Abstract: A luggage trim of a vehicle supports a luggage board that partitions a luggage room of the vehicle. The luggage trim includes an upper support member disposed at upper ends of opposite sides of the luggage room and configured to support the luggage board, and a lower support member that is disposed below the upper support member and protrudes from the opposite sides of the luggage room so that the luggage board is disposed. The luggage board is configured to be disposed on one of the upper support member or the lower support member to divide the space of the luggage room.

Abstract: A substrate dryer includes, among other things, means for generating isopropyl alcohol bubbles, and a vibrator to atomize stored isopropyl alcohol. A heater may be provided to heat pumped isopropyl alcohol, as wells as a spray nozzle to spray the heated IPA to the vibrator. It is possible to increase the concentration of the isopropyl alcohol supplied for the purpose of drying the substrate. Improved substrate drying is achieved.

Abstract: A semiconductor device having a trench in the side portion of a conducting line pattern and methods of forming the same. The semiconductor device provides a way of preventing an electrical short between the conducting line pattern and a landing pad adjacent to the conducting line pattern. There are disposed two conducting line patterns on a semiconductor substrate. Each of the conducting line patterns includes a conducting line and a conducting line capping layer pattern stacked thereon. Each of the conducting line patterns has a trench between the conducting line capping layer pattern and the conducting line. Conducting line spacers are formed between the conducting line patterns. One conducting line spacer covers a portion of a sidewall of one of the conducting line patterns, and the remaining conducting line spacer covers an entire sidewall of the remaining conducting line pattern. A landing pad is disposed between the conducting line patterns.

Abstract: A semiconductor device having a trench in the side portion of a conducting line pattern and methods of forming the same. The semiconductor device provides a way of preventing an electrical short between the conducting line pattern and a landing pad adjacent to the conducting line pattern. There are disposed two conducting line patterns on a semiconductor substrate. Each of the conducting line patterns includes a conducting line and a conducting line capping layer pattern stacked thereon. Each of the conducting line patterns has a trench between the conducting line capping layer pattern and the conducting line. Conducting line spacers are formed between the conducting line patterns. One conducting line spacer covers a portion of a sidewall of one of the conducting line patterns, and the remaining conducting line spacer covers an entire sidewall of the remaining conducting line pattern. A landing pad is disposed between the conducting line patterns.

Abstract: A semiconductor device having a trench in the side portion of a conducting line pattern and methods of forming the same. The semiconductor device provides a way of preventing an electrical short between the conducting line pattern and a landing pad adjacent to the conducting line pattern. There are disposed two conducting line patterns on a semiconductor substrate. Each of the conducting line patterns includes a conducting line and a conducting line capping layer pattern stacked thereon. Each of the conducting line patterns has a trench between the conducting line capping layer pattern and the conducting line. Conducting line spacers are formed between the conducting line patterns. One conducting line spacer covers a portion of a sidewall of one of the conducting line patterns, and the remaining conducting line spacer covers an entire sidewall of the remaining conducting line pattern. A landing pad is disposed between the conducting line patterns.

Abstract: Apparatus for and a method of cleaning or processing a wafer anticipates a malfunction of a pump and avoids an abrupt shutting down of the pump during the cleaning or processing of the wafer. The apparatus includes a tank vessel containing a liquid used in the cleaning or processing of the wafer, a pump that pumps the liquid chemical from the vessel, a filter that filters impurities contained in the liquid pumped by the pump, a heater that heats the filtered liquid to a predetermined temperature and supplies the heated liquid back into the tank vessel, and a pump malfunction anticipation unit that operates at the same time as the pump. The pump malfunction anticipation unit calculates the flow rate of the liquid pumped by the pump using a program, and based on the flow rate anticipates when it is time to replace the pump.

Abstract: There is provided a method and system for transferring wafers. Wafers in a FOUP are horizontally aligned by vibrating the FOUP before unloading the wafers from the FOUP. Thereafter, a mapping process may be accurately performed, and the wafers stably unloaded from the FOUP.

Abstract: A wet processing apparatus includes a bath in which a plurality of semiconductor substrates are to be seated, and which bath has drain valves defining drain openings between a bottom wall and the lower portions of side walls of the bath. Each of the drain valves also includes a gate mounted on the lower portion of one of the side walls. The gates of the drain valves are movable to selectively open and close the drain openings. A plurality of substrates are transferred into the bath and are held under a body of liquid contained in a bath while the substrates are oriented vertically as disposed generally parallel to one another. In this state, the side walls of the baths face the peripheral edges of the substrates at both sides of the substrates. Thus, the substrates are prevented from moving toward and becoming stuck to one another when the liquid is drained from the bath.

Abstract: Liquid used in manufacturing a semiconductor device is rapidly heated to a desired temperature at which the liquid is most effective at processing substrates. An apparatus for heating the liquid includes a chemical bath in which the liquid is stored, circulation piping connected to the chemical bath, so that the liquid can be circulated in a loop to and from the bath, and a heating system that includes a heating unit associated with the chemical bath and a heating unit associated with the circulation piping. Accordingly, the liquid present in the chemical bath and the liquid flowing through the circulation piping can be heated at the same time. Thus, the temperature of the liquid can be rapidly raised to a desired temperature suitable for the processing of the substrates.

