20240000184
    Abstract: A sole structure of a shoe includes a rearfoot-side concave-shaped portion including a vertex region in a bottom surface of the sole in a rearfoot region. The vertex region is positioned at a highest position within the bottom surface of the sole in the rearfoot region and configured to be positioned at a position corresponding to a center of a heel of a wearer such that center of pressure of the wearer overlaps with the center of the heel.
    Type: Application
    Filed: December 16, 2020
    Publication date: January 4, 2024
    Inventors: Shingo TAKASHIMA, Norihiko TANIGUCHI, Yuya KOZUKA, Genki HATANO, Satoru ABE, Masanori SAKAGUCHI, Hisashi MAEJIMA, Seiji YANO, Takayuki UEDA, Katsunori YAGYU
  • Publication number: 20230346070
    Abstract: A sole of a shoe includes a forefoot support portion R1 that supports a forefoot of a foot of a wearer, a midfoot support portion that supports a midfoot of the foot of the wearer, and a rearfoot support portion that supports a rearfoot of the foot of the wearer, which are connected in order from a front side toward a rear side. A ground contact portion having a portion positioned on a lowermost line connecting a lowermost point of the forefoot support portion and a lowermost point of the rearfoot support portion in a side view is formed in a medial-foot-side region of a bottom surface of the midfoot support portion. A protrusion protruding toward the medial foot side is formed on a medial-foot-side side surface of the midfoot support portion.
    Type: Application
    Filed: April 24, 2023
    Publication date: November 2, 2023
    Applicant: ASICS CORPORATION
    Inventors: Sho TAKAMASU, Seiji YANO, Hiroki NAKAMURA
  • Patent number: 11779081
    Abstract: A shoe is provided with a first forming portion provided on a medial side and a second forming portion provided on a lateral side across a central opening formed forward from a foot insertion portion of an upper on each of which a string passing portion is formed; a first support member a tip end of which is fixed to the second forming portion, including a first string passing structure provided at the tip end, and extending downward so as to abut a medial side of a foot; a second support member a tip end of which is fixed to the first forming portion, including a second string passing structure provided at the tip end, and extending downward so as to abut a lateral side of the foot; and a shoelace which passes through the string passing portion and continuously passes through the first and second string passing structures.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: October 10, 2023
    Assignee: Asics Corporation
    Inventors: Tatsuya Ishikawa, Ayu Bessho, Koji Otobe, Seigo Nakaya, Seiji Yano
  • Publication number: 20230240408
    Abstract: A shoe sole 1 includes a bottom part 20 and a deformation restraining part 30. The bottom part 20 includes: a rear bottom surface part 24 formed to extend from a rearfoot to a midfoot portion and to be, when the shoe sole is placed on a virtual surface S as a flat surface, in contact with the virtual surface S; and a toe portion 26 of which a height from the virtual surface S is set to 100% or greater and 250% or less with respect to a thickness in the rear bottom surface part 24. The deformation restraining part 30 is disposed in an edge part on a medial side and a lateral side of the bottom part 20 and extends from a forefoot to the midfoot portion along the bottom part 20. The deformation restraining part 30 has higher hardness than the bottom part 20.
    Type: Application
    Filed: June 26, 2020
    Publication date: August 3, 2023
    Applicant: ASICS CORPORATION
    Inventors: Masanori SAKAGUCHI, Hiroaki NISHIMURA, Tomoki ISHIZASHI, Kenji HIRATA, Seiji YANO, Seigo NAKAYA
  • Publication number: 20230098661
    Abstract: An upper includes an upper main body that covers an instep of a foot. The upper main body includes: a first portion including a plurality of linear bodies and formed by one layer; and a bag-shaped second portion formed by two layers in which some of the plurality of linear bodies constituting the first portion serve as one layer and the rest of the plurality of linear bodies serves as another layer. Inside the second portion, a cushioning material is put. The second portion protrudes toward a foot of a wearer with respect to the first portion.
    Type: Application
    Filed: September 16, 2022
    Publication date: March 30, 2023
    Applicant: ASICS CORPORATION
    Inventors: Chihaya SUZUKI, Seiji YANO, Hiroki NAKAMURA
  • Publication number: 20230075713
    Abstract: An upper includes an upper main body that covers an instep of a foot. A first region and a second region adjacent to the first region are formed in the upper main body . The upper main body includes: a first linear body provided across the first region and the second region or provided only in the second region; and a second linear body provided in the first region while avoiding the second region and having an end located at a boundary portion between the first region and the second region. The first linear body and the second linear body have mutually different stretchability.
