Abstract: A heat exchange system includes a pump or compressor 100 that pressurizes a working fluid, a first heat exchanger 200 that receives the working fluid from the pump or compressor 100 and causes the working fluid to exchange heat with a first medium to decrease a temperature of the working fluid, first adjustment means 300 for receiving the working fluid from the first heat exchanger 200 and decreasing the temperature and a pressure of the working fluid, heat absorption means 400 for receiving the working fluid from the first adjustment means 300, second adjustment means 500 for receiving the working fluid from the heat absorption means 400, and a second heat exchanger 600 that receives the working fluid from the second adjustment means 500.

Abstract: The present invention provides a complex power generation facility including a first transfer unit that transfers liquefied natural gas; a first heat exchange apparatus that causes the liquefied natural gas supplied from the first transfer unit to exchange heat with seawater, vaporizes the liquefied natural gas into natural gas, heats the seawater into hot water, and discharges the hot water; a second heat exchange apparatus that selectively receives the hot water discharged from the first heat exchange apparatus and caused the natural gas passing through the first heat exchange apparatus to exchange heat with seawater and hot water; and a power generation unit that generates power as the natural gas supplied from the second heat exchange apparatus passes therethrough.

Abstract: A wafer flat zone aligner prevents wafers from binding to the walls of a wafer cassette, that define the slots in which the wafers are seated, by restricting axial movement of the wafers while the wafers are being rotated by a wafer rotating roller of the aligner. To this end, the wafer rotating roller includes a shaft portion, and a plurality of spaced apart annular members protruding radially from the shaft portion. Each wafer seated in the cassette is inserted between adjacent ones of the annular members into contact with the shaft portion of the roller. When the roller is rotated, the shaft portion rotates the wafers while the wafers are constrained from moving in the axial direction of the roller by the annular members. The wafer aligner also includes a guide roller that is moved into contact with the wafers and causes the wafers to stop rotating when flat zones of the wafer arrive at the guide roller.

Abstract: A wafer flat zone aligner prevents wafers from binding to the walls of a wafer cassette, that define the slots in which the wafers are seated, by restricting axial movement of the wafers while the wafers are being rotated by a wafer rotating roller of the aligner. To this end, the wafer rotating roller includes a shaft portion, and a plurality of spaced apart annular members protruding radially from the shaft portion. Each wafer seated in the cassette is inserted between adjacent ones of the annular members into contact with the shaft portion of the roller. When the roller is rotated, the shaft portion rotates the wafers while the wafers are constrained from moving in the axial direction of the roller by the annular members. The wafer aligner also includes a guide roller that is moved into contact with the wafers and causes the wafers to stop rotating when flat zones of the wafer arrive at the guide roller.