Abstract: An optical combiner including a waveguide prism configured to convey display light, from a display panel, from a proximal end of the waveguide prism to a distal end of the waveguide prism via total internal reflection. The optical combiner also includes an outcoupling interface positioned at the distal end of the waveguide prism on a surface of the waveguide prism that faces a user's eye. The outcoupling interface includes a plurality of polarization-dependent layers including a refractive beam-splitting convex lens to fold the light path of the display light and reduce the dimensions of a near-eye optical system implementing the optical combiner.

Abstract: A device provides light for augmented reality vision. The device includes a display that emits light toward a beam splitter. The beam splitter reflects light from the display toward a polarization-dependent lens. The beam splitter allows world scene light to pass therethrough to the polarization-dependent lens. The polarization-dependent lens directs display light and world scene light toward a non-polarization-dependent lens positioned at an eye-ward side of the polarization-dependent lens.

Abstract: Embodiments of the invention include a semiconductor structure comprising a light emitting layer. The semiconductor structure is attached to a support such that the semiconductor structure and the support are mechanically self-supporting. A wavelength converting material extends over the sides of the semiconductor structure and the support, wherein the wavelength converting material has a substantially uniform thickness over the top and sides of the semiconductor structure and the support.

Abstract: A solid state light-emitting device (LED) lighting apparatus comprising a leadframe assembly comprising leadframes spaced apart at a pitch, each leadframe comprising at least one pad, interconnects each linking two adjacent leadframes, LEDs mounted on the leadframes, and bidirectional spreading lenses disposed about the LEDs, each bidirectional spreading lens having a spreading axis and a null axis perpendicular to the spreading axis, each bidirectional spreading lens directing more light in opposite directions along the spreading axis than the null axis, the spreading axis being aligned along the length of the stretched leadframe assembly.

Abstract: A solid state light-emitting device (LED) lighting apparatus comprising a leadframe assembly comprising leadframes spaced apart at a pitch, each leadframe comprising at least one pad, interconnects each linking two adjacent leadframes, LEDs mounted on the leadframes, and bidirectional spreading lenses disposed about the LEDs, each bidirectional spreading lens having a spreading axis and a null axis perpendicular to the spreading axis, each bidirectional spreading lens directing more light in opposite directions along the spreading axis than the null axis, the spreading axis being aligned along the length of the stretched leadframe assembly.

Abstract: A method for manufacturing a solid state light-emitting device (LED) lighting apparatus includes forming a leadframe assembly with a group of leadframes connected in series by folded interconnects, mounting LEDs on the leadframes, disposing optical elements about the LEDs, and stretching the leadframe assembly so the interconnects unfold to space apart the LEDs. Disposing the optical elements includes orienting the optical elements so the optical elements provide a predetermined light pattern after stretching the leadframe assembly.

Abstract: Techniques and mechanisms to provide for improved image display in an area of overlapping projections. In an embodiment, a multi-layer projection screen comprises light sources and collimation structures each disposed over a corresponding one of such light sources. A first collimation structure disposed over a first light source collimates first light from the first light source. The first collimation structure further receives and redirects second light from a second light source disposed under a second collimation structure that adjoins the first collimation structure. In another embodiment, the first collimation structure redirects the other light from the second light source away from the direction of collimation of the first light. A stray light rejection layer of the multi-layer projection screen passes a majority of the first light for inclusion as part of a projected image, and prevents a majority of the second light from inclusion in the projected image.

Abstract: Techniques and mechanisms to provide for improved image display in an area of overlapping projections. In an embodiment, a multi-layer projection screen comprises light sources and collimation structures each disposed over a corresponding one of such light sources. A first collimation structure disposed over a first light source collimates first light from the first light source. The first collimation structure further receives and redirects second light from a second light source disposed under a second collimation structure that adjoins the first collimation structure. In another embodiment, the first collimation structure redirects the other light from the second light source away from the direction of collimation of the first light.

Abstract: A wafer-scale process is described that simultaneously encapsulates LED dies, forms lenses over the LED dies, and forms a chip scale package for said dies. An array of LED dies (16A,B) are affixed to an adhesive surface of a temporary support structure (14). The support structure is then brought against a mold (32). A single molding material (40), such as transparent silicone, then encapsulates the top and side surfaces of each LED die and forms a lens (44) over the top surface of each LED die. The molded material does not cover bottom surfaces of bottom electrodes (26, 28) of the LED die so as to allow said electrodes to be directly bonded to pads (56, 58) of a substrate (60), such as a PCB. The temporary support substrate is then removed after the molding process, and the molded material is singulated to separate out the packages.

