Abstract: The present invention relates to a parallel optical interconnection module for transmitting an optical signal over an optical fiber and receiving an optical signal from the optical fiber. According to the present invention, a reflection surface is formed at the end of the optical waveguide forming a core so that the path of light can be exactly changed and is focused. A light source/photodetector is buried within a trench using the silicon optical bench and an optical waveguide is manually aligned on the surface of the silicon optical bench, so that alignment error between the light source/photodetector and the optical waveguide can be minimized. A ferrule into which the optical waveguide is inserted is fixed to an adaptor so that alignment error between the optical waveguide and the light source/photodetector is minimized. Therefore, the present invention can minimize the coupling loss in the process during which the optical signal is transmitted to increase the optical output.

Abstract: A compliant press-fit pin for electrically coupling a first board to a second board via a plated through hole formed in the second board, includes: an upper part for electrically fixing the first board; a lower part for electrically coupling the first board to a third board via the plated through hole formed in the second board; and a press-fit part located between said upper part and said lower part and containing a fixed beam and a compliant cantilever beam, for electrically coupling the first board fixed to said press-fit part to the second board, wherein the fixed beam and the compliant cantilever beam provide a retention force against a wall of the plated through hole, thereby electrically press-fitting the compliant press-fit pin into the plated through hole, when said press-fit part is inserted into the plated through hole.

Abstract: A method of ferrules used in an optical connector for connection and short-circuit of making multichannel optical signals. Heretofore, many fiber receiving holes have been arranged along a line at regular intervals with tolerance amounting to less than 1 micron. 10 and connect two ferrules, a precisely processed cylindrical metal guide pin under 1 micron, precise pitches formed in ferrules and a metal pin guide hole are used, Consequently, it has been necessary to maintain a high degree of precision. The present invention maintains a high degree of precision by reverse direction connection dependent merely on a predetermined height a reference plane. The reference plane is formed by relatively easy plane processing as the method of maintaining precise height and directivity of flow is added to the inside of a mold.

Abstract: A compound testing machine for testing mechanical properties used for an optical connector does not additionally have each testing machine for each of mechanical properties (such as a tensile force including both a straight pull and a side pull, a flex, a twist and an impact) in testing a mechanical property between optical connectors and other mechanical property between optical fibers of the optical connectors, and includes only one testing machine for simultaneously testing various mechanical properties in order to enhance a test machine's efficiency.

Abstract: A lead-on-chip semiconductor device package is formed by attaching a lead frame having a single adhesive layer to a semiconductor chip. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive having a certain viscosity. The adhesive material is continuously applied to spaces between adjacent inner leads as well as the top surface of the leads and then cured. The leads are disposed at the same intervals and include some side leads with a larger width in order to form the adhesive layer with a uniform thickness. Thermoplastic resins are preferably used as the adhesive, but thermosetting resins may be used as well. In the case of thermoplastic resins, the temperature of a cure step is about 200.degree. C. and that of chip attachment step is about 400.degree. C.

Abstract: An improved multifiber optical connector is disclosed which concurrently transmits an optical signal and provides for optical signal transmission with a lower transmission loss.

Abstract: A three dimensional stack package device that can realize vertical electrical interconnection of the stacked individual package devices without a cost increase or additional complicated processing steps.

Abstract: A multifiber optical connector for optical ribbon cable which must be essentially used in the optical line that requires a repeated connection and separation to transfer or to interrupt simultaneously optical signals with low loss by attaching to an end of the optical ribbon cable arranged in a line. In order to overcome a difficulty of production technique and to constitute a suitable net, the optical cable consists of a short circuit which must be connected for the maintenance of the optical path, in which the optical cable must be very precisely connected so as to minimize a loss.

Abstract: A stacked semiconductor multi-package including a plurality of individual semiconductor chip packages stacked over one another. The individual packages have a substrate provided with a plurality of bonding pads, electrode pads electrically connected to the bonding pads through wires, and chips attached to upper and lower surfaces of the substrate. A paddles lead frame is provided onto which the individual packages are attached to upper and lower surfaces thereof, and variants thereof. For these packages, since individual packages are mounted on upper and lower surfaces of a single printed circuit board or lead frame, the mounting density can be significantly increased and their production can be simplified.

Abstract: A thin semiconductor package having a support film formed on an upper surface of the inner leads with a thickness approximately equal to the thickness of a portion of the molding compound overlaying the inner leads.