Patents by Inventor Seong Ryeol Ryu

Seong Ryeol Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8823036
    Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: September 2, 2014
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Kwan Young Han, Kwang Il Park, Jae Ho Cho, Jung Hoo Seo, Seong Ryeol Ryu
  • Publication number: 20110254045
    Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.
    Type: Application
    Filed: June 28, 2011
    Publication date: October 20, 2011
    Applicant: SEOUL SEMICONDUCTOR CO., LTD.
    Inventors: Kwan Young Han, Kwang Il Park, Jae Ho Cho, Jung Hoo Seo, Seong Ryeol Ryu
  • Patent number: 7994526
    Abstract: There is provided a light emitting diode package having at least two heat sinks. The light emitting diode package includes a main body, at least two lead terminals fixed to the main body, and at least two heat sinks of electrically and thermally conductive materials, the heat sinks being fixed to the main body. The at least two heat sinks are separated from each other. Thus, high luminous power can be obtained mounting a plurality of light emitting diode dies in one LED package. Further, it is possible to embody polychromatic lights mounting LED dies emitting different wavelengths of light each other in the LED package.
    Type: Grant
    Filed: May 14, 2004
    Date of Patent: August 9, 2011
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Kwan Young Han, Kwang Il Park, Jae Ho Cho, Jung Hoo Seo, Seong Ryeol Ryu