Patents by Inventor Seok Hun YUN

Seok Hun YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11897761
    Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: February 13, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ki Yeul Yang, Kyung Han Ryu, Seok Hun Yun, Bora Baloglu, Hyun Cho, Ramakanth Alapati
  • Publication number: 20230404721
    Abstract: A dental-impression-material electric dispenser includes a main body having a longitudinal mounting portion formed therein. A top-open tray part includes, at the front end thereof, extrusion ports communicate with a mixing tip part communicate with each other. An impression material cartridge, having partitioned a first filling chamber and a second filling chamber, is mounted. The mixing tip part communicates with a pair of extrusion ports formed at the front end of the impression material cartridge, and stirs and discharges a silicone base and a curing agent, each being discharged in a fixed amount through the pair of extrusion ports. An extrusion rod part simultaneously presses a pair of pistons of the impression material cartridge mounted on the tray part through a pair of pressing ends. An electric extrusion part receives starting current from a battery cell and allows the extrusion rod part to advance forward through electrical driving.
    Type: Application
    Filed: June 16, 2021
    Publication date: December 21, 2023
    Inventors: Mun Gyu YUN, Seok Hun YUN
  • Publication number: 20220298008
    Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: June 6, 2022
    Publication date: September 22, 2022
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ki Yeul YANG, Kyung Han RYU, Seok Hun YUN, Bora BALOGLU, Hyun CHO, Ramakanth ALAPATI
  • Patent number: 11352252
    Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: June 7, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Ki Yeul Yang, Kyung Han Ryu, Seok Hun Yun, Bora Baloglu, Hyun Cho, Ramakanth Alapati
  • Publication number: 20200399119
    Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 24, 2020
    Applicants: Amkor Technology Korea, Inc., Amkor Technology Inc.
    Inventors: Ki Yeul YANG, Kyung Han RYU, Seok Hun YUN, Bora BALOGLU, Hyun CHO, Ramakanth ALAPATI