Abstract: There is provided a composition for forming a heat shrinkable film capable of providing a heat shrinkable film capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature. The composition for forming a heat shrinkable film includes a polyethylene terephthalate (PET) resin having an inherent viscosity of 0.50 to 1.2 dl/g, and a polyester based copolymer including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

Abstract: The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

Abstract: The present invention relates to a polyester resin composition capable of having an excellent shrinkage rate, being heat-shrunk at a low temperature, and improving adhesion properties, without impairing insulation properties in a state of heat-shrinkable films, and a method for preparing the same. The present polyester resin composition comprises: a copolymerized polyester resin including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexyl methyl 4?-(hydroxymethyl)cyclohexane carboxylate, and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol, an alkali metal compound, and an alkaline earth metal compound, wherein the alkali metal compound and the alkaline earth metal compound are contained in an amount that the content ratio of the alkali metal element/the alkaline earth metal element derived therefrom is 0.01 to 1.

Abstract: This disclosure relates to a thermo-shrinkable polyester film with excellent UV absorbance and heat resistance. According to one embodiment of the invention, provided is a thermo-shrinkable polyester film comprising a first resin layer comprising polyester resin comprising residues of dicarboxylic acid components comprising aromatic dicarboxylic acid, and residues of diol components comprising 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexanecarboxylate, and 4,4-(oxybis(methylene)bis)cyclohexane methanol; and a second resin layer comprising the polyester resin and a UV absorber, formed on at least one side of the first layer.

Abstract: The present invention relates to a multilayer polyester sheet, comprising: a substrate layer including a thermoplastic resin; and a coating layer formed on at least one surface of the substrate layer and contains a polyester resin including a residue of a diol component including 51 mol % to 85 mol % of isosorbide and a residue of a dicarboxylic acid component, and a molded product of the same.

Abstract: Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.

Abstract: There is provided a heat shrinkable film comprising a polyester based copolymer capable of having an excellent shrinkage rate and being heat shrunk at a low temperature. The heat shrinkable film according to an exemplary embodiment of the present invention includes a polyester based copolymer, wherein the polyester based copolymer includes: a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol represented by the following Chemical Formula 2.

Abstract: There is provided a composition for forming a heat shrinkable film capable of providing a heat shrinkable film capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature. The composition for forming a heat shrinkable film includes a polyethylene terephthalate (PET) resin having an inherent viscosity of 0.50 to 1.2 dl/g; and a polyester based copolymer including a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate represented by the following Chemical Formula 1 and a residue derived from 4,4-(oxybis(methylene)bis)cyclohexane methanol represented by the following Chemical Formula 2.

Abstract: There are provided a polyester based copolymer resin capable of having an excellent shrinkage rate and being heat-shrunk at a low temperature, and a molded product comprising the same. The polyester based copolymer resin includes a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid; and a diol-derived residue including a predetermined residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4?-(hydroxymethyl)cyclohexane carboxylate and a predetermined residue derived from 4,4-(oxybis(methylene)bis)cyclohexane methanol.

Abstract: A printed circuit board for a memory card includes an insulating layer; a mounting part on a first surface of the insulating layer, the mounting part being electrically connected to a memory device; and a terminal part on a second surface of the insulating layer, the terminal part being electrically connected to an external electronic appliance, wherein a same metal layer having a same property is formed on exposed surfaces of the mounting part and the terminal part.

Abstract: Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.

Abstract: Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.