Patents by Inventor Seiya Nishimura

Seiya Nishimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030218368
    Abstract: Seat lifting devices disposed between a seat support for supporting a seat cushion and a seat mount for mounting the seat support in order to vertically adjust the seat cushion are taught that comprise a first linking mechanism movably interconnecting the seat support and the seat mount. The first linking mechanism comprises first and second linking arms that are respectively pivotally connected to the seat mount and the seat support via pivot axes. One of the pivot axes of the second linking arm comprises a movable pivot axis that is arranged and constructed to move along the second linking arm and to engage the second linking arm, so that substantial length of the second linking arm can be changed when the movable pivot axis moves along the second linking arm.
    Type: Application
    Filed: May 23, 2003
    Publication date: November 27, 2003
    Inventors: Fumitoshi Akaike, Kazuhisa Tatematsu, Seiichiro Inadome, Seiya Nishimura
  • Patent number: 6651526
    Abstract: A steering wheel is manufactured by making a steering wheel core member by forming a first resin layer about a metal core bar, and then attaching outer parts to the outside of this core member.
    Type: Grant
    Filed: September 5, 2000
    Date of Patent: November 25, 2003
    Assignee: Yamaha Corporation
    Inventors: Tadashi Imaizumi, Seiya Nishimura, Toru Makino
  • Patent number: 5541447
    Abstract: A lead frame for use in producing of a semiconductor integrated circuit comprises a lead frame member, a plurality of leads, a tie bar, a plurality of auxiliary leads, a support-stay portion and a connecting portion. A semiconductor element such as an IC chip is mounted on a semiconductor-element-mounting portion of the lead frame member, while the leads are arranged along and extending from a side portion of the lead frame member. The tie bar is connected among the leads and auxiliary leads at their tip-edge portions. Herein, the auxiliary leads are electrically unconnected from the semiconductor element. Further, the support-stay portion is provided at a corner portion of the lead frame member. The connecting portion is provided between a base-edge portion of the support-stay portion and a base portion of the auxiliary lead. A location of the connecting portion is selected in such a manner than the connecting portion will be unaffected by bending of the leads.
    Type: Grant
    Filed: September 14, 1994
    Date of Patent: July 30, 1996
    Assignee: Yamaha Corporation
    Inventors: Yoshihisa Maejima, Seiya Nishimura, Masayoshi Takabayashi, Tokuyoshi Ohta
  • Patent number: 5498325
    Abstract: An electroplating apparatus carries out an electroplating on a work by using an insoluble anode for keeping the electrolyte clean, and, thereafter, makes up ionized metal into the electrolyte by respectively connecting a soluble anode and the insoluble anode with a positive electrode and a negative electrode, thereby preventing an operator from the make-up work.
    Type: Grant
    Filed: January 13, 1995
    Date of Patent: March 12, 1996
    Assignee: Yamaha Corporation
    Inventors: Seiya Nishimura, Yoshihisa Maejima, Tokuyoshi Ohta
  • Patent number: 5441620
    Abstract: An electroplating apparatus carries out an electroplating on a work by using an insoluble anode for keeping the electrolyte clean, and, thereafter, makes up ionized metal into the electrolyte by respectively connecting a soluble anode and the insoluble anode with a positive electrode and a negative electrode, thereby preventing an operator from the make-up work.
    Type: Grant
    Filed: February 7, 1994
    Date of Patent: August 15, 1995
    Assignee: Yamaha Corporation
    Inventors: Seiya Nishimura, Yoshihisa Maejima, Tokuyoshi Ohta
  • Patent number: 5441194
    Abstract: A thermo-compression tool incorproated in an assembly/disassembly system melts solder films of conductive leads of an electric circuit componet for bonding the conductive leads to pads of a circuit board, and nozzles blow high-temperature nitrogen gas to the conductive leads during the bonding work for preventing the solder films from oxidization.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: August 15, 1995
    Assignee: Yamaha Corporation
    Inventors: Seiya Nishimura, Yoshihisa Maejima, Tokuyoshi Ohta
  • Patent number: 5431801
    Abstract: An electroplating apparatus positively biases an anode with respect to a work dipped in an electrolyte in an electrolysis vessel for depositing metal on the work, and an inert ambience is created over the electrolyte so that the electrolyte is never oxidized.
    Type: Grant
    Filed: February 7, 1994
    Date of Patent: July 11, 1995
    Assignee: Yamaha Corporation
    Inventors: Seiya Nishimura, Yoshihisa Maejima, Tokuyoshi Ohta
  • Patent number: 5347709
    Abstract: A lead frame at least provides a semiconductor-element-mounting portion, plural leads and plural auxiliary leads. The auxiliary leads are arranged to be associated with plural leads, while a tie bar is provided and connected among the leads. According to a method of making the lead frame, an IC-chip mounting process, a wire-bonding process, a sealing process, a resin-cutting process and a dambar-cutting process are sequentially effected on the lead frame. After effecting the dambar-cutting process, a thin-plating process is effected so as to form a thin-plated layer, approximately having a thickness of 5 .mu.m to 15 .mu.m, on the leads. Then, the leads are bent by a predetermined bending process. Thereafter, a thick-plating process is effected so as to form an uniform thick-plated layer, approximately having a thickness of 15 .mu.m to 100 .mu.m, on the leads. After effecting the thick-plating process, a trimming process is effected on the leads.
