Patents by Inventor Seiya Onodera

Seiya Onodera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photocurable/therosetting resin composition, photosensitive dry film formed therefrom and method of forming pattern with the same
    Patent number: 7226710
    Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: June 5, 2007
    Assignees: Kanagawa University, Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Tadatomi Nishikubo, Atsushi Kameyama, Masaki Sasaki, Masatoshi Kusama, Seiya Onodera
  • Photocurable/therosetting resin composition, photosensitive dry film formed therefrom and method of forming pattern with the same
    Publication number: 20050112500
    Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.
    Type: Application
    Filed: November 4, 2004
    Publication date: May 26, 2005
    Inventors: Tadatomi Nishikubo, Atsushi Kameyama, Masaki Sasaki, Masatoshi Kusama, Seiya Onodera
  • Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same
    Patent number: 6844130
    Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: January 18, 2005
    Assignees: Kanagawa University, Taiyo Ink Manufacturing Co., Ltd.
    Inventors: Tadatomi Nishikubo, Atsushi Kameyama, Masaki Sasaki, Masatoshi Kusama, Seiya Onodera
  • Photocurable/thermosetting resin composition, photosensitive dry film formed therefrom, and method of forming pattern with the same
    Publication number: 20040023120
    Abstract: A photocurable and thermosetting resin composition comprising (A) a photosensitive prepolymer having a carboxyl group in combination with at least two ethylenically unsaturated double bonds in its molecule, (B) a polymerization initiator, (C) a diluent, (D) an oxetane compound having at least two oxetanyl groups in its molecule, and (E) a curing promotor is developable with an alkaline solution and can be formulated as a one package preparation. Such a photocurable and thermosetting resin composition and a photosensitive dry film prepared by the use thereof are useful as various resist materials and electrical insulating materials, particularly as solder resists for printed circuit boards, interlaminar insulating materials for build-up multi-layer printed circuit boards, and the like.
    Type: Application
    Filed: September 27, 2002
    Publication date: February 5, 2004
    Inventors: Tadatomi Nishikubo, Atsushi Kameyama, Masaki Sasaki, Masatoshi Kusama, Seiya Onodera