Abstract: An integrated circuit packaging system, and a method of manufacture thereof, includes: an integrated circuit; a substrate having a substrate contact; an internal interconnect between the substrate and the integrated circuit, the internal interconnect is a no-reflow connection directly on the substrate contact and the integrated circuit; and an encapsulation over the internal interconnect.

Abstract: A method of manufacture of an integrated circuit packaging system including: heating a support structure having a conductive pad and an organic surface protection layer on the conductive pad; removing the organic surface protection layer from the conductive pad by a plasma process with a two-step method, the two-step method includes a first step with a dioxygen and a second step with a dihydrogen, wherein the second step immediately follows the first step; and forming an underfill over the conductive pad.

Abstract: A heating apparatus includes a ceramic heater including a plurality of ceramic plates having a plate shape, and a housing including an inlet hole and an outlet hole, the housing in which the ceramic heater is installed. The ceramic plates are disposed vertically in the housing in a parallel manner and the outlet hole is disposed in an upper portion of the housing, such that when a fluid flows through a flow path formed along the ceramic plates, bubbles, generated by the fluid heated by the ceramic plates, ascend toward edges of the ceramic plates.

Abstract: There are provided a method and system for testing software for an industrial machine with continuous test values reflecting actual environmental factors, using a simulator before the software for the industrial machine is embedded into an actual industrial machine. A method for testing software for an industrial machine, the method comprising the steps of: coding a program for a diagram through which the industrial machine is driven; compiling the program into an instruction with which the industrial machine is driven; downloading the compiled program onto a simulator for implementing a programming interface provided by the industrial machine; executing the compiled program in the simulator: generating a first data for testing the compiled program: transmitting the first test data to the simulator having the downloaded program from a testing tool; and outputting a result data obtained after executing the program having the transmitted first test data and then transmitting the result data to the testing tool.

Abstract: A heating apparatus includes a ceramic heater including a plurality of ceramic plates having a plate shape, and a housing including an inlet hole and an outlet hole, the housing in which the ceramic heater is installed. The ceramic plates are disposed vertically in the housing in a parallel manner and the outlet hole is disposed in an upper portion of the housing, such that when a fluid flows through a flow path formed along the ceramic plates, bubbles, generated by the fluid heated by the ceramic plates, ascend toward edges of the ceramic plates.

Abstract: Disclosed is a structural alloy with oxidation resistance for electrolytic reduction equipment for treatment of spent nuclear fuel. More particularly, the present invention relates to a structural alloy with oxidation resistance for electrolytic reduction equipment for treatment of spent nuclear fuel wherein Cr, Si, Al, Nb and Ti are added to a Ni-based substrate so as to form an oxide coating film which is stable in a LiCl—Li2O molten salt and, in addition, a process thereof and use of the same.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a connection post to the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; and forming a package body on the substrate, the connection post, and the integrated circuit die.

Abstract: A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.

Abstract: There are provided a method and system for testing software for an industrial machine with continuous test values reflecting actual environmental factors, using a simulator before the software for the industrial machine is embedded into an actual industrial machine. A method for testing software for an industrial machine, the method comprising the steps of: coding a program for a diagram through which the industrial machine is driven; compiling the program into an instruction with which the industrial machine is driven; downloading the compiled program onto a simulator for implementing a programming interface provided by the industrial machine; executing the compiled program in the simulator: generating a first data for testing the compiled program: transmitting the first test data to the simulator having the downloaded program from a testing tool; and outputting a result data obtained after executing the program having the transmitted first test data and then transmitting the result data to the testing tool.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a base package substrate; mounting a flip chip integrated circuit die on the base package substrate; applying a flip chip protective layer on the flip chip integrated circuit die including covering only a back side of the flip chip integrated circuit die; and mounting an upper package on the base package substrate including positioning an upper package substrate adjacent to the flip chip protective layer.

Abstract: Disclosed is a structural alloy with oxidation resistance for electrolytic reduction equipment for treatment of spent nuclear fuel. More particularly, the present invention relates to a structural alloy with oxidation resistance for electrolytic reduction equipment for treatment of spent nuclear fuel wherein Cr, Si, Al, Nb and Ti are added to a Ni-based substrate so as to form an oxide coating film which is stable in a LiCl—Li2O molten salt and, in addition, a process thereof and use of the same.

Abstract: Provided are an apparatus and method for manufacturing a solidified salt that is easy to treat in size and shape by using a vacuum transfer and a dual vessel. In the apparatus for quantitative solidification of a molten salt, a molten salt is introduced into a first vessel, and a second vessel is disposed inside the first vessel and quantitatively supplied with the molten salt. A molten-salt transferring unit quantitatively transfers the molten salt from the first vessel to the second vessel by vacuum pressure. A valve controls a discharge of the molten salt from the second vessel. A mold receives the molten salt from the second vessel and solidifies the molten salt. Accordingly, the molten salt can be stably discharged to the mold by quantitatively transferring the molten salt at vacuum pressure within the dual vessel, and a predetermined size and shape of the solidified salt can be manufactured, thereby processing and collecting the solidified salt safely.

