Patents by Inventor Seong Hyun Kim
Seong Hyun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11983374Abstract: A touch sensor may include a substrate and may include electrode units, first demultiplexers, second demultiplexers, and driving pads all located on the substrate. The electrode units each may include a plurality of electrode groups, the electrode groups each including a plurality of touch electrodes. The first demultiplexers each may include a plurality of sub-demultiplexers and each may be electrically connected to a corresponding one of the electrode units. Each of the sub-demultiplexers of a first demultiplexer may be electrically connected to a corresponding one of the electrode groups of a corresponding electrode unit. The second demultiplexers may be connected between the first demultiplexers and the driving pads.Type: GrantFiled: May 1, 2023Date of Patent: May 14, 2024Assignee: Samsung Display Co., Ltd.Inventors: Hwa Jeong Kim, Jae Sic Lee, Na Yun Kwak, Dong Hwan Kim, Seung Woo Sung, Min Kyu Woo, Min Ku Lee, Seong Jun Lee, Sang Jin Pak, Sang Hyun Jun
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Publication number: 20240153198Abstract: The present invention relates to a method and apparatus for filling a blank area of MPI view plane based on a pixel ray path. A method for generating multi plane image (MPI) data according to an embodiment of the present disclosure may comprise: calculating a pixel value according to each view for each photographed object, based on a plurality of input images photographed from a plurality of views; generating a view plane at a specific point by recording the calculated pixel value on one MPI layer determined based on the spatial position of the corresponding photographed object among a plurality of MPI layers; and generating MPI data by additionally recording the pixel value for the view.Type: ApplicationFiled: October 10, 2023Publication date: May 9, 2024Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Seong Jun BAE, Jung Won KANG, Soo Woong KIM, Ji Hoon DO, Gun BANG, Jin Ho LEE, Ha Hyun LEE
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Patent number: 11980095Abstract: A heat converter according to one embodiment of the present invention comprises: a plurality of unit modules respectively arranged in a first direction and a second direction that intersects the first direction; and a frame, which supports the plurality of unit modules, allows cooling water to flow in through one surface arranged in the first direction, and allows the cooling water to be discharged through the other surface arranged in the first direction, wherein each unit module includes: a cooling water passage chamber having first and second surfaces arranged to be spaced in the first direction, third and fourth surfaces arranged to be spaced in a third direction that intersects the first direction and the second direction, a fifth surface arranged to be spaced in the second direction such that cooing water flows therein, and a sixth surface from which cooling water is discharged; a first thermoelectric module arranged on the first surface; and a second thermoelectric module arranged on the second surfaceType: GrantFiled: April 4, 2019Date of Patent: May 7, 2024Assignee: LG INNOTEK CO., LTD.Inventors: Seong Jae Jeon, Un Hak Lee, Jong Hyun Kang, Young Sam Yoo, Tae Woong Kim
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Patent number: 11978911Abstract: The present invention relates to a three-dimensional structure electrode, a method for manufacturing same, and an electrochemical element including the electrode. The present invention is characterized by comprising: (a) an upper conductive layer and a lower conductive layer which have a structure constituting an assembly within which a conductive material and a porous nonwoven fabric including a plurality of polymeric fibers are three-dimensionally connected in an irregular and continuous manner, thereby forming a mutually connected porous structure; and (b) an active material layer forming the same assembly structure as the conductive layers and forming a three-dimensionally filled structure in which electrode active material particles are uniformly filled inside the mutually connected porous structure formed in the assembly structure, wherein the active material layer is formed between the upper conductive layer and the lower conductive layer.Type: GrantFiled: September 28, 2022Date of Patent: May 7, 2024Assignees: UNIST (Ulsan National Institute of Science and Technology), LG Energy Solution, Ltd.Inventors: In Sung Uhm, Sang Young Lee, Yo Han Kwon, Ju Myung Kim, Joon Won Lim, Jae Hyun Lee, Je Young Kim, Seong Hyeok Kim
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Publication number: 20240140368Abstract: Provided are a vehicle sensor cleaning apparatus and a control method thereof. The vehicle sensor cleaning apparatus includes a liquid sprayer configured to spray washer fluid on at least one sensor arranged in a vehicle, an air sprayer configured to spray air on the at least one sensor, a liquid controller configured to control washer fluid spraying of the liquid sprayer, and an air controller configured to control air spraying of the air sprayer.Type: ApplicationFiled: October 25, 2023Publication date: May 2, 2024Applicants: DY AUTO Corporation, DY-ESSYS Corp.Inventors: Jong Wook Lee, Sin Won Kang, Seong Jun Kim, Kyung Seon Min, Gyu Seon Lee, Jong Hyun Jin, Min Wook Park, Je Min Mun, Sun Ju Kim, Ki Chan Lee
