Patents by Inventor Seog-soon Baek

Seog-soon Baek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6676244
    Abstract: A bubble-jet type inkjet printhead is disclosed, wherein a manifold for supplying ink, an ink chamber having a substantially hemispherical shape and filled with ink to be ejected, and an ink channel for supplying ink from the manifold to the ink chamber, are incorporated in a substrate. A nozzle plate having a nozzle, through which ink is ejected at the center of the ink chamber, is formed on the substrate. A heater is provided on the nozzle plate and surrounding the nozzle, and electrodes are provided on the nozzle plate and electrically connected to the heater to supply pulse current to the heater. An anti-wetting coating including a perfluorinated alkene compound on at least a surface around the nozzle is formed on an exposed surface of the printhead. Preferably, the anti-wetting coating is deposited by RF glow discharge and can be removed by O2 plasma.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: January 13, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung-jong Kwon, Yong-soo Oh, Seog Soon Baek
  • Publication number: 20030081069
    Abstract: A monolithic ink-jet printhead, and a method for manufacturing the same, wherein the monolithic ink-jet printhead includes a manifold for supplying ink, an ink chamber having a hemispheric shape, and an ink channel formed monolithically on a substrate; a silicon oxide layer, in which a nozzle for ejecting ink is centrally formed in the ink chamber, is deposited on the substrate; a heater having a ring shape is formed on the silicon oxide layer to surround the nozzle; a MOS integrated circuit is mounted on the substrate to drive the heater and includes a MOSFET and electrodes connected to the heater. The silicon oxide layer, the heater, and the MOS integrated circuit are formed monolithically on the substrate. Additionally, a DLC coating layer having a high hydrophobic property and high durability is formed on an external surface of the printhead.
    Type: Application
    Filed: October 24, 2002
    Publication date: May 1, 2003
    Inventors: Hyeon-Cheol Kim, Yong-Soo Oh, Keon Kuk, Kwang-Joon Yoon, Jae-Sik Min, Sang-Hyun Lee, Chang-Seung Lee, Seog Soon Baek, Sang-Wook Lee, Jong-Cheol Shin
  • Publication number: 20030030697
    Abstract: A bubble-jet type inkjet printhead is disclosed, wherein a manifold for supplying ink, an ink chamber having a substantially hemispherical shape and filled with ink to be ejected, and an ink channel for supplying ink from the manifold to the ink chamber, are incorporated in a substrate. A nozzle plate having a nozzle, through which ink is ejected at the center of the ink chamber, is formed on the substrate. A heater is provided on the nozzle plate and surrounding the nozzle, and electrodes are provided on the nozzle plate and electrically connected to the heater to supply pulse current to the heater. An anti-wetting coating including a perfluorinated alkene compound on at least a surface around the nozzle is formed on an exposed surface of the printhead. Preferably, the anti-wetting coating is deposited by RF glow discharge and can be removed by O2 plasma.
    Type: Application
    Filed: August 9, 2002
    Publication date: February 13, 2003
    Inventors: Myung-jong Kwon, Yong-soo Oh, Seog Soon Baek
  • Patent number: 6481828
    Abstract: An inkjet printhead includes a nozzle plate having a nozzle, a substrate having an ink feed hole, and an intermediate layer interposed between the nozzle plate and the substrate, wherein the intermediate layer includes an ink chamber connected to the ink feed hole and the nozzle and a heating element surrounding the ink chamber. In the present invention, the nozzle, the ink chamber, and the ink feed hole are formed in a straight channel, thereby providing a high density printhead.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: November 19, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seog Soon Baek, Hyeon-cheol Kim, Yong-soo Oh
  • Patent number: 6467348
    Abstract: A microgyroscope with two resonant plates is provided. The microgyroscope includes a substrate; first and second frames provided on the substrate to have a predetermined height, the first and second frames facing each other; a plurality of anchors supporting the first and second frames with respect to the substrate; first and second resonant plates provided between the first and second frames to be separated from each other by a predetermined distance; and a matching link unit connected to the first and second resonant plates so that it links the motion of one resonant plate to the motion of the other resonant plate such that the matching link unit is moved by the motion of one resonant plate in a first direction and then moves the other resonant plate in a second direction opposite to the first direction.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: October 22, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoon Song, Seog-soon Baek, Hyun-cheol Kim, Byeoung Ju Ha, Yong-soo Oh
  • Publication number: 20020075358
    Abstract: An ink-jet printhead includes a nozzle plate having a nozzle, a substrate having an ink feed hole, and an intermediate layer interposed between the nozzle plate and the substrate, wherein the intermediate layer includes an ink chamber connected to the ink feed hole and the nozzle and a heating element surrounding the ink chamber. In the present invention, the nozzle, the ink chamber, and the ink feed hole are formed in a straight channel, thereby providing a high density printhead.
    Type: Application
    Filed: December 7, 2001
    Publication date: June 20, 2002
    Inventors: Seog Soon Baek, Hyeon-Cheol Kim, Yong-Soo Oh
  • Patent number: 6391673
    Abstract: A method of fabricating a micro electromechanical system (MEMS) structure which can be vacuum-packaged at the wafer level is provided. The method includes the steps of forming a multilayered stack including a signal line on a first wafer; bonding a second wafer to the multilayered stack; polishing the first wafer to a predetermined thickness; forming a MEMS structure in a vacuum area of the first wafer and a pad outside the vacuum area, the MEMS structure and the pad being connected to the signal line; forming a structure in a third wafer to have space corresponding to the vacuum area of the MEMS structure; and bonding the third wafer to the polished surface of the first wafer in a vacuum state. For protection of the structure and maintaining a vacuum level required for operation, the fabricated structure is vacuum-packaged at the wafer level, thereby improving the yield of fabrication. In addition, since a special vacuum packaging process is not necessary, the fabrication can be simplified.
    Type: Grant
    Filed: November 1, 2000
    Date of Patent: May 21, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byeoung Ju Ha, Seog-soon Baek, Hyun-cheol Kim, Hoon Song, Yong-soo Oh
  • Patent number: 6242276
    Abstract: A micro inertia sensor fabrication method in which thick silicon bonded to glass is processed at a high sectional ratio, is provided. In this method, silicon is bonded to a glass substrate, the bonded silicon is polished to have a desired thickness, a silicon structure is formed by etching the polished silicon using an RIE method, and the silicon structure is separated from the bottom by selectively etching glass below the silicon structure via grooves in etched silicon. Since the thick silicon bonded to glass is processed at a high sectional ratio, the area and thickness of the silicon to be measured are increased. Also, this method is simple since only one mask is used.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: June 5, 2001
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seog-soon Baek, Byeoung-ju Ha, Young-soo Oh