Patents by Inventor Sen KANG

Sen KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978676
    Abstract: A device includes a first semiconductor fin extending from a substrate, a second semiconductor fin extending from the substrate, a dielectric fin over the substrate, a first isolation region between the first semiconductor fin and the dielectric fin, and a second isolation region between the first semiconductor fin and the second semiconductor fin. The first semiconductor fin is disposed between the second semiconductor fin and the dielectric fin. The first isolation region has a first concentration of an impurity. The second isolation region has a second concentration of the impurity. The second concentration is less than the first concentration. A top surface of the second isolation region is disposed closer to the substrate than a top surface of the first isolation region.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Szu-Ying Chen, Po-Kang Ho, Sen-Hong Syue, Huicheng Chang, Yee-Chia Yeo
  • Patent number: 11097139
    Abstract: A corrosion prevention process to protect the piping of a dry pipe sprinkler system from corrosion is described. The process includes the selection and application of suitable corrosion inhibitors to interior portions of the piping. The corrosion inhibitors used in this process may include volatile corrosion inhibitors.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: August 24, 2021
    Assignee: Cortec Corporation
    Inventors: Mincheng Shen, Sen Kang, Boris A. Miksic
  • Patent number: 10718059
    Abstract: Nickel electroplating compositions containing cationic polymers of a reaction product of an imidazole compound and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: July 21, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael Lipschutz, Sen Kang
  • Publication number: 20190010625
    Abstract: Nickel electroplating compositions containing cationic polymers of a reaction product of an imidazole compound and a bisepoxide enable the electroplating of nickel deposits which have uniform bright surfaces over wide current density ranges.
    Type: Application
    Filed: May 8, 2018
    Publication date: January 10, 2019
    Inventors: Michael Lipschutz, Sen Kang
  • Patent number: 9943487
    Abstract: One aspect of the invention is a polymer material comprising a capsule coated with PDA. In certain embodiments, the capsule encapsulates a functional agent. The encapsulated functional agent may be an indicating agent, healing agent, protecting agent, pharmaceutical drug, food additive, or a combination thereof.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: April 17, 2018
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Scott R. White, Nancy R. Sottos, Sen Kang, Marta B. Baginska
  • Publication number: 20160346217
    Abstract: One aspect of the invention is a polymer material comprising a capsule coated with PDA. In certain embodiments, the capsule encapsulates a functional agent. The encapsulated functional agent may be an indicating agent, healing agent, protecting agent, pharmaceutical drug, food additive, or a combination thereof.
    Type: Application
    Filed: May 26, 2016
    Publication date: December 1, 2016
    Applicant: The Board of Trustees of the University of Illinois
    Inventors: Scott R. WHITE, Nancy R. SOTTOS, Sen KANG, Marta B. BAGINSKA