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Publication number: 20240144578Abstract: Disclosed herein is a method for generating a texture map of a 3D mesh includes encoding a texture map of a 3D mesh, quantizing the encoded texture map, decoding the quantized texture map, performing rendering using the decoded texture map, and updating the texture map of the 3D mesh based on the value of a loss function.Type: ApplicationFiled: February 24, 2023Publication date: May 2, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Soo-Woong KIM, Jung-Won KANG, Ji-Hoon DO, Gun BANG, Seong-Jun BAE, Jin-Ho LEE, Ha-Hyun LEE
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Publication number: 20240141118Abstract: A surface-treated inorganic nanoparticle includes a core including Mania (TiO2); a shell surrounding the core, and including zirconia(ZrO2); and a dispersant including a phosphate functional group, and connected to the shell,Type: ApplicationFiled: February 7, 2023Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seong Chan PARK, Chang Hyun YOON, Jung Hyun LEE, Eun Jung LIM, Young O KIM
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Patent number: 11970672Abstract: A semiconductor wafer cleaning composition for used in a semiconductor device manufacturing process and a method of cleaning a semiconductor wafer using the cleaning composition are provided. The cleaning composition includes surfactants represented by Formula 1 and Formula 2, respectively, an organic or inorganic acid, and water occupying for the remaining proportion. The cleaning method is a method of immersing a semiconductor wafer in the cleaning composition for 100 to 500 seconds. The cleaning composition and the cleaning method according to the present disclosure provide an incredibility improved removal rate and an effective cleaning power for contaminants, especially organic wax, during a process of polishing the surface of a wafer used to manufacture semiconductor devices, thereby providing a super-cleaned wafer surface, resulting in production of reliable semiconductor devices.Type: GrantFiled: February 10, 2020Date of Patent: April 30, 2024Assignee: YOUNG CHANG CHEMICAL CO., LTDInventors: Seung Hun Lee, Seung Hyun Lee, Seong Hwan Kim, Seung Oh Jin
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Patent number: 11973209Abstract: A positive electrode active material for a secondary battery includes a lithium composite transition metal oxide including nickel (Ni), cobalt (Co), and manganese (Mn), wherein the lithium composite transition metal oxide has a layered crystal structure of space group R3m, includes the nickel (Ni) in an amount of 60 mol % or less based on a total amount of transition metals, includes the cobalt (Co) in an amount greater than an amount of the manganese (Mn), and is composed of single particles.Type: GrantFiled: June 7, 2019Date of Patent: April 30, 2024Assignee: LG Chem, Ltd.Inventors: Eun Hee Lee, Seong Bae Kim, Young Su Park, Yi Rang Lim, Hong Kyu Park, Song Yi Yang, Byung Hyun Hwang, Woo Hyun Kim
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Publication number: 20240136187Abstract: One embodiment of the present invention provides a method of manufacturing an electronic device using a cyclic doping process including i) an operation of forming a unit transfer thin film including a two-dimensional material on a transfer substrate, ii) an operation of doping the unit transfer thin film in a low-damage doping process, iii) an operation of transferring the unit transfer thin film doped according to the operation ii) on a transfer target substrate, and iv) an operation of repeatedly performing the operations i) to iii) several times to reach a target thickness.Type: ApplicationFiled: October 19, 2023Publication date: April 25, 2024Applicant: Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Geun Young YEOM, Ki Hyun KIM, Ji Eun KANG, Seong Jae YU, You Jin JI, Doo San KIM, Hyun Woo TAK, Yun Jong JANG, Hee Ju KIM, Ki Seok KIM
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Publication number: 20240130638Abstract: Disclosed is a mechanochromic array patch that implements, as a color change, a strain applied to a skin surface due to musculoskeletal movement. The mechanochromic array patch may include stretchable mechanochromic color-changing parts, a polymer connection part that connects the mechanochromic color-changing parts, and a water-insoluble support part. The polymer connection part may have a higher elastic modulus compared to the mechanochromic color-changing parts.Type: ApplicationFiled: October 12, 2023Publication date: April 25, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: JAE JOON KIM, Chan Woo PARK, Seong Hyun KIM, Sujung KIM, Bock Soon NA, Jeho NA, Su Jae LEE
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Publication number: 20240125908Abstract: A method for manufacturing a LiDAR device is proposed. The method may include providing a LiDAR module including a laser emitting module and a laser detecting module to a target region. The method may also include adjusting, on the basis of first detecting data obtained from the laser detecting module, a relative position of a detecting optic module with respect to the laser detecting module. The method may further include adjusting, on the basis of image data obtained from at least one image sensor, a relative position of an emitting optic module with respect to the laser emitting module.Type: ApplicationFiled: December 21, 2023Publication date: April 18, 2024Inventors: Chan M LIM, Dong Kyu KIM, Chang Mo JEONG, Hoon Il JEONG, Eunsung KWON, Junhyun JO, Bumsik WON, Suwoo NOH, Sang Shin BAE, Seong Min YUN, Jong Hyun YIM
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Publication number: 20240128136Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.Type: ApplicationFiled: February 16, 2023Publication date: April 18, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
