Patents by Inventor Seisaku Imagawa

Seisaku Imagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10263531
    Abstract: A heat dissipation heat sink having a press-fit hole whose inner peripheral surface is a cast skin surface is included; the heat dissipation heat sink is sandwiched by the press-fit head and the insertion guide by aligning the axis of a rectifying element in an insertion guide with the axis of the press-fit hole and making the press-fit head face the heat dissipation heat sink; a protrusion portion of a load receiving jig is made to face the rectifying element in the insertion guide; and the rectifying element is press-fitted into the press-fit hole of the heat dissipation heat sink by pressing the periphery of the press-fit hole of the heat dissipation heat sink (22,23) by the press-fit head and receiving a load applied to the rectifying element by the protrusion portion of the load receiving jig.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: April 16, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tadashi Yokoyama, Atsuya Iwamoto, Seisaku Imagawa, Toshiyuki Oonishi, Yuzuru Kobayashi
  • Publication number: 20190036460
    Abstract: A heat dissipation heat sink having a press-fit hole whose inner peripheral surface is a cast skin surface is included; the heat dissipation heat sink is sandwiched by the press-fit head and the insertion guide by aligning the axis of a rectifying element in an insertion guide with the axis of the press-fit hole and making the press-fit head face the heat dissipation heat sink; a protrusion portion of a load receiving jig is made to face the rectifying element in the insertion guide; and the rectifying element is press-fitted into the press-fit hole of the heat dissipation heat sink by pressing the periphery of the press-fit hole of the heat dissipation heat sink (22,23) by the press-fit head and receiving a load applied to the rectifying element by the protrusion portion of the load receiving jig.
    Type: Application
    Filed: July 26, 2018
    Publication date: January 31, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tadashi YOKOYAMA, Atsuya IWAMOTO, Seisaku IMAGAWA, Toshiyuki OONISHI, Yuzuru KOBAYASHI
  • Patent number: 10069432
    Abstract: A heat dissipation heat sink having a press-fit hole whose inner peripheral surface is a cast skin surface is included; the heat dissipation heat sink is sandwiched by the press-fit head and the insertion guide by aligning the axis of a rectifying element in an insertion guide with the axis of the press-fit hole and making the press-fit head face the heat dissipation heat sink; a protrusion portion of a load receiving jig is made to face the rectifying element in the insertion guide; and the rectifying element is press-fitted into the press-fit hole of the heat dissipation heat sink by pressing the periphery of the press-fit hole of the heat dissipation heat sink (22,23) by the press-fit head and receiving a load applied to the rectifying element by the protrusion portion of the load receiving jig.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: September 4, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tadashi Yokoyama, Atsuya Iwamoto, Seisaku Imagawa, Toshiyuki Oonishi, Yuzuru Kobayashi
  • Publication number: 20150162846
    Abstract: A heat dissipation heat sink having a press-fit hole whose inner peripheral surface is a cast skin surface is included; the heat dissipation heat sink is sandwiched by the press-fit head and the insertion guide by aligning the axis of a rectifying element in an insertion guide with the axis of the press-fit hole and making the press-fit head face the heat dissipation heat sink; a protrusion portion of a load receiving jig is made to face the rectifying element in the insertion guide; and the rectifying element is press-fitted into the press-fit hole of the heat dissipation heat sink by pressing the periphery of the press-fit hole of the heat dissipation heat sink (22,23) by the press-fit head and receiving a load applied to the rectifying element by the protrusion portion of the load receiving jig.
    Type: Application
    Filed: November 27, 2012
    Publication date: June 11, 2015
    Inventors: Tadashi Yokoyama, Atsuya Iwamoto, Seisaku Imagawa, Toshiyuki Oonishi, Yuzuru Kobayashi
  • Publication number: 20140048901
    Abstract: In a rectifier device (2) for full-wave rectifying an output of a vehicle alternating-current generator (1), a schottky barrier diode having a characteristic whose forward voltage drop with respect to a forward current is small and whose reverse leakage current is small, is used as a rectifier semiconductor element (201),(202) constituting the rectifier device (2).
    Type: Application
    Filed: September 26, 2011
    Publication date: February 20, 2014
    Applicant: MITSUBISHI ELECTRIC CORORATION
    Inventor: Seisaku Imagawa