Abstract: The sensor comprises a reference bolometer and a plurality of sensing bolometers. Each sensing bolometer is arranged adjacent to the reference bolometer. Each bolometer comprises (i) a substrate, (ii) a cap structure connected to the substrate, the cap structure configured to define a cavity between an inner surface of the cap structure and a first surface of the substrate, (iii) an absorber connected the substrate and arranged within the cavity, the absorber configured to absorb infrared radiation within the cavity, and (iv) a readout circuit connected to the absorber and configured to provide a signal that indicates an amount of infrared radiation absorbed by the absorber. The cap structure of the reference bolometer blocks infrared radiation from entering the cavity from outside the cap structure. The cap structure of each sensing bolometers allows infrared radiation to enter the cavity from outside the cap structure.

Abstract: A sensor comprises a substrate having a first surface; a cap structure connected to the substrate, the cap structure configured to define a cavity between an inner surface of the cap structure and the first surface of the substrate, the cap structure configured to block infrared radiation from entering the cavity from outside the cap structure; a plurality of absorbers, each absorber in the plurality of absorbers being connected to the first surface of the substrate and arranged at a respective position within the cavity and configured to absorb infrared radiation at the respective position within the cavity; and a plurality of readout circuits, each readout circuit in the plurality of readout circuits being connected to a respective absorber in the plurality of absorbers and configured to provide a measurement signal that indicates an amount of infrared radiation absorbed by the respective absorber.

Abstract: A flexible electronic device includes a flexible electronic circuit and a flexible microfluidic sensor homogeneously integrated into the flexible circuit. The flexible sensor includes a flexible microfluidic structure, a first material, a second material, and an electrode arrangement. At least one of the first and second materials is a fluid. The structure defines at least one microfluidic chamber. The first and second materials are disposed in the chamber. The second material has a physical property and an electrical property different from the first material. The electrode arrangement includes at least one pair of electrodes spaced apart from each other with at least a portion of the at least one chamber located functionally directly therebetween such that at least one electronic property measured across the pair is based on a relationship between the second material and the electrode pair. The relationship is based on a physical condition of the microfluidic structure.

Abstract: A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.

Abstract: A MEMS device, e.g., a flexible MEMS pressure sensor, is formed by disposing a sacrificial layer, such as photoresist, on a substrate. A first flexible support layer is disposed on the substrate, and a first conductive layer is disposed over a portion of the first support layer. A liquid or gel separator, e.g., silicone oil, is disposed on an internal region of the first conductive layer. A second flexible support layer encapsulates the first conductive layer and the separator. A second conductive layer disposed over the second support layer at least partially overlaps the first conductive layer and forms a parallel plate capacitor. A third flexible support layer encapsulates the second conductive layer and second support layer. Soaking the sensor in hot water releases the sensor from the sacrificial layer.

Abstract: System and method for forming an ALD assembly on a surface of a microelectromechanical system (MEMS) device comprises a substrate having a surface and the ALD assembly is at least partially disposed on the surface of the substrate, wherein the ALD assembly is at least one of hydrophobic and hydrophilic properties. The ALD layer further includes a first ALD and a second ALD. On the surface of the substrate, the first ALD is deposited in a first deposition cycle and the second ALD is deposited in a second deposition cycle. The ALD assembly further comprises a seed layer formed using atomic layer deposition and the ALD layer is at least partially disposed on the seed layer. In one example, the seed layer is formed from alumina (Al2O3) and the ALD layer is formed from platinum (Pt). In alternate embodiment, on the seed layer, the first ALD is deposited in a first deposition cycle and the second ALD is deposited in a subsequent deposition cycle. The substrate is formed from silicon dioxide (SiO2).