Abstract: Provided is a ceiling storage system capable of correcting a working position and constantly checking stability of a structure by detecting an amount of change in a facility. According to the ceiling storage system, a transport vehicle moves to an upper portion of a first storage area of a plurality of storage areas in a state of gripping an article, and the transport vehicle measures a first distance value between the transport vehicle and the first storage area using a distance sensor and measures a relative position value between the transport vehicle and the first storage area using a vision sensor, before unloading the article from the first storage area.

Abstract: A camera system with a complementary pixlet structure and a method of operating the same are provided. The camera system includes an image sensor that includes at least one 2×2 pixel block including a first pixel, a second pixel, and two third pixels—the two third pixels are disposed at positions diagonal to each other in the 2×2 pixel block and include deflected small pixlets, which are deflected in opposite directions to be symmetrical to each other with respect to each pixel center, and large pixlets adjacent to the deflected small pixlets, respectively, and each pixlet includes an photodiode converting an optical signal to an electrical signal and a depth calculator that receives images acquired from the deflected small pixlets of the two third pixels and calculates a depth between the image sensor and an object using a parallax between the images.

Abstract: A camera system with a complementary pixlet structure and a method of operating the same are provided. The camera system includes an image sensor that includes at least one 2×2 pixel block including a first pixel, a second pixel, and two third pixels—the two third pixels are disposed at positions diagonal to each other in the 2×2 pixel block and include deflected small pixlets, which are deflected in opposite directions to be symmetrical to each other with respect to each pixel center, and large pixlets adjacent to the deflected small pixlets, respectively, and each pixlet includes an photodiode converting an optical signal to an electrical signal and a depth calculator that receives images acquired from the deflected small pixlets of the two third pixels and calculates a depth between the image sensor and an object using a parallax between the images.

Abstract: A camera system with a complementary pixlet structure and a method of operating the same are provided. According to an embodiment, the camera system includes an image sensor that includes two pixels, each of the two pixels including a deflected small pixlet deflected in one direction based on a pixel center and a large pixlet disposed adjacent to the deflected small pixlet, each pixlet including a photodiode converting an optical signal to an electric signal, and the deflected small pixlets of the two pixels being arranged to be symmetrical to each other with respect to each of the pixel centers within each of the two pixels, respectively, and a depth calculator that receives images acquired from the deflected small pixlets of the two pixels and calculates a depth between the image sensor and an object using a parallax between the images.

Abstract: A camera system includes a single lens and an image sensor including a reference pixel array including a plurality of W (white) pixels in a two-dimensional arrangement and a single microlens formed on the plurality of W pixels to be shared, and at least one color pixel array including two W pixels and two color pixels in a two-dimensional arrangement, and a single microlens disposed on the two W pixels and the two color pixels to be shared. Light shielding layers formed with Offset Pixel Apertures (OPAs) are disposed on the plurality of W pixels included in the reference pixel array and the two W pixels included in the at least one color pixel array, respectively, and the OPAs are formed on the light shielding layers in the reference pixel array and the at least one color pixel array, respectively, to maximize a spaced distance between the OPAs.

Abstract: A camera system is provided to increase a baseline. The camera system includes a single lens, and an image sensor includes at least one pixel array, each of the at least one pixel array including a plurality of pixels in a two-dimensional arrangement and a single microlens disposed on the plurality of pixels to be shared. Light shielding layers formed with Offset Pixel Apertures (OPAs) are disposed on at least two pixels of the plurality of pixels, and the OPAs are formed on the light shielding layers to maximize a spaced distance between the OPAs.

Abstract: A method of operating a three-dimensional image sensor may include: obtaining position information of an object using light emitted by a light source module, the three-dimensional image sensor including the light source module having a light source and a lens; and adjusting a relative position of the light source to the lens based on the obtained position information of the object. A method of operating an image sensor may include: obtaining position information of an object using light emitted by a light source module, the image sensor including the light source module; and adjusting an emission angle of the light emitted by the light source module based on the obtained position information.

Abstract: An image sensor included in a camera system comprises: a plurality of photodiodes for processing optical signals which have passed through a lens included in the camera system; and at least one mask, disposed on the top of at least one photodiode among the plurality of photodiodes, for enabling the optical signals which have passed through an inner region of the lens included in the camera system to enter the at least one photodiode.

Abstract: A camera system is provided to increase a baseline. The camera system includes a single lens, and an image sensor includes at least one pixel array, each of the at least one pixel array including a plurality of pixels in a two-dimensional arrangement and a single microlens disposed on the plurality of pixels to be shared. Light shielding layers formed with Offset Pixel Apertures (OPAs) are disposed on at least two pixels of the plurality of pixels, and the OPAs are formed on the light shielding layers to maximize a spaced distance between the OPAs.

