Patents by Inventor Seiya Motomiya

Seiya Motomiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Release sheet with printed layer, pressure sensitive adhesive label having the printed layer, and method of manufacturing the pressure sensitive adhesive label using thermal transfer printing
    Publication number: 20020090482
    Abstract: Disclosed is a release sheet with a printed layer for use with a pressure sensitive adhesive label for indicating information. The release sheet comprises a release sheet base, a releasing agent layer provided on one of the surfaces of the release sheet base, and a printed layer provided on the releasing agent layer. The printed layer has fixed and/or variable information and is formed by means of thermal transfer printing. Further, a pressure sensitive adhesive label for indicating information is also disclosed. The pressure sensitive adhesive label is adapted to be stuck onto the release sheet with the printed layer mentioned above before the pressure sensitive adhesive label is used.
    Type: Application
    Filed: October 23, 2001
    Publication date: July 11, 2002
    Applicant: LINTEC CORPORATION
    Inventor: Seiya Motomiya