Abstract: The present invention relates to a power module and a method of manufacturing the same. A power module according to one embodiment of the present invention includes a power module including a substrate a sealing member disposed to cover the substrate, a heatsink bonded to one surface of the substrate, a stepped bonding portion protruding to be stepped from one surface of the heatsink toward the substrate, and a bonding member disposed between and sinter-bonded to the stepped bonding portion and the substrate.

Abstract: Provided is a method of outputting a velocity of an object, the method including: transmitting an ultrasound signal to an object and receiving an ultrasound echo signal returned from the object; determining a velocity of the object based on the ultrasound echo signal; displaying a spectral Doppler image showing velocities of the object over time; receiving user inputs of selecting an interval within a range of the velocities of the object shown in the spectral Doppler image and adjusting an output volume of an audible sound corresponding to velocities in the selected interval; and outputting, based on the adjusted output volume of the audible sound, an audible sound representing the velocities of the object over time.

Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.

Abstract: Provided is a method of outputting a velocity of an object, the method including: transmitting an ultrasound signal to an object and receiving an ultrasound echo signal returned from the object; determining a velocity of the object based on the ultrasound echo signal; displaying a spectral Doppler image showing velocities of the object over time; receiving user inputs of selecting an interval within a range of the velocities of the object shown in the spectral Doppler image and adjusting an output volume of an audible sound corresponding to velocities in the selected interval; and outputting, based on the adjusted output volume of the audible sound, an audible sound representing the velocities of the object over time.

Abstract: Provided is an ultrasonic image generating apparatus that may generate an ultrasonic image by using an ultrasonic transducer which has a wideband frequency transfer characteristic or an ultra-wideband frequency transfer characteristic, such as a micromachined ultrasonic transducer (MUT). A pulse generator of the ultrasonic image generating apparatus may generate a first ultrasonic pulse having a first center frequency and a first bandwidth and a second ultrasonic pulse having a second center frequency and a second bandwidth. The ultrasonic transducer may simultaneously transmit the first ultrasonic pulse and the second ultrasonic pulse.

Abstract: A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module.

Abstract: There are provided an ultrasonic imaging apparatus for imaging an ultrasonic signal and a method of controlling the same. A method of controlling an ultrasonic imaging apparatus according to an embodiment which uses a 2D array probe in which a plurality of elements are two-dimensionally arranged, the method includes setting an ultrasound to be transmitted using all of the plurality of elements and an echo ultrasound to be received using some predetermined elements among the plurality of elements, determining whether a section of interest of an object is included in a weak resolution region determined by the setting, and generating an ultrasound image of the section of interest according to a beamforming method corresponding to focusing of the transmitted ultrasound by transmitting the ultrasound and receiving the echo ultrasound in accordance with the setting when the section of interest is included in the weak resolution region.

Abstract: A sampling method for generating a diagnostic image of an object is provided. The sampling method may include receiving an echo signal reflected from an object; sampling the received echo signal by using a sampling frequency and storing the I component data and the Q component data extracted according to a result of the sampling.

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract: A multi-array type ultrasonic probe apparatus includes n tiles which transmit and receive an ultrasonic beam; and a substrate having n guide portions on which the n tiles are mounted, respectively, to be aligned in a multi-array. The multi-array ultrasonic probe apparatus may align tiles in identical directions and at identical levels to control a direction and a time for transmitting and receiving an ultrasonic beam to be transmitted and received at the tiles, thereby providing a stable ultrasonic beam.

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract: Disclosed herein is a beamforming apparatus for beamforming signals which are transmitted or received by a probe which includes a plurality of transducer blocks, each of which includes a plurality of transducers. The apparatus includes a controller configured to control components to delay signals to be transmitted by the plurality of transducers included in each transducer block or signals received by the plurality of transducers included in each transducer block, and an analog beamformer which includes a plurality of beamforming units which correspond to the respective transducer blocks. The plurality of beamforming units is configured to perform analog beamforming on signals transmitted or received by the plurality of transducers included in each transducer block based on a control signal which is received from the controller, to reduce a dynamic delay range, thereby reducing a size of a delay line.

Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract: Disclosed herein is an ultrasonic probe capable of emitting heat generated by a transducer outside the ultrasonic probe using a heat radiation plate. The ultrasonic probe includes a transducer configured to generate an ultrasonic wave, a heat spreader provided on a surface of the transducer, the heat spreader being configured to absorb heat generated by the transducer, at least one heat radiation plate which contacts at least one side of the heat spreader, and at least one board installed on the at least one heat radiation plate so as to transfer heat generated by the at least one board to the at least one heat radiation plate.

Abstract: Provided is a portable ultrasonic probe including a main body comprising a transducer configured to generate an ultrasonic wave, and a folder part comprising a display and rotatably coupled to an end portion of the main body, wherein the main body further comprises an analog to digital (AD) converter and a beamformer, the AD converter and the beamformer being provided in a chip.

Abstract: A portable ultrasonic probe includes a main body including a transducer to generate an ultrasonic wave and a folder portion including a display portion and pivotally coupled to an end portion of the main body, the main body includes a first heat radiation module configured to absorb and emit heat generated by the transducer, and the folder portion includes a second heat radiation module thermally coupled to the first heat radiation module when the folder portion is in a first position and configured to emit heat transmitted from the first heat radiation module.

Abstract: A transducer module includes a curved surface frame which is formed from a flexible material in a curved shape and includes a front surface and a rear surface; a transducer which is disposed on the front surface; and a support frame which is mounted on the rear surface and supports the curved surface frame.

Abstract: A jig includes a wafer including an accommodation groove configured to accommodate a capacitive micromachined ultrasonic transducer (cMUT) when flip chip bonding is performed, and a separation groove formed in a bottom surface of the accommodation groove, the separation groove having a bottom surface that is spaced apart from thin films of the cMUT that face the bottom surface of the separation groove when the cMUT is seated on portions of the bottom surface of the accommodation groove.

Abstract: A method and apparatus for performing three-dimensional (3D) ultrasound volume scanning by using a two-dimensional (2D) transducer array, in which a plurality of transducer elements are two-dimensionally arranged, including applying at least two codes which are orthogonal to each other to at least one one-dimensional (1D) transducer array which is included in the 2D transducer array, the 1D transducer array having transducer elements which are arranged linearly from among the plurality of the transducer elements; obtaining signals which respectively correspond to the codes which are orthogonal to each other from signals which are reflected by a target object and received by the plurality of transducer elements; and generating image data regarding the target object by using the obtained signals.