Patents by Inventor Sergei Stoukach

Sergei Stoukach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip-chip assembly of semiconductor devices using adhesives
    Patent number: 6555414
    Abstract: The present invention is related to a flip-chip-on-board (FCOB) assembly technology applicable for mounting large chips with high I/O count or small pitch, mounted on low-cost or low-grade substrates. The assembly technology uses both an isotropically conductive adhesive (ICA) and a non-conductive material (NCA) in the same assembly cycle. The thermocompression step establishes at the same time the electrical and mechanical interconnections and the curing of the adhesives.
    Type: Grant
    Filed: February 9, 2001
    Date of Patent: April 29, 2003
    Assignee: Interuniversitair Microelektronica Centrum, vzw
    Inventors: Jan Vanfleteren, Sergei Stoukach, Bjorn Vandecasteele