Abstract: A camera system includes a single lens and an image sensor including a reference pixel array including a plurality of W (white) pixels in a two-dimensional arrangement and a single microlens formed on the plurality of W pixels to be shared, and at least one color pixel array including two W pixels and two color pixels in a two-dimensional arrangement, and a single microlens disposed on the two W pixels and the two color pixels to be shared. Light shielding layers formed with Offset Pixel Apertures (OPAs) are disposed on the plurality of W pixels included in the reference pixel array and the two W pixels included in the at least one color pixel array, respectively, and the OPAs are formed on the light shielding layers in the reference pixel array and the at least one color pixel array, respectively, to maximize a spaced distance between the OPAs.

Abstract: An image sensor included in a camera system comprises: a plurality of photodiodes for processing optical signals which have passed through a lens included in the camera system; and at least one mask, disposed on the top of at least one photodiode among the plurality of photodiodes, for enabling the optical signals which have passed through an inner region of the lens included in the camera system to enter the at least one photodiode.

Abstract: Integrated circuit device packages including optical elements are provided. The integrated circuit device package may include an integrated circuit device and a conductive pad on a first surface of the integrated circuit device. The conductive pad may be electrically connected to the integrated circuit device and may be configured to transmit an electrical signal. The integrated circuit device package may also include an optical element in the integrated circuit device and the optical element may be configured to transmit an optical signal through a second surface of the integrated circuit device that is opposite the first surface of the integrated circuit device.

Abstract: A method of operating a three-dimensional image sensor may include: obtaining position information of an object using light emitted by a light source module, the three-dimensional image sensor including the light source module having a light source and a lens; and adjusting a relative position of the light source to the lens based on the obtained position information of the object. A method of operating an image sensor may include: obtaining position information of an object using light emitted by a light source module, the image sensor including the light source module; and adjusting an emission angle of the light emitted by the light source module based on the obtained position information.

Abstract: A method of fabricating a microlens includes forming layer of photoresist on a substrate, patterning the layer of photoresist, and then reflowing the photoresist pattern. The layer of photoresist is formed by coating the substrate with liquid photoresist whose viscosity is 150 to 250 cp. A depth sensor includes a substrate and photoelectric conversion elements at an upper portion of the substrate, a metal wiring section disposed on the substrate, an array of the microlenses for focusing incident light as beams onto the photoelectric conversion elements and which beams avoid the wirings of the metal wiring section. The depths sensor also includes a layer presenting a flat upper surface on which the microlenses are formed. The layer may be a dedicated planarization layer or an IR filter, interposed between the microlenses and the metal wiring section.

Abstract: An operation method of an image sensor includes determining a distance between the image sensor and an object, and activating at least one of a color pixel, a depth pixel and a thermal pixel included in a pixel array of the image sensor based on a determined distance and a reference distance.

Abstract: Integrated circuit device packages including optical elements are provided. The integrated circuit device package may include an integrated circuit device and a conductive pad on a first surface of the integrated circuit device. The conductive pad may be electrically connected to the integrated circuit device and may be configured to transmit an electrical signal. The integrated circuit device package may also include an optical element in the integrated circuit device and the optical element may be configured to transmit an optical signal through a second surface of the integrated circuit device that is opposite the first surface of the integrated circuit device.

Abstract: A method of fabricating a microlens includes forming layer of photoresist on a substrate, patterning the layer of photoresist, and then reflowing the photoresist pattern. The layer of photoresist is formed by coating the substrate with liquid photoresist whose viscosity is 150 to 250 cp. A depth sensor includes a substrate and photoelectric conversion elements at an upper portion of the substrate, a metal wiring section disposed on the substrate, an array of the microlenses for focusing incident light as beams onto the photoelectric conversion elements and which beams avoid the wirings of the metal wiring section. The depths sensor also includes a layer presenting a flat upper surface on which the microlenses are formed. The layer may be a dedicated planarization layer or an IR filter, interposed between the microlenses and the metal wiring section.

Abstract: According to example embodiments, a method of operating a three-dimensional image sensor comprises measuring a distance of an object from the three-dimensional image sensor using light emitted by a light source module, and adjusting an emission angle of the light emitted by the light source module based on the measured distance. The three-dimensional image sensor includes the light source module.

Abstract: Provided are photodiodes, image sensing devices and image sensors. An image sensing device includes a p-n junction photodiode having a metal pattern layer on an upper surface thereof. An image sensor includes the image sensing device and a micro-lens formed above the metal pattern layer. The metal pattern layer filters light having a first wavelength.

Abstract: A reflection mask for extreme ultraviolet (EUV) photolithography and a method of fabricating the same, in which the reflection mask includes a substrate, a lower reflection layer formed in a multi-layer structure on the substrate and including a material reflecting EUV light, an upper reflection layer formed in a multi-layer structure on the lower reflection layer and reflecting EUV light, and a phase reversing layer formed between the lower reflection layer and the upper reflection layer in a certain pattern and causing destructive interference between reflection light from the upper reflection layer and reflection light from the lower reflection layer. An incidence of a shadow effect can be reduced and unnecessary EUV light can be eliminated, so that a pattern on the reflection mask can be projected precisely on a silicon wafer. Since the phase reversing layer includes the same material as the reflection layer and an absorption layer, mask fabrication processes can be handled easily.