    Type: Application
    Filed: August 25, 2022
    Publication date: March 9, 2023
    Applicant: ASICS CORPORATION
    Inventors: Chihaya SUZUKI, Seiji YANO, Katsunori YAGYU, Yoshiyasu ANDO, Keita OZAWA, Yousuke ATARASHI, Shingo MASUMOTO, Hiroaki NISHIMURA, Kenta TATENO
  • Publication number: 20220312899
    Abstract: A shoe includes: a sole; an upper disposed above the sole and including a wearing opening; a first band including a first base end fixed to a boundary part between the upper and the sole, at a position in front of the wearing opening, the first band extending diagonally upward from the first base end to a position in the rear of the wearing opening of the upper; a second band including a second base end fixed to the boundary part, the second band extending frontward from the second base end to a position in front of the wearing opening, the second band bringing the first band into contact with the upper, at a portion where the second band intersects the first band; and a tightening part applying tightening force to the second band to tighten the upper.
    Type: Application
    Filed: September 27, 2019
    Publication date: October 6, 2022
    Inventors: Kenta TATENO, Hisanori FUJITA, Seiji YANO
  • Publication number: 20220218071
    Abstract: A shoe is provided with a first forming portion provided on a medial side and a second forming portion provided on a lateral side across a central opening formed forward from a foot insertion portion of an upper on each of which a string passing portion is formed; a first support member a tip end of which is fixed to the second forming portion, including a first string passing structure provided at the tip end, and extending downward so as to abut a medial side of a foot; a second support member a tip end of which is fixed to the first forming portion, including a second string passing structure provided at the tip end, and extending downward so as to abut a lateral side of the foot; and a shoelace which passes through the string passing portion and continuously passes through the first and second string passing structures.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Applicant: Asics Corporation
    Inventors: Tatsuya ISHIKAWA, Ayu Bessho, Koji Otobe, Seigo Nakaya, Seiji Yano
  • Publication number: 20220216125
    Abstract: A silicon nitride circuit board includes a silicon nitride substrate, a first copper layer over one surface of the silicon nitride substrate, and a second copper layer over the other surface of the silicon nitride substrate, in which a fracture toughness value Kc of the silicon nitride substrate is equal to or more than 5.0 MPa·m0.5 and equal to or less than 10.0 MPa·m0.5, and when a coefficient of linear expansion of the silicon nitride substrate is ?B (/° C.), a Young's modulus of the silicon nitride substrate is EB (GPa), a coefficient of linear expansion of the first copper layer is ?A (/° C.), and a coefficient of linear expansion of the second copper layer is ?C (/° C.), each of a heat shock parameter HS1 and a heat shock parameter HS2 is equal to or more than 1.30 GPa and equal to or less than 2.30 GPa.
    Type: Application
    Filed: March 26, 2020
    Publication date: July 7, 2022
    Applicant: DENKA COMPANY LIMITED
    Inventors: Seiji YANO, Katsunori TERANO
  • Patent number: 11357289
    Abstract: A shoe is provided with a first forming portion provided on a medial side and a second forming portion provided on a lateral side across a central opening formed forward from a foot insertion portion of an upper on each of which a string passing portion is formed; a first support member a tip end of which is fixed to the second forming portion, including a first string passing structure provided at the tip end, and extending downward so as to abut a medial side of a foot; a second support member a tip end of which is fixed to the first forming portion, including a second string passing structure provided at the tip end, and extending downward so as to abut a lateral side of the foot; and a shoelace which passes through the string passing portion and continuously passes through the first and second string passing structures.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 14, 2022
    Assignee: ASICS CORPORATION
    Inventors: Tatsuya Ishikawa, Ayu Bessho, Koji Otobe, Seigo Nakaya, Seiji Yano
  • Publication number: 20220015499
    Abstract: A shoe sole includes a body portion and a heel holding portion. The heel holding portion is located opposite to a ground contact surface of the body portion and holds a heel portion of a foot at least from a medial foot side. The body portion includes a low hardness portion and a high hardness portion. The high hardness portion is a foam material harder than a foam material of the low hardness portion. The heel holding portion is a resin harder than the foam material of the low hardness portion and the foam material of the high hardness portion. On the medial foot side in a rear foot portion, the low hardness portion is located between the heel holding portion and the high hardness portion in an up-down direction.
