Abstract: The invention provides conducting polymeric interpenetrating network (IPN), and related methods and composition. The conductive surface of polymer of this invention comprises an interpenetrating network of two or more polymers, wherein at least one of the polymer networks is conducting polymer. Also provided is a method of producing a conducting surface on otherwise insulating bulk polymer, combining a first polymeric network with a second polymeric network, wherein the first or second polymeric network is based on a conducting polymer. The conducting surfaces are intended for use in flexible and wearable electronics; in photonics and photovoltaics; signal dissipation and suppression, corrosion protection; ionic and catalytic exchange; electrodes, filters and membranes; finishing textiles, bandages and carpets, healthcare devices, sensors. The present application also discloses devices manufactured from IPN conducting polymers and uses thereof.

Abstract: A thin-film plasmonic device including a layer of a conductive material positioned over an array of electrodes of alternating polarity.

Abstract: A thin-film plasmonic device including a layer of a conductive material positioned over an array of electrodes of alternating polarity.

Abstract: A thin-film plasmonic device including a layer of a conductive material positioned over an array of electrodes of alternating polarity.

Abstract: Conductor structures include a substrate, a first conducting layer that is selectively passivated from growth of unwanted surface layers by the application of a selective passivation layer, and a second conducting layer that is applied onto the selective passivation layer. The selective passivation layer prevents the combination of unwanted materials with the first conducting layer while allowing the combination of the applied second conducting layer with the first conducting layer. The selective passivation layer is displaced by the second conducting layer and remains as a passivation layer on the exposed surface of the second conducting layer being displaced, thereby protecting the first and second conducting layers from unwanted materials or unwanted surface layers. Methods of fabricating conductor structures are also provided.

Abstract: Conductor structures include a substrate, a first conducting layer that is selectively passivated from growth of unwanted surface layers by the application of a selective passivation layer, and a second conducting layer that is applied onto the selective passivation layer. The selective passivation layer prevents the combination of unwanted materials with the first conducting layer while allowing the combination of the applied second conducting layer with the first conducting layer. The selective passivation layer is displaced by the second conducting layer and remains as a passivation layer on the exposed surface of the second conducting layer being displaced, thereby protecting the first and second conducting layers from unwanted materials or unwanted surface layers. Methods of fabricating conductor structures are also provided.