Patents by Inventor Sen-Hou Ko
Sen-Hou Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9711381Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis disposed parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis.Type: GrantFiled: January 29, 2014Date of Patent: July 18, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Sen-Hou Ko, Lakshmanan Karuppiah
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Patent number: 9646859Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.Type: GrantFiled: April 30, 2010Date of Patent: May 9, 2017Assignee: APPLIED MATERIALS, INC.Inventors: Hui Chen, Allen L. D'Ambra, Sen-Hou Ko, Yufei Chen, Adrian Blank, Mario D. Silvetti, Gerald J. Alonzo, Lakshmanan Karuppiah
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Publication number: 20170040160Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.Type: ApplicationFiled: October 24, 2016Publication date: February 9, 2017Inventors: Hui CHEN, Sen-Hou KO
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Patent number: 9508575Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.Type: GrantFiled: March 5, 2014Date of Patent: November 29, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Hui Chen, Sen-Hou Ko
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Publication number: 20140360976Abstract: A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a method for processing a substrate is described. The method includes transferring a substrate to a tank, positioning the substrate between two cylindrical rollers disposed in the tank, moving each of the two cylindrical rollers into a first position where a processing surface of each of the cylindrical rollers contacts major surfaces of the substrate, processing the substrate by providing relative motion between at least one of the two cylindrical rollers and the substrate, moving each of the two cylindrical rollers to a second position that is spaced apart from the major surfaces of the substrate, the second position including contacting the processing surface with a conditioning device, and transferring the substrate out of the tank while conditioning the processing surface.Type: ApplicationFiled: August 26, 2014Publication date: December 11, 2014Inventors: Sen-Hou KO, Lakshmanan KARUPPIAH
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Publication number: 20140261539Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and space apart relation, the first pad holder rotatable on a second axis rotatable parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance defined between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, wherein the second pad holder is couple with a rotary arm.Type: ApplicationFiled: March 5, 2014Publication date: September 18, 2014Inventors: Hui CHEN, Sen-Hou KO
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Patent number: 8813293Abstract: A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.Type: GrantFiled: May 17, 2013Date of Patent: August 26, 2014Assignee: Applied Materials, Inc.Inventors: Sen-Hou Ko, Lakshmanan Karuppiah
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Publication number: 20140209239Abstract: A method and apparatus for cleaning a substrate after chemical mechanical planarizing (CMP) is provided. The apparatus comprises a housing, a substrate holder rotatable on a first axis and configured to retain a substrate in a substantially vertical orientation, a first pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the first pad holder rotatable on a second axis disposed parallel to the first axis, a first actuator operable to move the pad holder relative to the substrate holder to change a distance between the first axis and the second axis, and a second pad holder disposed in the housing, the second pad holder having a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, the second pad holder rotatable on a third axis parallel to the first axis and the second axis.Type: ApplicationFiled: January 29, 2014Publication date: July 31, 2014Inventors: Sen-Hou Ko, Lakshmanan Karuppiah
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Patent number: 8550879Abstract: Embodiments of the present invention generally provide an improved conditioning module and conditioning disks for improved pressure distribution during the process of conditioning a polishing pad of a chemical mechanical polishing (CMP) system. In one embodiment, a conditioning module comprising multiple, small conditioning disks is provided. In one embodiment, a conditioning disk having a compliant backing member is provided. In one embodiment, the compliant backing member comprises a semi-rigid backing member cut into a spiral shape to provide compliancy. In another embodiment, the compliant backing member comprises a fluid-pressurized, flexible membrane. Each embodiment of the present invention provides an improved pressure distribution across the face of each conditioning disk, resulting in increased disk life as well as increased conditioning rate and uniformity.Type: GrantFiled: October 23, 2008Date of Patent: October 8, 2013Assignee: Applied Materials, Inc.Inventors: Hung Chih Chen, Sen-Hou Ko, Shou-Sung Chang
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Publication number: 20130247314Abstract: A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.Type: ApplicationFiled: May 17, 2013Publication date: September 26, 2013Inventors: Sen-Hou KO, Lakshmanan KARUPPIAH
