Abstract: There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite to the first substrate with a predetermined space and having a second electrode formed thereon; a display element layer formed between the first substrate and the second substrate and having a plurality of display elements arranged thereon, the display elements having optical characteristics changed by voltage applied to the first and second electrodes; and vibration parts formed on the first substrate or the second substrate and configured to apply vibrations to the display elements by the voltage applied to the first and second electrodes.

Abstract: There is provided a haptic feedback device and an electronic device having the same. The haptic feedback device includes a display panel receiving contact pressure applied thereto; an actuator generating vibrations so as to give different types of haptic feedback according to a change in the contact pressure applied to the display panel; a support plate supporting the actuator; a bonding portion provided between an end portion of the actuator in a lengthwise direction thereof and the support plate so as to fix the actuator to the support plate; and a vibration space expanding portion formed to be recessed in a portion of the support plate corresponding to the actuator.

Abstract: There are provided a ceramic composition for a piezoelectric actuator allowing for low-temperature sintering and a method of manufacturing the same, and a piezoelectric actuator. A Cuo powder and an MnO powder as an sintring additive are added to a PZT-PZN piezoelectric ceramic powder to allow low-temperature sintering at a temperature of 950° C. or lower, and the usage of high-priced palladium (Pd) used as materials for high-temperature inner electrodes is decreased due to lowering of the sintering temperature, and thereby to achieve cost reduction.

Abstract: There is provided a haptic driving assembly capable of providing more uniform haptic feedback, and an electronic device using the same. The haptic driving assembly includes: at least one actuator; and a vibration transferring part disposed to contact at least one surface of the actuator and transferring vibrations generated in the actuator to the outside through a liquid phase medium.

Abstract: There are provided a haptic driving assembly capable of providing stronger and more accurate vibration feedback, and an electronic device using the same. The haptic driving assembly includes: a support plate having a plate shape; and at least one actuator having one end thereof coupled to the support plate in order that the other end thereof is spaced apart from an upper surface of the support plate by a predetermined interval.

Abstract: Disclosed are a ceramic composition for a piezoelectric actuator and a piezoelectric actuator including the same. The ceramic composition for a piezoelectric actuator includes piezoelectric ceramic powder expressed by a chemical formula, (1?x)Pb(Zr(1-y)Tiy)O3-xPb(Ni1/3Nb2/3)O3, where, x ranges from 0.25 to 0.4, and y ranges from 0.4 to 0.7. The ceramic composition for a piezoelectric actuator permits low-temperature firing while implementing superior piezoelectric properties.

Abstract: The present invention relates to a ceramic composition for a piezoelectric actuator and a piezoelectric actuator comprising the same. The ceramic composition for piezoelectric actuator includes a piezoelectric ceramic powder expressed by a Chemical Formula: (1-x)Pb(Zr(1-y)Tiy)O3-xPb(Ni1/3Nb2/3)O3, wherein x is 0.25 to 0.4 and y is 0.4 to 0.7; and a CuO powder and a PbO powder forming a liquid-phase compound at a sintering temperature or less of the piezoelectric ceramic powder. The ceramic composition for a piezoelectric actuator according to the present invention exhibits excellent piezoelectric characteristics and allows for low-temperature firing.

Abstract: Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction.

Abstract: Disclosed herein is a piezoelectric sealing cap, including: a piezoelectric element generating displacement by a driving voltage; and a sealing part formed to surround the piezoelectric element and sealing a bottle neck when the piezoelectric element is inserted into the bottle neck.

Abstract: There is provided a haptic feedback actuator, a haptic feedback device and an electronic device. The haptic feedback actuator includes a support plate disposed in a lower portion of a haptic device; one or more actuators disposed on the support plate, each having one end towards a central portion of the support plate and the other end towards a corner of the support plate, and generating vibrations so as to give different types of haptic feedback according to a change in contact pressure applied to the haptic device; and one or more dividing portions, each penetrating the support plate in a thickness direction thereof and dividing the support plate into vibration areas corresponding to the respective actuators.