    Type: Grant
    Filed: June 8, 1993
    Date of Patent: September 20, 1994
    Assignee: Yamaha Corporation
    Inventors: Yoshihisa Maejima, Seiya Nishimura, Masayoshi Takabayashi, Tokuyoshi Ohta
  • Patent number: 4987040
    Abstract: In constructoin of a magnetic recording medium provided with one circular track for magnetic graduations and another circular track for standard marks, the standard marks are accompanied with specified magnetic identification marks so that discrimination between the standard marks can be fairly done without any influence by the number of the standard marks only by reading them out together with the identification marks. The medium is advantageously used for displacement detectors such as magnetic rotary encoders and magnetic linear scales.
    Type: Grant
    Filed: September 13, 1988
    Date of Patent: January 22, 1991
    Assignee: Yamaha Corporation
    Inventors: Kenzaburou Iijima, Yoshinori Hayashi, Seiya Nishimura
  • Patent number: 4983916
    Abstract: In construction of a magnetic encoder used for detection of displacement of a mobile body, a circular magnetized pattern is formed on one longitudinal end face of a magnetic rotary spindle mechanically coupled to the mobile body, and a magnetic sensor faces the magnetized pattern with a prescribed gap. Direct formation of the magnetized pattern on the rotary spindle excludes production errors caused by the conventional coupling process and end-face magnetization assures significant compactness of the entire construction.
    Type: Grant
    Filed: January 25, 1989
    Date of Patent: January 8, 1991
    Assignee: Yamaha Corporation
    Inventors: Kenzaburou Iijima, Yoshinori Hayashi, Seiya Nishimura
  • Patent number: 4851752
    Abstract: In construction of a peripheral-magnetization type magnetic encoder having a rotary spindle and a magnetic head, a resin housing is formed by insert moulding so as to embrace the spindle leaving a slight tubular clearance to allow free axial rotation of the spindle, thereby providing direct, simple and stable support to the rotary spindle for enhanced precision in direction.
    Type: Grant
    Filed: March 15, 1988
    Date of Patent: July 25, 1989
    Assignee: Yamaha Corporation
    Inventors: Seiya Nishimura, Mitsuo Yamaguchi, Kenzaburou Iijima
  • Patent number: 4806860
    Abstract: A magnetoresistive detection head for detecting relative displacement of a magnetic recording medium relative to the detection head includes two sets of magnetoresistive elements which change their respective resistances in response to changes in the intensity of a magnetic field generated by the magnetic recording medium during the relative displacement. The magnetoresistive elements are overlapped and spaced relative to each other by a specified space lag in the direction of the relative displacement. One set of magnetoresistive elements produce a sine output and the other a cosine output. The overlapping and precise spacing of the elements aligns the phases of the signal envelopes of the sine and cosine outputs, reducing reading errors when physical warps appear on the magnetic recording medium.
    Type: Grant
    Filed: June 9, 1987
    Date of Patent: February 21, 1989
    Assignee: Nippon Gakki Seizo Kabushiki Kaisha
    Inventors: Kenzaburou Iijima, Yoshinori Hayashi, Terumoto Nonaka, Katsuyuki Yokoi, Seiya Nishimura
  • Patent number: 4624460
    Abstract: In construction of a golf club head having a fiber reinforced plastic shell, the neck section of the shell provides the first hold and an inward bulge on the sole side section of the shell provides the second hold, both for the club shaft so that presence of a dual hold joint structure enables effectual energy transmission at hitting balls and reliably prevents accidental separation of the club head from the club shaft.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: November 25, 1986
    Assignee: Nippon Gakki Seizo Kabushiki Kaisha
    Inventors: Yoshihiko Murase, Seiya Nishimura, Osamu Tomita
  • Patent number: 4545580
    Abstract: A wood-type golf club head containing a fiber reinforced plastic outer shell formed by heat pressing in a mould, around an intermediate shell. A solid center core is formed inside the intermediate shell by injection of foam synthetic resin for reduced generation of harsh and keen noises at hitting balls, ideal transmission of striking energy to balls and high durability against shocks by hitting balls. The elastic modulus of the outer shell material is greater than that of the intermediate shell material. The buckling strength of the intermediate shell material is greater than that of the foam resin core material.
    Type: Grant
    Filed: February 14, 1984
    Date of Patent: October 8, 1985
    Assignee: Nippon Gakki Seizo Kabushiki Kaisha
    Inventors: Osamu Tomita, Yoshihiko Murase, Seiya Nishimura