Patents by Inventor Seizo Nemoto

Seizo Nemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow method and reflow device
    Patent number: 6402011
    Abstract: For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.
    Type: Grant
    Filed: August 4, 2000
    Date of Patent: June 11, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiro Taniguchi, Kazumi Ishimoto, Koichi Nagai, Osamu Yamazaki, Tatsuaki Kitagawa, Osamu Matsushima, Kazuhiro Uji, Seizo Nemoto
  • Reflow method and reflow device
    Publication number: 20020053588
    Abstract: For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.
    Type: Application
    Filed: January 4, 2002
    Publication date: May 9, 2002
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Masahiro Taniguchi, Kazumi Ishimoto, Koichi Nagai, Osamu Yamazaki, Tatsuaki Kitagawa, Osamu Matsushima, Kazuhiro Uji, Seizo Nemoto
  • Reflow method and reflow device
    Patent number: 6145734
    Abstract: For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-connected points on said one surface of the printed circuit board. This reflow method permits secure soldering even if the hot air is set at a temperature not exceeding the heat resistance of the electronic components, which is possilbe because of its combination with the radiant heat. Moreover, this reflow method can permit soldering in such a manner that only the to-be-connected points are heated selectively, because the hot air is blown locally and roughly perpendicular to the points to be connected. Thus, this reflow method prevents heat damage to other sections than the to-be-connected points and ensures that the solder at the to-be-connected points is melted.
    Type: Grant
    Filed: April 11, 1997
    Date of Patent: November 14, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiro Taniguchi, Kazumi Ishimoto, Koichi Nagai, Osamu Yamazaki, Tatsuaki Kitagawa, Osamu Matsushima, Kazuhiro Uji, Seizo Nemoto