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Patent number: 11959819Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.Type: GrantFiled: May 11, 2021Date of Patent: April 16, 2024Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Su Jae Lee, Seong Hyun Kim, Chan Woo Park, Jae Bon Koo, Bock Soon Na, Ji-Young Oh
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Publication number: 20240118071Abstract: A strain sensor may have a conductive elastic yarn including a first fiber having a predetermined length and a shape of a fiber yarn and a second fiber having electrical conductivity and a sheet shape. The strain sensor may have a pair of wiring members electrically connected to both ends of the conductive elastic yarn. The conductive elastic yarn, with the second fiber wrapped around the first fiber, is twisted in a coil shape.Type: ApplicationFiled: February 1, 2023Publication date: April 11, 2024Inventors: Mi Yong Lee, Seong Hyun Son, Moon Young Jung, Jun Ho Song, Jong Seo Kim, Woo Chang Jeong, Gwan Mu Lee, Dong Seok Suh, Feng Wang
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Publication number: 20240116361Abstract: An electronic pedal apparatus includes a pad that rectilinearly moves and rotates along a pad guide while being kept in line contact with the pad guide including a shape of an arc when a driver operates the pad, an acceleration signal or a braking signal for a vehicle is generated by operation of the single pad, and a movement direction of the pad at the time of generating the acceleration signal is different from a movement direction of the pad at the time of generating the braking signal.Type: ApplicationFiled: March 6, 2023Publication date: April 11, 2024Applicants: Hyundai Motor Company, Kia Corporation, Dong Hee Industrial Co, Ltd.Inventors: Eun Sik KIM, Wi Sang PARK, Jae Hyun CHO, Jung Min LEE, Seong Ju JO
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Patent number: 11953930Abstract: An embodiment electronic pedal apparatus includes a pedal housing and an accelerator pedal assembly and a brake pedal assembly coupled to the pedal housing and configured to move along different movement trajectories when the accelerator pedal assembly and the brake pedal assembly are operated. In an embodiment, the accelerator pedal assembly is compressed and moved upward when the accelerator pedal assembly is operated, and the brake pedal assembly is compressed and moved downward when the brake pedal assembly is operated.Type: GrantFiled: October 20, 2022Date of Patent: April 9, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, DONG HEE INDUSTRIAL CO., LTD.Inventors: Eun Sik Kim, Wi Sang Park, Jae Hyun Cho, Jung Min Lee, Seong Ju Jo
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Publication number: 20240112948Abstract: A manufacturing method for a semiconductor device, includes: forming a first gate structure and a second gate structure on a substrate; forming a deep trench isolation (DTI) hard mask on the first and second gate structures; forming a deep trench isolation disposed between the first gate structure and the second gate structure; depositing a first undoped oxide layer in the deep trench isolation; performing a first etch-back process on the first undoped oxide layer to remove a portion of the undoped oxide layer; depositing a first deep trench isolation (DTI) gap-fill layer on a remaining portion of the undoped oxide layer, and performing a second etch-back process on the first DTI gap-fill layer; depositing a second DTI gap-fill layer to seal the deep trench isolation, and forming a planarized second DTI gap-fill layer by a planarization process; and depositing a second undoped layer on the planarized second DTI gap-fill layer.Type: ApplicationFiled: February 28, 2023Publication date: April 4, 2024Applicant: KEY FOUNDRY CO., LTD.Inventors: Kwang Il KIM, Yang Beom KANG, Sang Min HAN, Seong Hyun KIM
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Patent number: 11939580Abstract: A self-circularization RNA construct that can be expressed in a DNA vector and simultaneously circularized through a self-targeting and splicing reaction to form a circRNA is disclosed. The circRNA can consist only of a gene of interest which can be a coding, non-coding, or a combination thereof. The gene of interest has the advantage of being able to rapidly express a peptide or protein. The formed circRNA has a circular structure and has a stable and high half-life because 5? and 3? ends are not exposed. Accordingly, functional RNA such as miRNA, anti-miRNA, siRNA, shRNA, aptamer, functional RNA for gene/RNA editing, ADAR (adenosine deaminase acting on the RNA)-recruiting RNA, mRNA vaccine, mRNA therapeutic agent, vaccine adjuvant, and CAR-T mRNA can be produced as a stable circRNA in cells.Type: GrantFiled: October 12, 2022Date of Patent: March 26, 2024Assignee: Rznomics Inc.Inventors: Seong-Wook Lee, Kyung Hyun Lee, Seung Ryul Han, Ji Hyun Kim, Seongcheol Kim
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Patent number: 11939334Abstract: The present disclosure relates to a novel PLK1 degradation inducing compound having a structure according to Formula I, a method for preparing the same, and the use thereof. The compounds of the present disclosure exhibit an effect of inducing PLK1 degradation. Therefore, the compounds of the present disclosure may be effectively utilized for preventing or treating PLK1-related diseases.Type: GrantFiled: August 10, 2022Date of Patent: March 26, 2024Assignee: UPPTHERA, INC.Inventors: Soo Hee Ryu, Im Suk Min, Han Kyu Lee, Seong Hoon Kim, Hye Guk Ryu, Keum Young Kang, Sang Youn Kim, So Hyun Chung, Jun Kyu Lee, Gibbeum Lee