Patents by Inventor Seong-Jun JEONG
Seong-Jun JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240107788Abstract: The present specification relates to a heterocyclic compound represented by Chemical Formula 1 and an organic light emitting device including the same.Type: ApplicationFiled: June 3, 2021Publication date: March 28, 2024Applicant: LT MATERIALS CO., LTD.Inventors: Gi-Back LEE, Seong-Jong PARK, Won-Jang JEONG, Dong-Jun KIM
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Publication number: 20240098880Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: KMW INC.Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Jun Woo YANG
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Publication number: 20240098885Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: KMW INC.Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Duk Yong KIM
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Publication number: 20240088553Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.Type: ApplicationFiled: November 24, 2023Publication date: March 14, 2024Applicant: KMW INC.Inventors: Duk Yong KIM, Bae Mook JEONG, Kyo Sung JI, Chi Back RYU, Won Jun PARK, Jun Woo YANG, Seong Min AHN, Ki Hun PARK, Jae Eun KIM
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Patent number: 11916455Abstract: A busbar unit electrically connected to a motor comprising a stator around which a coil is wound includes: a first terminal including a first body and a first terminal part protruding from an upper portion of the first body and electrically connected to the coil; a first holder configured to support the first terminal such that the first terminal part is exposed to an outside of the busbar unit; and a second holder disposed on an upper portion of the first holder and configured to press the coil against the first terminal part.Type: GrantFiled: April 6, 2023Date of Patent: February 27, 2024Assignee: HYUNDAI MOBIS CO., LTD.Inventors: Yeong Woo Seo, Seong Jun Hwang, Ui Il Jeong, Yul Kyu Son
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Publication number: 20210381132Abstract: Provided is a method of producing a transition metal dichalcogenide fiber. The method of producing a transition metal dichalcogenide fiber according to the present invention includes: spinning a spinning solution containing a transition metal dichalcogenide in a coagulation solution to obtain a transition metal dichalcogenide fiber, wherein the spinning solution has liquid crystallinity by the transition metal dichalcogenide.Type: ApplicationFiled: May 13, 2021Publication date: December 9, 2021Inventors: SangOuk KIM, Taeyeong YUN, Seong-jun JEONG, Hoe Yeon LIM, Simon KIM
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Patent number: 11062818Abstract: Example embodiments relate to a stacking structure having a material layer formed on a graphene layer, and a method of forming the material layer on the graphene layer. In the stacking structure, when the material layer is formed on the graphene layer by using an ALD method, an intermediate layer as a seed layer may be formed on the graphene layer by using a linear type precursor.Type: GrantFiled: January 2, 2015Date of Patent: July 13, 2021Assignees: Samsung Electronics Co., Ltd., SUNGKYUNKWAN UNIVERSITY RESEARCH & BUSINESS FOUNDATIONInventors: Seong-jun Jeong, Seong-jun Park, Hyeon-jin Shin, Yea-hyun Gu, Hyoung-sub Kim, Jae-hyun Yang
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Patent number: 9595361Abstract: A thin film structure includes a metal seed layer, and a method of forming an oxide thin film on a conductive substrate by using the metal seed layer is disclosed. The thin film structure includes a transparent conductive substrate, a metal seed layer that is deposited on the transparent conductive substrate, and a metal oxide layer that is deposited on the metal seed layer.Type: GrantFiled: July 22, 2014Date of Patent: March 14, 2017Assignee: Samsung Electronics Co., Ltd.Inventors: Hyeon-jin Shin, Seong-jun Park, Jae-ho Lee, Seong-Jun Jeong
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Patent number: 9557639Abstract: A method of patterning a block copolymer layer, the method including: providing a substrate with a guide pattern formed on a surface thereof; forming a block copolymer layer on the substrate with the guide pattern, the block copolymer layer including a block copolymer; and directing self-assembly of the block copolymer on the substrate according to the guide pattern to form n/2 discrete domains, wherein the guide pattern includes a block copolymer patterning area having a 90-degree bending portion, and an outer apex and an inner apex of the 90-degree bending portion are each rounded, the outer apex having a first curvature radius r1, and the inner apex having a second curvature radius r2, respectively, and the width of the patterning area W, the first curvature radius r1 and the second curvature radius r2, satisfy Inequation 1: 2 + 2 - ( 1 + 2 ) [ ( n + 2 ) 2 n ? ( n + 1 ) ] 1 3 ? r 1 - r 2 W ? 2 + 2 - ( 1 + 2 ) [ ( n - 2 ) 2 n ? ( n - 1 )Type: GrantFiled: November 13, 2013Date of Patent: January 31, 2017Assignees: SAMSUNG ELECTRONICS CO., LTD., YONSEI UNIVESITY, UNIVERSITY-INDUSTRY FOUNDATION(UIF)Inventors: Mi-Jeong Kim, In Taek Han, June Huh, Seong-Jun Jeong, Haeng Deog Koh, Youn Jung Park
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Publication number: 20150194234Abstract: A thin film structure includes a metal seed layer, and a method of forming an oxide thin film on a conductive substrate by using the metal seed layer is disclosed. The thin film structure includes a transparent conductive substrate, a metal seed layer that is deposited on the transparent conductive substrate, and a metal oxide layer that is deposited on the metal seed layer.Type: ApplicationFiled: July 22, 2014Publication date: July 9, 2015Inventors: Hyeon-jin SHIN, Seong-jun PARK, Jae-ho LEE, Seong-Jun JEONG
