Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).

Abstract: A display device including: a display panel; and a digitizer overlapped by the display panel, wherein the digitizer includes a base layer, a folding area, first circuit patterns disposed on a first surface of the base layer and extending in a first direction, a plurality of first dummy patterns disposed in regions defined by the first circuit patterns, second circuit patterns disposed on a second surface of the base layer and extending in a second direction that intersects the first direction, and a plurality of second dummy patterns disposed in regions defined by the second circuit patterns, the second dummy patterns include a plurality of first lower dummy patterns, which do not overlap the folding area, and a plurality of second lower dummy patterns, which overlap the folding area.

Abstract: The inventive concepts provide a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a treatment space is provided, a support unit supporting a substrate in the process chamber, a gas supply unit supplying a gas into the process chamber, and a plasma source generating plasma from the gas. The support unit includes a support plate on which a substrate is loaded, a focus ring disposed to surround the support plate, an electric field adjusting ring disposed under the focus ring, and an actuator vertically moving the electric field adjusting ring.

Abstract: The inventive concepts provide a substrate treating apparatus. The substrate treating apparatus includes a process chamber in which a treatment space is provided, a support unit supporting a substrate in the process chamber, a gas supply unit supplying a gas into the process chamber, and a plasma source generating plasma from the gas. The support unit includes a support plate on which a substrate is loaded, a focus ring disposed to surround the support plate, an electric field adjusting ring disposed under the focus ring, and an actuator vertically moving the electric field adjusting ring.

Abstract: Example embodiments relate to a memory test system having a semiconductor memory device, a coupling circuit and a tester. The semiconductor memory device may include a plurality of first output nodes and a plurality of second output nodes. The first output nodes may be connected to respective first on-die termination circuits that may not be tested, and the second output nodes may be connected to second on-die termination circuits that may be tested. The semiconductor memory device may be configured to generate test signals of the second on-die termination circuits and to provide the test signals to the second output nodes. The coupling circuit may be configured to connect the first output nodes and the second output nodes to communication channels, respectively. The tester may be configured to test a logic state of the test signals of the communication channels.

Abstract: A semiconductor device, a test system and a method of testing an on die termination (ODT) circuit are disclosed. The semiconductor device includes an ODT circuit, a termination impedance control circuit and a boundary scan circuit. The termination impedance control circuit generates termination impedance control signals in response to a test mode command. The ODT circuit is coupled to the plurality of input/output pads and generates a plurality of termination impedances in response to the impedance control signals. The boundary scan circuit stores the termination impedances to output the stored termination impedances. Thus, the semiconductor device may test an ODT circuit accurately by using a smaller number of pins and may reduce a required time for testing the semiconductor device.

Abstract: Example embodiments relate to a memory test system having a semiconductor memory device, a coupling circuit and a tester. The semiconductor memory device may include a plurality of first output nodes and a plurality of second output nodes. The first output nodes may be connected to respective first on-die termination circuits that may not be tested, and the second output nodes may be connected to second on-die termination circuits that may be tested. The semiconductor memory device may be configured to generate test signals of the second on-die termination circuits and to provide the test signals to the second output nodes. The coupling circuit may be configured to connect the first output nodes and the second output nodes to communication channels, respectively. The tester may be configured to test a logic state of the test signals of the communication channels.

Abstract: An integrated circuit memory device may include a memory cell array, a plurality of data input/output pins, and a plurality of input/output circuits coupled to respective data input/output pins. The input/output circuits may be configured to accept respective data bits being written to the memory cell array from the respective data input/output pins during a write operation, and the input/output circuits may be configured to provide respective data bits being read from the memory cell array to the respective data input/output pins during a read operation. In addition, the input/output circuits may be configured to modify operational characteristics thereof responsive to respective control bits received through the respective data input/output pins during a mode set operation. Related methods and systems are also discussed.

Abstract: A semiconductor device, a test system and a method of testing an on die termination (ODT) circuit are disclosed. The semiconductor device includes an ODT circuit, a termination impedance control circuit and a boundary scan circuit. The termination impedance control circuit generates termination impedance control signals in response to a test mode command. The ODT circuit is coupled to the plurality of input/output pads and generates a plurality of termination impedances in response to the impedance control signals. The boundary scan circuit stores the termination impedances to output the stored termination impedances. Thus, the semiconductor device may test an ODT circuit accurately by using a smaller number of pins and may reduce a required time for testing the semiconductor device.

Abstract: A circuit for testing a semiconductor memory device includes a data comparator and a signal aligner. The data comparator compares a first output data and a second output data provided from an output buffer circuit. The data comparator determines whether logical states of the first output data and the second output data are identical to generate a comparison signal. The signal aligner aligns the first output data and the comparison signal, and generates a plurality of test signals in response to a clock signal. The test signals includes an even bit test data, an odd bit test data, an even bit comparison test data and an odd bit comparison test data. The even bit data and the odd bit data are simultaneously tested by using one pattern, and a correct test result is yielded even when test data are all inverted.

Abstract: An integrated circuit memory device may include a memory cell array, a plurality of data input/output pins, and a plurality of input/output circuits coupled to respective data input/output pins. The input/output circuits may be configured to accept respective data bits being written to the memory cell array from the respective data input/output pins during a write operation, and the input/output circuits may be configured to provide respective data bits being read from the memory cell array to the respective data input/output pins during a read operation. In addition, the input/output circuits may be configured to modify operational characteristics thereof responsive to respective control bits received through the respective data input/output pins during a mode set operation. Related methods and systems are also discussed.

Abstract: An integrated circuit memory device includes a test pattern data generator circuit that is configured to generate an extended test pattern data based on test pattern data provided to the memory device during a test mode of the memory device and is configured to provide the extended test pattern data and the test pattern data during a test mode of the memory device. Related methods are also disclosed.

Abstract: An integrated circuit memory device includes a test pattern data generator circuit that is configured to generate an extended test pattern data based on test pattern data provided to the memory device during a test mode of the memory device and is configured to provide the extended test pattern data and the test pattern data during a test mode of the memory device. Related methods are also disclosed.