Patents by Inventor Seong-cheol Byun

Seong-cheol Byun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7760265
    Abstract: An image sensor shutter module for use in an image sensor outputting image data with scanning line by line and a method for controlling the same are provided. The method for controlling a shutter for use in an image sensor includes: opening electronic shutters for every imaging line; opening mechanical shutter after all of the electronic shutters of every imaging line are opened; closing the mechanical shutter after a predetermined exposure time passes; and sequentially carrying out reading line image data of every imaging line with respect to each imaging line.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: July 20, 2010
    Inventors: Hyung-Suk You, Seong-Cheol Byun
  • Publication number: 20060050172
    Abstract: An image sensor shutter module for use in an image sensor outputting image data with scanning line by line and a method for controlling the same are provided. The method for controlling a shutter for use in an image sensor includes: opening electronic shutters for every imaging line; opening mechanical shutter after all of the electronic shutters of every imaging line are opened; closing the mechanical shutter after a predetermined exposure time passes; and sequentially carrying out reading line image data of every imaging line with respect to each imaging line.
    Type: Application
    Filed: September 8, 2005
    Publication date: March 9, 2006
    Inventors: Hyung-Suk You, Seong-Cheol Byun
  • Patent number: 6670205
    Abstract: Methods of fabricating an image sensor equipped with a lens are disclosed. The disclosed methods can attach a lens directly onto a device without fabricating a separate lens module in a fabrication process of an image sensor device by forming a concave groove on the bottom surface of the lens and coupling the device and the lens by alignment marks after forming a metal convex portion around a pixel array and forming a lens from a mobile material in the final step of device fabrication prior to performing a packaging process.
    Type: Grant
    Filed: February 13, 2003
    Date of Patent: December 30, 2003
    Assignee: Hynix Semiconductor Inc
    Inventor: Seong-cheol Byun