Abstract: There is provided a haptic feedback device and an electronic device having the same. The haptic feedback device includes a display panel receiving contact pressure applied thereto; an actuator generating vibrations so as to give different types of haptic feedback according to a change in the contact pressure applied to the display panel; a support plate supporting the actuator; a bonding portion provided between an end portion of the actuator in a lengthwise direction thereof and the support plate so as to fix the actuator to the support plate; and a vibration space expanding portion formed to be recessed in a portion of the support plate corresponding to the actuator.

Abstract: There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite to the first substrate with a predetermined space and having a second electrode formed thereon; a display element layer formed between the first substrate and the second substrate and having a plurality of display elements arranged thereon, the display elements having optical characteristics changed by voltage applied to the first and second electrodes; and vibration parts formed on the first substrate or the second substrate and configured to apply vibrations to the display elements by the voltage applied to the first and second electrodes.

Abstract: Provided are a ceramic substrate, a method of manufacturing the same, and an electrical device using the same. A ceramic substrate includes a first laminated body, a second laminated body and an adhesive part. The first laminated body includes a predetermined electrode formed therein. The second laminated body is laminated on and electrically connected to the first laminated body. Also, the adhesive part is intervened between the first laminated body and the second laminated body to adhere the first and second laminated bodies through interfacial reaction.

Abstract: A method of manufacturing a non-shrinking ceramic substrate according to an aspect of the invention may include: preparing a ceramic laminate having a via electrode therein; firing the ceramic laminate so that a void is formed at the interface between the via electrode and the ceramic laminate; and performing plating to fill the void with a conductive material.

Abstract: Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of fired ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.

Abstract: A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate. A capacitor part is manufactured by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part. A plurality of low temperature co-fired green sheets are provided. Each of the low temperature co-fired green sheet has at least one of a conductive pattern and a conductive via hole thereon. A low temperature co-fired ceramic deposition is formed by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition. The embedded capacitor part is connected either to the conductive pattern or the conductive via hole of an adjacent green sheet. Then the low temperature co-fired ceramic deposition having the capacitor part embedded therein is fired.

Abstract: Disclosed is a method of manufacturing a multilayer ceramic substrate. The method includes providing a plurality of ceramic blocks, each including a ceramic laminate having a first surface and a second surface and having a laminated structure of a plurality of ceramic green sheets containing a glass ceramic component, and a first bonding ceramic green sheet including a glass component and disposed on a surface of the first and second surfaces of the ceramic laminate, which is to contact another ceramic laminate, firing the plurality of ceramic blocks, laminating the plurality of ceramic blocks such that the first bonding ceramic green sheets of the adjacent ceramic blocks face each other, and bonding the plurality of ceramic blocks using the glass component of the first bonding ceramic green sheets.

Abstract: A method of manufacturing a capacitor-embedded low temperature co-fired ceramic substrate. A capacitor part is manufactured by firing a deposition including at least one high dielectric ceramic sheet to form a capacitor part. A plurality of low temperature co-fired green sheets are provided. Each of the low temperature co-fired green sheet has at least one of a conductive pattern and a conductive via hole thereon. A low temperature co-fired ceramic deposition is formed by depositing the low temperature co-fired green sheets to embed the capacitor part in the low temperature co-fired ceramic deposition. The embedded capacitor part is connected either to the conductive pattern or the conductive via hole of an adjacent green sheet. Then the low temperature co-fired ceramic deposition having the capacitor part embedded therein is fired.

Abstract: A method of manufacturing a non-shrinking ceramic substrate according to an aspect of the invention may include: preparing a ceramic laminate having a via electrode therein; firing the ceramic laminate so that a void is formed at the interface between the via electrode and the ceramic laminate; and performing plating to fill the void with a conductive material.

Abstract: A non-shrinkage ceramic substrate includes: a ceramic laminated body formed by laminating a plurality of green sheets; an electrode part including a via electrode penetratingly formed at the ceramic laminated body and an outer electrode formed on a surface of the ceramic laminated body and electrically connected with the via electrode; and an interface part formed between the ceramic laminated body and the electrode part to prevent an electrical connection between the electrodes from weakening.