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Publication number: 20150194233Abstract: Example embodiments relate to a stacking structure having a material layer formed on a graphene layer, and a method of forming the material layer on the graphene layer. In the stacking structure, when the material layer is formed on the graphene layer by using an ALD method, an intermediate layer as a seed layer may be formed on the graphene layer by using a linear type precursor.Type: ApplicationFiled: January 2, 2015Publication date: July 9, 2015Applicant: Sungkyunkwan University Research & Business FoundationInventors: Seong-jun JEONG, Seong-jun PARK, Hyeon-jin SHIN, Yea-hyun GU, Hyoung-sub KIM, Jae-hyun YANG
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Patent number: 9029271Abstract: A method of patterning a block copolymer layer includes: providing a guide pattern on a surface of a substrate, the guide pattern including sidewalls each elongated in a longitudinal direction and spaced apart from each other, a trench defined by a bottom surface and facing surfaces of the sidewalls, and having a uniform width over an entire length thereof in the longitudinal direction, and a latitudinal wall perpendicular to the longitudinal direction of the trench; providing a block copolymer layer on the surface of the substrate; and annealing the block copolymer to cause self-assembly of the block copolymer and to direct the same in the trench. The block copolymer has a microphase-separation into anisotropic discrete domains aligned with a period ?o in the trench by the annealing.Type: GrantFiled: December 24, 2013Date of Patent: May 12, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Youn Jung Park, Haeng Deog Koh, Mi-Jeong Kim, Seong-Jun Jeong
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Publication number: 20140193614Abstract: A method of patterning a block copolymer layer, the method including: providing a substrate with a guide pattern formed on a surface thereof; forming a block copolymer layer on the substrate with the guide pattern, the block copolymer layer including a block copolymer; and directing self-assembly of the block copolymer on the substrate according to the guide pattern to form n/2 discrete domains, wherein the guide pattern includes a block copolymer patterning area having a 90-degree bending portion, and an outer apex and an inner apex of the 90-degree bending portion are each rounded, the outer apex having a first curvature radius r1and the inner apex having a second curvature radius r2, respectively, and the width of the patterning area W, the first curvature radius r1 and the second curvature radius r2, satisfy Inequation 1: 2 + 2 - ( 1 + 2 ) [ ( n + 2 ) 2 n ? ( n + 1 ) ] 1 3 ? r 1 - r 2 W ? 2 + 2 - ( 1 + 2 ) [ ( n - 2 ) 2 n ? ( n - 1 ) ]Type: ApplicationFiled: November 13, 2013Publication date: July 10, 2014Applicants: Yonsei University, University - Industry Foundation(UIF), SAMSUNG ELECTRONICS CO., LTD.Inventors: Mi-Jeong KIM, In Taek HAN, June HUH, Seong-Jun Jeong, Haeng Deog KOH, Youn Jung PARK
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Publication number: 20140187054Abstract: A method of patterning a block copolymer layer includes: providing a guide pattern on a surface of a substrate, the guide pattern including sidewalls each elongated in a longitudinal direction and spaced apart from each other, a trench defined by a bottom surface and facing surfaces of the sidewalls, and having a uniform width over an entire length thereof in the longitudinal direction, and a latitudinal wall perpendicular to the longitudinal direction of the trench; providing a block copolymer layer on the surface of the substrate; and annealing the block copolymer to cause self-assembly of the block copolymer and to direct the same in the trench. The block copolymer has a microphase-separation into anisotropic discrete domains aligned with a period ?o in the trench by the annealing.Type: ApplicationFiled: December 24, 2013Publication date: July 3, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Youn Jung PARK, Haeng Deog KOH, Mi-Jeong KIM, Seong-Jun JEONG
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Patent number: 8486613Abstract: According to an example embodiment of the present invention, a photoresist pattern is formed on a base substrate including a neutral layer. A sacrifice structure including a first sacrifice block and a second sacrifice block is formed on the base substrate having the photoresist pattern, and the sacrifice structure is formed from a first thin film including a first block copolymer. Thus, a chemical pattern is formed to form a nano-structure. Therefore, the nano-structure may be easily formed on a substrate having a large size by using a block copolymer, and productivity and manufacturing reliability may be improved.Type: GrantFiled: December 11, 2009Date of Patent: July 16, 2013Assignees: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and TechnologyInventors: Sang-Ouk Kim, Seong-Jun Jeong, Su-Mi Lee, Bong-Hoon Kim, Ji-Eun Kim, Jae-Ho You, Moon-Gyu Lee, Seung-Ho Nam
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Publication number: 20100151393Abstract: According to an example embodiment of the present invention, a photoresist pattern is formed on a base substrate including a neutral layer. A sacrifice structure including a first sacrifice block and a second sacrifice block is formed on the base substrate having the photoresist pattern, and the sacrifice structure is formed from a first thin film including a first block copolymer. Thus, a chemical pattern is formed to form a nano-structure. Therefore, the nano-structure may be easily formed on a substrate having a large size by using a block copolymer, and productivity and manufacturing reliability may be improved.Type: ApplicationFiled: December 11, 2009Publication date: June 17, 2010Applicants: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and TechnologyInventors: Sang-Ouk KIM, Seong-Jun JEONG, Su-Mi LEE, Bong-Hoon KIM, Ji-Eun KIM, Jae-Ho YOU, Moon-Gyu LEE, Seung-Ho NAM