Patents by Inventor Seung-ho Bak

Seung-ho Bak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8421013
    Abstract: An electromagnetic wave transmission filter may include a substrate and one or more coils. The one or more coils may be at least partly disposed in an opening through the substrate. An electromagnetic camera may include an electromagnetic wave detector array, including a plurality of detector cells for detecting electromagnetic waves, and an electromagnetic wave transmission filter disposed in front of the electromagnetic wave detector array to provide each of the detector cells with an electromagnetic wave of a certain wavelength. The electromagnetic wave transmission filter may includes a substrate and a plurality of coils. At least one of the plurality of coils may be at least partly disposed in each of a plurality of openings through the substrate.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: April 16, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chan-wook Baik, Seung-ho Bak, Jong-min Kim, Gun-sik Park
  • Publication number: 20110090025
    Abstract: An electromagnetic wave transmission filter may include a substrate and one or more coils. The one or more coils may be at least partly disposed in an opening through the substrate. An electromagnetic camera may include an electromagnetic wave detector array, including a plurality of detector cells for detecting electromagnetic waves, and an electromagnetic wave transmission filter disposed in front of the electromagnetic wave detector array to provide each of the detector cells with an electromagnetic wave of a certain wavelength. The electromagnetic wave transmission filter may includes a substrate and a plurality of coils. At least one of the plurality of coils may be at least partly disposed in each of a plurality of openings through the substrate.
    Type: Application
    Filed: February 26, 2010
    Publication date: April 21, 2011
    Inventors: Chan-wook Baik, Seung-ho Bak, Jong-min Kim, Gun-sik Park