Abstract: A wafer guide and a semiconductor wafer drying apparatus using the same are disclosed. The wafer guide includes a body and supporters formed on the body. The supporters present a plurality of grooves to engage and support a periphery of a wafer. A discharge structure, e.g., a discharging hole, promotes flow of a cleaning solution away from the grooves thereby more effectively drying the wafer by more readily discharging the cleaning solution by way of the discharging structure. The discharging structure reduces undesirable accumulation of the cleaning solution, such as deionized water, in the grooves during a wafer cleaning process. In some embodiments, a pump actively draws fluid away from the discharge structure.

Abstract: A substrate dryer includes, among other things, means for generating isopropyl alcohol bubbles, and a vibrator to atomize stored isopropyl alcohol. A heater may be provided to heat pumped isopropyl alcohol, as wells as a spray nozzle to spray the heated IPA to the vibrator. It is possible to increase the concentration of the isopropyl alcohol supplied for the purpose of drying the substrate. Improved substrate drying is achieved.

Abstract: A semiconductor device having a trench in the side portion of a conducting line pattern and methods of forming the same. The semiconductor device provides a way of preventing an electrical short between the conducting line pattern and a landing pad adjacent to the conducting line pattern. There are disposed two conducting line patterns on a semiconductor substrate. Each of the conducting line patterns includes a conducting line and a conducting line capping layer pattern stacked thereon. Each of the conducting line patterns has a trench between the conducting line capping layer pattern and the conducting line. Conducting line spacers are formed between the conducting line patterns. One conducting line spacer covers a portion of a sidewall of one of the conducting line patterns, and the remaining conducting line spacer covers an entire sidewall of the remaining conducting line pattern. A landing pad is disposed between the conducting line patterns.

Abstract: Rinsing and drying apparatus having rotatable drying source nozzles and methods of rinsing and drying semiconductor wafers are provided. The apparatus includes a bath for storing liquid and rotatable nozzles disposed over the bath. The semiconductor wafers are rinsed using de-ionized water inside the bath. After the rinsing process, de-ionized water is drained. A drying source is then sprayed onto the semiconductor wafers through the rotatable nozzles. The nozzles are oscillated and/or rotated while the drying source is sprayed.

Abstract: Apparatus for and a method of cleaning or processing a wafer anticipates a malfunction of a pump and avoids an abrupt shutting down of the pump during the cleaning or processing of the wafer. The apparatus includes a tank vessel containing a liquid used in the cleaning or processing of the wafer, a pump that pumps the liquid chemical from the vessel, a filter that filters impurities contained in the liquid pumped by the pump, a heater that heats the filtered liquid to a predetermined temperature and supplies the heated liquid back into the tank vessel, and a pump malfunction anticipation unit that operates at the same time as the pump. The pump malfunction anticipation unit calculates the flow rate of the liquid pumped by the pump using a program, and based on the flow rate anticipates when it is time to replace the pump.

Abstract: A semiconductor wafer cleaning apparatus and method uses only one inner bath for chemical solution and de-ionized water cleaning, and includes a marangoni dryer for cleaning and drying semiconductor wafers. The apparatus includes a loading unit loaded with a cassette holding wafers; a moving mechanism for extracting the wafers from the cassette and moving the wafers into a loader; an inner bath for cleaning the wafers with a chemical solution or de-ionized water; a marangoni dryer including a hood, for moving the wafers from the loader into the bath, to be sealed to the bath; and a knife for supporting the wafers loaded into the bath at a lower portion thereof and moving the wafers up and down. Since the marangoni dryer is adhered to the bath during drying, the wafers are not affected by laminar flow or exhaustion and water marks do not occur thereon.

Abstract: Disclosed is a vanity mirror of a sun visor for an automotive vehicle.

Abstract: A semiconductor wafer cleaning apparatus and method uses only one inner bath for chemical solution and de-ionized water cleaning, and includes a marangoni dryer for cleaning and drying semiconductor wafers. The apparatus includes a loading unit loaded with a cassette holding wafers; a moving mechanism for extracting the wafers from the cassette and moving the wafers into a loader; an inner bath for cleaning the wafers with a chemical solution or de-ionized water; a marangoni dryer including a hood, for moving the wafers from the loader into the bath, to be sealed to the bath; and a knife for supporting the wafers loaded into the bath at a lower portion thereof and moving the wafers up and down. Since the marangoni dryer is adhered to the bath during drying, the wafers are not affected by laminar flow or exhaustion and water marks do not occur thereon.

Abstract: There is provided a wet-etching facility for manufacturing semiconductor devices, wherein the etching process is performed for a wafer with its used surface facing downward so that the by-products from the etching process are completely removed from the etching groove of the wafer by gravity, and the impurities on the back side of the wafer are sank down, and are not touched to the used surface of the other wafer thereby producing good quality of wafers.

Abstract: A wafer transfer method of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer method uses a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.

Abstract: A wafer transfer system of semiconductor fabricating equipment is capable of successively arranging a plurality of wafers in a designated order (e.g., an ascending order, a descending order, an odd/even number order or an individual selection order). The wafer transfer system includes a first cassette containing the wafers, and a second cassette for receiving the wafers. A wafer transfer robot having a wafer transfer arm moves the wafers from the first cassette to the second cassette, after the wafer serial numbers have been read and sent to a computer. The computer uses a selected wafer arrangement order to decide where within the second cassette each wafer from the first cassette should be placed and then controls the wafer transfer robot to place each wafer into the desired location. With the wafers arranged in the selected order, it is not necessary to test each wafer after each fabricating process.