Abstract: Embodiments of the invention include a semiconductor structure comprising a light emitting layer. The semiconductor structure is attached to a support such that the semiconductor structure and the support are mechanically self-supporting. A wavelength converting material extends over the sides of the semiconductor structure and the support, wherein the wavelength converting material has a substantially uniform thickness over the top and sides of the semiconductor structure and the support.

Abstract: Embodiments of the invention include a semiconductor structure including a light emitting layer. The semiconductor structure is attached to a support such that the semiconductor structure and the support are mechanically self-supporting. A wavelength converting material extends over the sides of the semiconductor structure and the support. In some embodiments, a thickness of the wavelength converting material on a side of the semiconductor structure is at least 25% of a thickness of the wavelength converting material over a top of the semiconductor structure.

Abstract: Embodiments of the invention include a plurality of semiconductor light emitting diodes attached to a mount. A plurality of lenses are disposed over the plurality of semiconductor light emitting diodes. A lens disposed over a semiconductor light emitting diode proximate an edge of the mount is rotationally asymmetrical and is shaped such that for a portion of the lens light emitted at an intensity that is half a maximum intensity is emitted at an angle of at least 70° relative to a normal to a top surface of the semiconductor light emitting diode.

Abstract: Embodiments of the invention include a plurality of semiconductor light emitting diodes attached to a mount. A plurality of lenses are disposed over the plurality of semiconductor light emitting diodes. A lens disposed over a semiconductor light emitting diode proximate an edge of the mount is rotationally asymmetrical and is shaped such that for a portion of the lens light emitted at an intensity that is half a maximum intensity is emitted at an angle of at least 70° relative to a normal to a top surface of the semiconductor light emitting diode.

Abstract: A method for manufacturing a solid state light-emitting device (LED) lighting apparatus includes forming a leadframe assembly with a group of leadframes connected in series by folded interconnects, mounting LEDs on the leadframes, disposing optical elements about the LEDs, and stretching the leadframe assembly so the interconnects unfold to space apart the LEDs. Disposing the optical elements includes orienting the optical elements so the optical elements provide a predetermined light pattern after stretching the leadframe assembly.

Abstract: Embodiments of the invention include a semiconductor structure comprising a light emitting layer. The semiconductor structure is attached to a support such that the semiconductor structure and the support are mechanically self-supporting. A wavelength converting material extends over the sides of the semiconductor structure and the support, wherein the wavelength converting material has a substantially uniform thickness over the top and sides of the semiconductor structure and the support.

Abstract: A wafer-scale process is described that simultaneously encapsulates LED dies, forms lenses over the LED dies, and forms a chip scale package for said dies. An array of LED dies (16A,B) are affixed to an adhesive surface of a temporary support structure (14). The support structure is then brought against a mold (32). A single molding material (40), such as transparent silicone, then encapsulates the top and side surfaces of each LED die and forms a lens (44) over the top surface of each LED die. The molded material does not cover bottom surfaces of bottom electrodes (26, 28) of the LED die so as to allow said electrodes to be directly bonded to pads (56, 58) of a substrate (60), such as a PCB. The temporary support substrate is then removed after the molding process, and the molded material is singulated to separate out the packages.

Abstract: Embodiments of the invention include a plurality of semiconductor light emitting diodes attached to a mount. A plurality of lenses are disposed over the plurality of semiconductor light emitting diodes. A lens disposed over a semiconductor light emitting diode proximate an edge of the mount is rotationally asymmetrical and is shaped such that for a portion of the lens light emitted at an intensity that is half a maximum intensity is emitted at an angle of at least 70° relative to a normal to a top surface of the semiconductor light emitting diode.

Abstract: Light emitting elements (110) are situated on a film (210), then surrounded by a reflective structure (250) that is placed or formed on the film (210). Thereafter, the reflective structure (250) is filled with an encapsulant (270), affixing the light emitting element (110) within the reflective structure (250). The film (210) may then be removed, exposing the contacts (230) for coupling the light emitting element (110) to an external power source. The encapsulated light emitting elements (110) within the reflective structure (250) are diced/singulated to provide the individual light emitting devices. The encapsulant (270) may be molded or otherwise shaped to provide a desired optical function.

Abstract: Light emitting elements (110) are situated on a film (210), then surrounded by a reflective structure (250) that is placed or formed on the film (210). Thereafter, the reflective structure (250) is filled with an encapsulant (270), affixing the light emitting element (110) within the reflective structure (250). The film (210) may then be removed, exposing the contacts (230) for coupling the light emitting element (110) to an external power source. The encapsulated light emitting elements (110) within the reflective structure (250) are diced/singulated to provide the individual light emitting devices. The encapsulant (270) may be molded or otherwise shaped to provide a desired optical function.