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Publication number: 20130196572Abstract: A particle cleaning module includes a housing, a substrate holder, a pad holder, an actuator and a pad conditioner. The substrate holder is disposed in the housing, is configured to retain a substrate in a substantially vertical orientation, and is rotatable on a first axis. The pad holder is disposed in the housing, has a pad retaining surface facing the substrate holder in a parallel and spaced apart relation, and is rotatable on a second axis parallel to the first axis. The actuator is operable to move the pad holder relative to the substrate holder to change a distance defined between the pad retaining surface and the substrate. The pad conditioner is disposed in the housing and has a conditioning surface oriented parallel to the pad retaining surface.Type: ApplicationFiled: January 27, 2012Publication date: August 1, 2013Inventors: Sen-Hou Ko, Hui Chen
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Publication number: 20130185884Abstract: A method and apparatus for cleaning a substrate are provided. In one embodiment, a particle cleaning module is provided that includes a substrate holder and a pad holder disposed in a housing, and an actuator operable to move the pad holder relative to the substrate holder. The substrate holder is configured to retain and rotate a substrate in a substantially vertical orientation. The pad holder has a pad retaining surface that faces the substrate holder in a parallel and spaced apart relation. The pad holder is rotatable on an axis parallel to an axis on which the substrate holder rotates. The actuator is operable to move the pad holder relative to the substrate holder as to change a distance defined between the first axis and the second axis.Type: ApplicationFiled: January 24, 2013Publication date: July 25, 2013Inventors: Sen-Hou Ko, Lakshmanan Karuppiah
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Patent number: 8458843Abstract: A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.Type: GrantFiled: October 22, 2009Date of Patent: June 11, 2013Assignee: Applied Materials, Inc.Inventors: Sen-Hou Ko, Lakshmanan Karuppiah
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Patent number: 8142260Abstract: Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.Type: GrantFiled: May 20, 2008Date of Patent: March 27, 2012Assignee: Applied Materials, Inc.Inventors: Eashwer Kollata, Shou-Sung Chang, Zhenhua Zhang, Paul D. Butterfield, Sen-Hou Ko, Antoine P. Manens, Gary C. Ettinger, Ricardo Martinez
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Patent number: 8125654Abstract: Systems, methods and apparatus are provided for determining a substrate polishing endpoint. The invention includes a light source adapted to transmit light to an edge of a substrate; one or more detectors adapted to detect an arrangement of light reflected from the substrate edge; and a controller adapted to determine a polishing endpoint for the substrate edge based on the arrangement of reflected light. Numerous other aspects are provided.Type: GrantFiled: April 16, 2009Date of Patent: February 28, 2012Assignee: Applied Materials, Inc.Inventors: Dominic J. Benvegnu, Boguslaw A. Swedek, Sen-Hou Ko, Abraham Ravid, Paul V. Miller
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Publication number: 20110265816Abstract: Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Hui Chen, Allen L. D'Ambra, Sen-Hou Ko, Yufei Chen, Adrian Blank, Mario D. Silvetti, Gerald J. Alonzo, Lakshmanan Karuppiah
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Patent number: 7993485Abstract: Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.Type: GrantFiled: December 9, 2005Date of Patent: August 9, 2011Assignee: Applied Materials, Inc.Inventors: Erik C. Wasinger, Gary C. Ettinger, Sen-Hou Ko, Wei-Yung Hsu, Liang-Yuh Chen, Ho Seon Shin, Donald Olgado
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Publication number: 20110094537Abstract: A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.Type: ApplicationFiled: October 22, 2009Publication date: April 28, 2011Applicant: APPLIED MATERIALS, INC.Inventors: Sen-Hou Ko, Lakshmanan Karuppiah
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Patent number: 7828626Abstract: Embodiments of an apparatus for conditioning a processing pad are provided. In one embodiment, an apparatus for conditioning a processing pad includes a member having a bottom surface selectively maintained in a non-planar orientation and an abrasive disposed on the bottom surface of the member. The abrasive is configured for conditioning a processing pad. The member and abrasive have a profile that produces a non-planar processing pad surface.Type: GrantFiled: October 9, 2008Date of Patent: November 9, 2010Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Sen-Hou Ko
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Patent number: 7749048Abstract: A method of operating a polishing apparatus in which a substrate is held with a carrier head supported by a movable support of the polishing apparatus, the substrate is brought into contact with a polishing surface at a polishing station of the polishing apparatus and the substrate is polished, the substrate is removed from the polishing surface, the support moves to transfer the carrier head to a different station of the polishing apparatus, and the polishing surface is conditioned. The conditioning overlaps with at least one of removing the substrate or moving the support.Type: GrantFiled: May 4, 2007Date of Patent: July 6, 2010Assignee: Applied Materials, Inc.Inventors: James C. Wang, Hung K. Nguyen, Sen-Hou Ko, Wei-Yung Hsu