Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

Abstract: A land grid array (LGA) socket apparatus includes an LGA socket, with two guide rails provided respectively on the inner sides of two opposite side walls of the socket. The height of the top surface of each guide rail from the socket's bottom is greater than the height of socket terminals from the socket's bottom. The length of each guide rail is smaller than the length of the sidewall's inner side. The guide rails support at least two protrusions provided at corners at opposite sides of an integrated circuit chip assembly when the assembly is slid into the socket from a side. The guide rails, when the assembly is slid to the end of the guide rail, enable the at least two protrusions to fall into the gaps between the ends of the guide rail and the respective socket end walls to install the assembly in the socket.

Abstract: A land grid array (LGA) socket apparatus includes an LGA socket, with two guide rails provided respectively on the inner sides of two opposite side walls of the socket. The height of the top surface of each guide rail from the socket's bottom is greater than the height of socket terminals from the socket's bottom. The length of each guide rail is smaller than the length of the sidewall's inner side. The guide rails support at least two protrusions provided at corners at opposite sides of an integrated circuit chip assembly when the assembly is slid into the socket from a side. The guide rails, when the assembly is slid to the end of the guide rail, enable the at least two protrusions to fall into the gaps between the ends of the guide rail and the respective socket end walls to install the assembly in the socket.