    Type: Application
    Filed: June 28, 2021
    Publication date: January 20, 2022
    Inventors: Hiroki NAKAMURA, Keishi KITAMOTO, Yuji TAMAKOSHI, Seiji YANO, Shingo MASUMOTO, Shuhei TAKEMURA, Hiroaki NISHIMURA, Naoki SAKAJO, Seigo NAKAYA, Kazunaga NAKAYAMA
  • Publication number: 20210361028
    Abstract: A shoe 100 includes a twist allowance part 22 and a medial reinforcement member 21 (bend restraining part). The twist allowance part 22 is provided in a medial part of a midfoot portion in a shoe sole 1 serving as a bottom portion and allows medial twisting of the heel side with respect to the toe side. The medial reinforcement member 21 is disposed on the twist allowance part 22 and restrains upward bending of the heel side in the medial part.
    Type: Application
    Filed: December 11, 2018
    Publication date: November 25, 2021
    Inventors: Tatsuya ISHIKAWA, Koji OTOBE, Seiji YANO, Takashi INOMATA, Yasuyuki TAKADA, Tomoichiro OZAKI
  • Publication number: 20210244132
    Abstract: A shoe is provided with a first forming portion provided on a medial side and a second forming portion provided on a lateral side across a central opening formed forward from a foot insertion portion of an upper on each of which a string passing portion is formed; a first support member a tip end of which is fixed to the second forming portion, including a first string passing structure provided at the tip end, and extending downward so as to abut a medial side of a foot; a second support member a tip end of which is fixed to the first forming portion, including a second string passing structure provided at the tip end, and extending downward so as to abut a lateral side of the foot; and a shoelace which passes through the string passing portion and continuously passes through the first and second string passing structures.
    Type: Application
    Filed: March 29, 2019
    Publication date: August 12, 2021
    Applicant: ASICS CORPORATION
    Inventors: Tatsuya ISHIKAWA, Ayu BESSHO, Koji OTOBE, Seigo NAKAYA, Seiji YANO
  • Patent number: 9259054
    Abstract: A low rigidity region being more stretchable and bendable than a high rigidity region, includes a main portion, and a medial first flexible portion and a lateral first flexible portion extending from the main portion in the medial and lateral directions. The main portion covers a portion of the area from the shaft of the first proximal phalanx to the shaft of the second proximal phalanx, the medial first flexible portion covers a portion of the area from the shaft of the first proximal phalanx to the head of the first metatarsal bone, and the lateral first flexible portion extends to the lateral side of the foot from the main portion. When pushing off the foot onto the medial/lateral side in a diagonally forward direction, the upper bends along the diagonal bend lines. Therefore, the diagonal portions and the main portion serve as the bend lines.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: February 16, 2016
    Assignee: ASICS Corporation
    Inventors: Tsuyoshi Nishiwaki, Kouki Matsuo, Kenta Moriyasu, Seiji Yano, Rena Furuishi
  • Patent number: 9066929
    Abstract: The present invention relates to a therapeutic method and a diagnostic method using an antibody that binds to a ganglioside GM2 antigen, and a therapeutic agent and a diagnostic agent comprising as an active ingredient an antibody that binds to a ganglioside GM2 antigen. According to the present invention, the prognosis of GM2 positive mesothelioma patients can be improved by diagnosing and treating GM2 positive mesothelioma patients with a diagnostic agent and a therapeutic agent that comprise an anti-ganglioside GM2 antibody as an active ingredient.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: June 30, 2015
    Assignees: NATIONAL UNIVERSITY CORPORATION KANAZAWA UNIVERSITY, KYOWA HAKKO KIRIN CO., LTD.
    Inventors: Seiji Yano, Yusuke Machino, Yui Suzuki
  • Patent number: D823581
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: July 24, 2018
    Assignee: ASICS CORPORATION
    Inventors: Kenji Umehara, Takayuki Ueda, Seiji Yano, Keishi Kitamoto, Tatsuro Ushiyama, Jun Takei, Yousuke Atarashi, Takuto Ishii