Abstract: Disclosed herein is a continuous electrolytic refining device for metal uranium, the device comprising a cathode section fixed to the lower side of the heat radiation plate, and having a plurality of graphite cathodes; an anode section encompassing the cathode section to face the cathode section, rotatably fixed to the lower side of the heat radiation plate, and receiving the used nuclear fuel; an electrolytic cell receiving the cathode section and the anode section and filled with electrolytes so as to sink the cathode section and the anode section; an uranium collecting section collecting metal uranium deposited on and detached from the graphite cathode in the lower side of the cathode section inside the electrolytic cell and withdrawing the collected metal uranium to the outside of the electrolytic cell; and a transition metal collecting section coupled with the lower side of the electrolytic cell to withdraw the transition metal particles released from the anode section and collected in the lower side of

Abstract: A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.

Abstract: Disclosed relates to a method for preparing tantalum or niobium powders used for manufacturing capacitors in an electrolytic reducing reactor including an anode, a cathode and a molten salt, the method comprising: obtaining a tantalum or niobium oxide, expressed by Ta2O(5-y) or Nb2O(5-y) where y=2.5 to 4.

Abstract: Provided are an apparatus and method for manufacturing a solidified salt that is easy to treat in size and shape by using a vacuum transfer and a dual vessel. In the apparatus for quantitative solidification of a molten salt, a molten salt is introduced into a first vessel, and a second vessel is disposed inside the first vessel and quantitatively supplied with the molten salt. A molten-salt transferring unit quantitatively transfers the molten salt from the first vessel to the second vessel by vacuum pressure. A valve controls a discharge of the molten salt from the second vessel. A mold receives the molten salt from the second vessel and solidifies the molten salt. Accordingly, the molten salt can be stably discharged to the mold by quantitatively transferring the molten salt at vacuum pressure within the dual vessel, and a predetermined size and shape of the solidified salt can be manufactured, thereby processing and collecting the solidified salt safely.

Abstract: Disclosed are a method of reducing spent oxides nuclear fuel to nuclear-fuel metal, in which metal oxides are reduced to metals using an electrochemical reduction device with LiCl—Li2O salt as an electrolyte, a cathode electrode assembly used in the method, and a reduction device including the cathode electrode assembly. The method is advantageous in that the process of reducing the spent oxide nuclear fuel to the nuclear-fuel metal and another process of recovering Li are united to simplify the whole processes, direct use of high oxidative Li metals is excluded to secure safety, and conversion efficiency of the spent oxide nuclear fuel is 99% or more.

Abstract: Disclosed is a device for metallizing uranium oxide and recovering uranium, which reacts uranium oxide with a lithium metal to product uranium metal powder, and filters the resulting product using a porous filter to separate the uranium metal powder from lithium chloride molten liquid to recover the uranium metal powder. The device includes a heating furnace including at least one first heating unit, and a reactor includes a reaction vessel having a discharging valve hole located at the center of a bottom thereof and a conical bottom tapered to the discharging valve hole, a sealing lid for sealing the reaction vessel airtight, an argon gas inlet port for feeding argon gas into the reactor therethrough, and an argon gas outlet port for venting argon gas from the reactor therethrough. A valve assembly controls the discharging valve hole of the reaction vessel, and a plurality of agitators mix a mixture in the reactor.

Abstract: Disclosed is a device for metallizing uranium oxide and recovering uranium, which reacts uranium oxide with a lithium metal to product uranium metal powder, and filters the resulting product using a porous filter to separate the uranium metal powder from lithium chloride molten liquid to recover the uranium metal powder. The device includes a heating furnace including at least one first heating unit, and a reactor includes a reaction vessel having a discharging valve hole located at the center of a bottom thereof and a conical bottom tapered to the discharging valve hole, a sealing lid for sealing the reaction vessel airtight, an argon gas inlet port for feeding argon gas into the reactor therethrough, and an argon gas outlet port for venting argon gas from the reactor therethrough. A valve assembly controls the discharging valve hole of the reaction vessel, and a plurality of agitators mix a mixture in the reactor.

Abstract: Disclosed are a method and an apparatus for continuously casting a uranium rod so that impurities generated in melting the metallic substance reduced from nuclear spent fuel are easily removed, the molten metal is easily degassed, the oxidation of uranium is prevented, and the molten metal does not remain in a crucible, thereby completely removing the noxious gas, improving the safety of work, allowing the workers to be close to the apparatus, reducing the consumption rate of the inert gas, completely preventing the oxidation of uranium, and being remotely controlled.