Patents by Inventor Seok-Heon JUNG

Seok-Heon JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

Resist compound, method of forming pattern using the same, and method of manufacturing semiconductor device using the same

Patent number: 11720022

Abstract: Provided is a resist compound, a method for forming a pattern using the same, and a method for manufacturing a semiconductor device. According to the present disclosure, the compound may be represented by Formula 1.

Type: Grant

Filed: February 12, 2020

Date of Patent: August 8, 2023

Assignee: SAMSUNG ELECTRONICS CO., LTD.

Inventors: Jin-Kyun Lee, Hyun-Taek Oh, Seok-Heon Jung, Jeong-Seok Mun
RESIST COMPOUND, METHOD OF FORMING PATTERN USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Publication number: 20200257200

Abstract: Provided is a resist compound, a method for forming a pattern using the same, and a method for manufacturing a semiconductor device. According to the present disclosure, the compound may be represented by Formula 1.

Type: Application

Filed: February 12, 2020

Publication date: August 13, 2020

Applicant: lnha University Research and Business Foundation

Inventors: Jin-Kyun LEE, Hyun-Taek OH, Seok-Heon JUNG, Jeong-Seok MUN

Resist compound, method of forming pattern using the same, and method of manufacturing semiconductor device using the same

RESIST COMPOUND, METHOD OF FORMING PATTERN USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME