Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate. The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.

Abstract: In some examples, a multiple chip module (MCM) includes a heat sink; a circuit board; a first chip secured to a first location on the circuit board; a first vapor chamber thermally coupled to the first chip to pass heat generated by the first chip to the heat sink; a second chip secured to a second location on the circuit board; and a second vapor chamber thermally coupled to the second chip to pass heat generated by the second chip to the heat sink. In some examples, a portion of the second vapor chamber is positioned between a portion of the first vapor chamber and the heat sink. In some examples, the first vapor chamber is substantially thermally insulated from the second vapor chamber.

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

Abstract: A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

Abstract: Examples described herein include heat dissipating apparatuses with phase change material. In some examples, a heat dissipating apparatus comprises a wick structure to carry a cooling fluid to cool an electronic heat source, a vapor region to carry heated cooling fluid away from the wick structure, and a compartmentalized space separate from the vapor region comprising a phase change material to absorb energy from the heated cooling fluid.

Abstract: A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

Abstract: Apparatuses associated with liquid coolant supply are disclosed. One example apparatus is a computing cartridge which includes a first electronic device and a liquid-cooled cold plate. The computing cartridge also includes a first thermal couple between the first electronic device and the cold plate. The computing cartridge also includes an inlet fluid connector. The inlet fluid connector may supply a liquid coolant to the cold plate The computing cartridge also includes an outlet fluid connector. The outlet fluid connector may facilitate return of the coolant from the cold plate.

Abstract: According to an example, a cooling system includes a cooling fluid reservoir, a cooling apparatus in fluid communication with the cooling fluid reservoir, a chamber having a side in thermal contact with a portion of the heat generating component, in which cooling fluid delivered by the cooling apparatus is to be heated through receipt of heat from the heat generating component, a cooling plate positioned at a distance and separated from the chamber, and a cooling fluid tube connecting the chamber and the cooling plate, in which the heated cooling fluid is to flow through the cooling fluid tube to the cooling plate. The cooling plate is also to be in thermal contact with a heat exchanger that that is to remove heat from the cooling fluid.

Abstract: A method for cooling a heat-generating device, comprising setting a reference surface temperature of the heat-generating device, measuring a temperature of a surface of the heat-generating device, measuring a temperature gradient based on temperature measurements of two or more different locations on the heat-generating device, implementing a closed-loop control based on the reference surface temperature, the measured surface temperature, and the measured temperature gradient of the heat-generating device to compute a rate of application of a cooling material to the surface of the heat-generating device, and providing a command to apply the cooling material to the surface of the heat-generating device at the calculated rate to cool the heat-generating device.

Abstract: Real-time monitoring of an energy characteristic of a building such as an energy performance of the building or a carbon offset of the building is performed by first computing a heat transfer coefficient of the building from nighttime steady-state thermal load data of the building and from nighttime steady-state indoor and outdoor temperature data of the building. A thermal inertia of the building is then computed from nighttime transient indoor temperature data of the building and nighttime transient thermal load data of the building. During daytime, a solar radiation gain coefficient is computed from daytime thermal load data, daytime indoor and outdoor temperature data, incident solar radiation data, and the heat transfer coefficient. The energy characteristic of the building is then estimated in real time from the heat transfer coefficient, the thermal inertia, and the solar radiation gain coefficient.

Abstract: To deposit carbon nanotubes onto a substrate, an at least partially porous film is prepared so that a surface of the film has a layer of carbon nanotubes thereon. The film is positioned in relation to a surface of the substrate such that the surface of the film having the layer of carbon nanotubes is brought into contact with the surface of the substrate. Pressure is applied to the film to attach the film, including the layer of carbon nanotubes, to the surface of the substrate.

Abstract: A method for cooling a heat-generating device, comprising setting a reference surface temperature of the heat-generating device, measuring a temperature of a surface of the heat-generating device, measuring a temperature gradient based on temperature measurements of two or more different locations on the heat-generating device, implementing a closed-loop control based on the reference surface temperature, the measured surface temperature, and the measured temperature gradient of the heat-generating device to compute a rate of application of a cooling material to the surface of the heat-generating device, and providing a command to apply the cooling material to the surface of the heat-generating device at the calculated rate to cool the heat-generating device.

Abstract: A method for cooling a heat-generating device, comprising setting a reference surface temperature of the heat-generating device, measuring a temperature of a surface of the heat-generating device, measuring a temperature gradient based on temperature measurements of two or more different locations on the heat-generating device, implementing a closed-loop control based on the reference surface temperature, the measured surface temperature, and the measured temperature gradient of the heat-generating device to compute a rate of application of a cooling material to the surface of the heat-generating device, and providing a command to apply the cooling material to the surface of the heat-generating device at the calculated rate to cool the heat-generating device.

Abstract: To deposit carbon nanotubes onto a substrate, an at least partially porous film is prepared so that a surface of the film has a layer of carbon nanotubes thereon. The film is positioned in relation to a surface of the substrate such that the surface of the film having the layer of carbon nanotubes is brought into contact with the surface of the substrate. Pressure is applied to the film to attach the film, including the layer of carbon nanotubes, to the surface of the substrate.

Abstract: A method for cooling a heat-generating device, comprising setting a reference surface temperature of the heat-generating device, measuring a temperature of a surface of the heat-generating device, measuring a temperature gradient based on temperature measurements of two or more different locations on the heat-generating device, implementing a closed-loop control based on the reference surface temperature, the measured surface temperature, and the measured temperature gradient of the heat-generating device to compute a rate of application of a cooling material to the surface of the heat-generating device, and providing a command to apply the cooling material to the surface of the heat-generating device at the calculated rate to cool the heat-generating device.